METHOD, APPARATUS AND SYSTEM FOR CONFIGURING A PROTOCOL STACK OF AN INTEGRATED CIRCUIT CHIP
    2.
    发明申请
    METHOD, APPARATUS AND SYSTEM FOR CONFIGURING A PROTOCOL STACK OF AN INTEGRATED CIRCUIT CHIP 有权
    用于配置集成电路芯片的协议栈的方法,装置和系统

    公开(公告)号:US20150269108A1

    公开(公告)日:2015-09-24

    申请号:US14658021

    申请日:2015-03-13

    IPC分类号: G06F13/42

    摘要: Techniques and mechanisms for configuring an integrated circuit (IC) chip to implement a protocol stack. In an embodiment, a transaction layer of the IC chip is operable to exchange with a link layer of the IC chip transaction layer packets (TLPs) having a format compatible with one defined in a Peripheral Component Interconnect Express™ (PCIe™) specification. Configuration circuitry of the IC chip provides for configuration of a first protocol stack including the transaction layer, circuitry of the link layer and a first physical layer of the IC chip. The configuration circuitry further provides for an alternative configuration of a second protocol stack including the transaction layer, circuitry of the link layer and a second physical layer of the IC chip. In another embodiment, the first protocol stack supports single-ended signaling to communicate TLP information, whereas the second protocol stack supports differential signaling to communicate TLP information.

    摘要翻译: 用于配置集成电路(IC)芯片以实现协议栈的技术和机制。 在一个实施例中,IC芯片的事务层可操作以与具有与外围组件互连Express(TM TM)规范中定义的格式兼容的格式的IC芯片事务层分组(TLP)的链路层进行交换。 IC芯片的配置电路提供包括交易层,链路层的电路和IC芯片的第一物理层的第一协议栈的配置。 配置电路还提供包括交易层,链路层的电路和IC芯片的第二物理层的第二协议栈的备选配置。 在另一实施例中,第一协议栈支持单端信令来传送TLP信息,而第二协议栈支持差分信令来传送TLP信息。