摘要:
Disclosed are a variety of methods for increasing the relative thickness in the peripheral or edge regions of gate dielectric patterns to suppress leakage through these regions. The methods provide alternatives to conventional GPOX processes and provide the improved leakage resistance without incurring the degree of increased gate electrode resistance associated with GPOX processes. Each of the methods includes forming a first opening to expose an active area region, forming an oxidation control region on the exposed portion and then forming a second opening whereby a peripheral region free of the oxidation control region is exposed for formation of a gate dielectric layer. The resulting gate dielectric layers are characterized by a thinner central region surrounded or bounded by a thicker peripheral region.
摘要:
A semiconductor device may include a gate dielectric film on a semiconductor substrate and/or a gate electrode. The gate electrode may include a first metal film, a first metal silicide film, and/or a conductive polysilicon film sequentially stacked on the gate dielectric film.
摘要:
Provided are semiconductor devices and methods of fabricating the same, and more specifically, semiconductor devices having a W—Ni alloy thin layer that has a low resistance, and methods of fabricating the same. The semiconductor devices include the W—Ni alloy thin layer. The weight of Ni in the W—Ni alloy thin layer may be in a range from approximately 0.01 to approximately 5.0 wt % of the total weight of the W—Ni alloy thin layer.
摘要:
A method of fabricating a semiconductor device can include forming a trench in a semiconductor substrate, forming a first conductive layer on a bottom surface and side surfaces of the trench, and selectively forming a second conductive layer on the first conductive layer to be buried in the trench. The second conductive layer may be formed selectively on the first conductive layer by using an electroless plating method or using a metal organic chemical vapor deposition (MOCVD) or an atomic layer deposition (ALD) method.
摘要:
Provided are semiconductor devices and methods of fabricating the same, and more specifically, semiconductor devices having a W—Ni alloy thin layer that has a low resistance, and methods of fabricating the same. The semiconductor devices include the W—Ni alloy thin layer. The weight of Ni in the W—Ni alloy thin layer may be in a range from approximately 0.01 to approximately 5.0 wt % of the total weight of the W—Ni alloy thin layer.
摘要:
A method of fabricating a semiconductor device can include forming a trench in a semiconductor substrate, forming a first conductive layer on a bottom surface and side surfaces of the trench, and selectively forming a second conductive layer on the first conductive layer to be buried in the trench. The second conductive layer may be formed selectively on the first conductive layer by using an electroless plating method or using a metal organic chemical vapor deposition (MOCVD) or an atomic layer deposition (ALD) method.
摘要:
Embodiments of the invention provide a method for removing hydrogen gas from a chamber and a method for performing a semiconductor device fabrication sub-process and removing hydrogen gas from a chamber. The method for removing hydrogen gas from a chamber comprises removing a substrate from a chamber, wherein residual hydrogen gas is disposed in the chamber, injecting oxygen gas or ozone gas into the chamber, producing plasma in the chamber, and removing OH radicals from the chamber.
摘要:
A method for fabricating a partition of a plasma display panel includes the steps of spraying and coating a powdered partition material onto a substrate on which address electrodes and a dielectric layer are formed, melting the partition material by a laser beam, and solidifying the melted partition material to complete the partition.
摘要:
A plasma display device includes a first substrate, an address electrode formed on an upper surface of the fist substrate, a first dielectric layer formed on the upper surface of the first substrate and embedding the address electrode, a second substrate which is transparent and forms a discharge space by being coupled to the first substrate, a plurality of maintaining electrodes formed on a lower surface of the second substrate to form a predetermined angle with the address electrode, each of the maintaining electrodes including first and second electrodes, a second dielectric layer formed on the second substrate where the maintaining electrodes are formed and embedding the maintaining electrodes, at least a portion where an electrical field is concentrated formed between the first and second electrodes constituting the maintaining electrodes, and a partition installed between the first and second substrates for sectioning the discharge space.
摘要:
A plasma display device includes a first substrate, an address electrode formed on an upper surface of the fist substrate, a first dielectric layer formed on the upper surface of the first substrate and embedding the address electrode, a second substrate which is transparent and forms a discharge space by being coupled to the first substrate, a plurality of maintaining electrodes formed on a lower surface of the second substrate to form a predetermined angle with the address electrode, each of the maintaining electrodes including first and second electrodes, a second dielectric layer formed on the second substrate where the maintaining electrodes are formed and embedding the maintaining electrodes, at least a portion where an electrical field is concentrated formed between the first and second electrodes constituting the maintaining electrodes, and a partition installed between the first and second substrates for sectioning the discharge space.