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公开(公告)号:US20170062203A1
公开(公告)日:2017-03-02
申请号:US15348383
申请日:2016-11-10
发明人: Atsushi RYOKAWA , Shuhei YAMADA , Masahiro FUJITANI , Soichi KUMON , Masanori SAITO , Takashi SAIO , Shinobu ARATA
CPC分类号: H01L21/0206 , B08B3/08 , C09D7/63 , H01L21/02057 , H01L21/3105 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要: [Problem] To provide a method for preparing a protective film-forming liquid chemical, in a method for producing a wafer having at its surface an uneven pattern and containing silicon element at least at a part of the uneven pattern. The liquid chemical forms a water-repellent protective film on the uneven pattern of the wafer and improves a cleaning step which tends to induce a pattern collapse, and particularly provides a good persistence (pot life) of the improving effect.[Solution] A method for preparing a liquid chemical for forming a water-repellent protective film, the liquid chemical being for forming a water-repellent protective film at the time of cleaning the wafer at least on surfaces of recessed portions of the uneven pattern, the liquid chemical containing a nonaqueous organic solvent, a silylation agent, and an acid or base. The method for preparing a liquid chemical for forming a water-repellent protective film is characterized by including: a dehydrating step for adjusting a water content of the nonaqueous organic solvent to 200 mass ppm or less; and a mixing step for mixing the nonaqueous organic solvent, the silylation agent, and the acid or base after the dehydrating step.
摘要翻译: 本文公开了一种制备用于形成防水保护膜的液体化学品的方法,该液体化学品用于在其表面上清洁具有不均匀图案并且含有硅元素的晶片时形成防水保护膜 至少在不均匀图案的凹陷部分的至少在表面上的凹凸图案的一部分,液体化学品含有非水有机溶剂,甲硅烷基化剂和酸或碱。 该方法包括(i)通过脱水将非水有机溶剂的水分调节至200质量ppm以下; 和(ii)在调整步骤之后混合非水有机溶剂,甲硅烷基化剂和酸或碱。
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公开(公告)号:US20180308683A1
公开(公告)日:2018-10-25
申请号:US15753032
申请日:2016-08-10
发明人: Takashi SAIO , Yuzo OKUMURA , Yuki FUKUI , Hiroki FUKAZAWA , Tomohiro TAKATA , Soichi KUMON , Kazuyuki ABE , Shota WATANABE , Masayoshi IMACHI
CPC分类号: H01L21/02057 , B08B3/00 , C11D3/162 , H01L21/304 , H01L21/6704
摘要: To provide a water-repellent protective film-forming liquid chemical used in a process of cleaning a wafer by means of a cleaning machine whose liquid contact member contains a vinyl chloride resin. A liquid chemical is used, which includes an alkoxysilane represented by the following general formula [1]; at least one kind selected from the group consisting of a sulfonic acid represented by the following general formula [2], an anhydride of the sulfonic acid, a salt of the sulfonic acid and a sulfonic acid derivative represented by the following general formula [3]; and a diluent solvent containing at least one kind selected from the group consisting of a hydrocarbon, an ether and a thiol. (R1)aSi(H)b(OR2)4-a-b [1] R3—S(═O)2OH [2] R3—S(═O)2O—Si(H)3-c(R4)c [3]
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公开(公告)号:US20170287705A1
公开(公告)日:2017-10-05
申请号:US15512350
申请日:2015-09-11
发明人: Takashi SAIO , Yuzo OKUMURA , Yuki FUKUI , Soichi KUMON
IPC分类号: H01L21/02 , C07C309/03 , C07F7/08
CPC分类号: H01L21/02087 , C07C309/03 , C07F7/081 , H01L21/02057 , H01L21/0209 , H01L21/31138
摘要: Provided herein is a method for cleaning a wafer having a fine uneven surface pattern that at least partially contains a silicon element using a wafer cleaning device that includes a vinyl chloride resin as a liquid contacting member, the method including retaining a water-repellent protective film-forming chemical in at least a recessed portion of the uneven pattern to form a water-repellent protective film on a surface of the recessed portion, the water-repellent protective film-forming chemical containing: a monoalkoxysilane represented by the following general formula [1], (R1)aSi(H)3-a(OR2) [1]; a sulfonic acid represented by the following general formula [2], R3—S(═O)2OH [2]; and a diluting solvent, wherein the diluting solvent contains 80 to 100 mass % of alcohol with respect to the total 100 mass % of the diluting solvent.
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公开(公告)号:US20140174465A1
公开(公告)日:2014-06-26
申请号:US14136381
申请日:2013-12-20
发明人: Soichi KUMON , Takashi SAIO , Shinobu ARATA , Hidehisa NANAI , Yoshinori AKAMATSU , Shigeo HAMAGUCHI , Kazuhiko MAEDA
IPC分类号: H01L21/02
CPC分类号: H01L21/02052 , B08B3/00 , C09D183/04 , C11D3/162 , C11D7/5022 , H01L21/00 , H01L21/02054
摘要: A cleaning agent for a silicon wafer (a first cleaning agent) contains at least a water-based cleaning liquid and a water-repellent cleaning liquid for providing at least a recessed portion of an uneven pattern with water repellency during a cleaning process. The water-based cleaning liquid is a liquid in which a water-repellent compound having a reactive moiety chemically bondable to Si element in the silicon wafer and a hydrophobic group, and an organic solvent including at least an alcoholic solvent are mixed and contained. With this cleaning agent, the cleaning process which tends to induce a pattern collapse can be improved.
摘要翻译: 一种用于硅晶片(第一清洁剂)的清洁剂至少含有一种水基清洗液和一种防水清洗液,用于在清洁过程中至少提供具有防水性的凹凸图案的凹陷部分。 水性清洗液是将具有与硅晶片中的Si元素和疏水性基团化学结合的反应性部分的防水化合物和至少含有醇溶剂的有机溶剂混合并包含的液体。 利用该清洁剂,可以提高倾向于引起图案塌陷的清洁处理。
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公开(公告)号:US20160148802A1
公开(公告)日:2016-05-26
申请号:US14952354
申请日:2015-11-25
发明人: Soichi KUMON , Takashi SAIO , Shinobu ARATA , Masanori SAITO , Atsushi RYOKAWA , Shuhei YAMADA , Hidehisa NANAI , Yoshinori AKAMATSU
CPC分类号: H01L21/02057 , B08B3/08 , B08B3/10 , C09K3/18 , C11D1/82 , C11D3/162 , C11D11/0047 , H01L21/02082
摘要: Disclosed is a liquid chemical for forming a water-repellent protecting film at least on a surface of a recessed portion of an uneven pattern at the time of cleaning a wafer having a finely uneven pattern at its surface and containing silicon at at least a part of the uneven pattern. This liquid chemical contains a silicon compound A represented by the general formula: R1aSi(H)bX4-a-b and an acid A, the acid A being at least one selected from the group consisting of trimethylsilyl trifluoroactate, trimethylsilyl trifluoromethanesulfonate, dimethylsilyl trifluoroactate, dimethylsilyl trifluoromethanesulfonate, butyldimethylsilyl trifluoroactate, butyldimethylsilyl trifluoromethanesulfonate, hexyldimethylsilyl trifluoroacetate, hexyldimethylsilyl trifluoromethanesulfonate, octyldimethylsilyl trifluoroactate, octyldimethylsilyl trifluoromethanesulfonate, decyldimethylsilyl trifluoroacetate and decyldimethylsilyl trifluoromethanesulfonate.
摘要翻译: 公开了一种液体化学品,用于至少在凹凸图案的凹陷部分的表面上在其表面上清洁具有精细不均匀图案的晶片的表面上形成防水保护膜,并且在至少部分 不均匀的图案。 该液体化学品含有由通式R1aSi(H)bX4-ab表示的硅化合物A和酸A,酸A为选自三甲基甲硅烷基三氟甲酸三甲基甲硅烷基酯,三氟甲磺酸三甲基甲硅烷基酯,三氟甲磺酸二甲基甲硅烷基酯,三氟甲磺酸二甲基甲硅烷基酯 丁基二甲基甲硅烷基三氟甲酸酯,丁基二甲基甲硅烷基三氟甲磺酸酯,己基二甲基甲硅烷基三氟乙酸酯,己基二甲基甲硅烷基三氟甲磺酸酯,辛基二甲基甲硅烷基三氟甲酸酯,辛基二甲基甲硅烷基三氟甲磺酸酯,癸基二甲基甲硅烷基三氟乙酸酯和癸基二甲基甲硅烷基三氟甲磺酸酯。
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公开(公告)号:US20150101643A1
公开(公告)日:2015-04-16
申请号:US14574838
申请日:2014-12-18
CPC分类号: C11D11/0047 , C11D7/30 , C11D7/3209 , C11D11/0064 , C11D11/007 , H01L21/02052
摘要: A silicon wafer cleaning agent includes at least a water-based cleaning liquid, and a water-repellent cleaning liquid for providing water-repellent to an uneven pattern at least at recessed portions during a cleaning process. The water-repellent cleaning liquid is a liquid composed of a water-repellent compound containing a reactive moiety which is chemically bondable to Si in the silicon wafer, and a hydrophobic group, or is a liquid wherein 0.1 mass % or more of the water-repellent compound relative to the total quantity of 100 mass % of the water-repellent cleaning liquid and an organic solvent are mixed and contained therein. A cleaning process wherein a pattern collapse is easily induced can be improved by using the cleaning agent.
摘要翻译: 硅晶片清洗剂至少包括一种水基清洗液,以及一种用于在清洁过程中至少在凹陷处向不均匀图案提供防水性的防水清洗液。 防水清洗液是由含有与硅晶片中的Si化学结合的反应性部分的疏水性组合物和疏水性基团构成的液体,或其中0.1质量%以上的水溶性化合物, 防水化合物相对于防水性清洗液和有机溶剂的总量的100质量%混合并包含在其中。 可以通过使用清洁剂来改善容易诱发图案塌陷的清洁方法。
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公开(公告)号:US20140373870A1
公开(公告)日:2014-12-25
申请号:US14478466
申请日:2014-09-05
发明人: Takashi SAIO , Soichi KUMON , Masanori SAITO , Shinobu ARATA , Hidehisa NANAI , Yoshinori AKAMATSU
IPC分类号: H01L21/02
CPC分类号: H01L21/02068 , C11D11/0047
摘要: Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1].
摘要翻译: 公开了一种用于形成防水保护膜的液体化学品。 液体化学品含有形成防水保护膜的试剂和溶剂。 该试剂用于在晶片的清洁步骤之后并且在用于晶片的干燥步骤之前在晶片上形成防水保护膜,所述晶片在其表面处具有不均匀图案并且包含至少一种钛元素 ,钨,铝,铜,锡,钽和钌在凹凸图案的凹部的表面处,至少在凹部的表面上形成防水保护膜。 液体化学品的特征在于用于形成防水保护膜的试剂是由以下通式[1]表示的化合物。
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公开(公告)号:US20140339321A1
公开(公告)日:2014-11-20
申请号:US14280964
申请日:2014-05-19
发明人: Atsushi RYOKAWA , Shuhei YAMADA , Masahiro FUJITANI , Yosuke HASHIMOTO , Chiaki IDETA , Soichi KUMON , Masanori SAITO , Takashi SAIO
CPC分类号: B65B31/00 , H01L21/67017
摘要: The present invention provides a pressure feed container capable of ensuring the cleanliness of a liquid such as a protective film-forming liquid chemical or a protective film-forming liquid chemical kit for preparing the liquid chemical even after long-term storage, and also capable of suppressing electrostatic charge in the liquid. The present invention provides a pressure feed container configured to store a protective film-forming liquid chemical or a protective film-forming liquid chemical kit that is mixed into the protective film-forming liquid chemical, and to transfer a liquid upon application of pressure to the inside of the container, the protective film-forming liquid chemical being for forming a water-repellent protective film on at least surfaces of recessed portions of an uneven pattern formed on a surface of a wafer containing a silicon element at least at a part of the uneven pattern. The protective film-forming liquid chemical contains a nonaqueous organic solvent, a silylation agent, and an acid or a base; the protective film-forming liquid chemical kit includes a treatment liquid A containing a nonaqueous organic solvent and a silylation agent, and a treatment liquid B containing a nonaqueous organic solvent and an acid or a base; the pressure feed container includes a container body configured to contain a liquid selected from the protective film-forming liquid chemical, the treatment liquid A, and the treatment liquid B, and a liquid flowing nozzle configured such that the liquid flows therethrough to be introduced into the container body and/or to be extracted from the container body; the container body includes a metal can body in which a portion configured to contact the liquid is formed from a resin material; the liquid flowing nozzle is provided with a neutralization mechanism configured to reduce electrostatic potential in the liquid; and a liquid contact portion of the liquid flowing nozzle excluding the neutralization mechanism is formed from a resin material.
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公开(公告)号:US20190074173A1
公开(公告)日:2019-03-07
申请号:US16084697
申请日:2017-03-07
发明人: Yuki FUKUI , Takashi SAIO , Atsushi RYOKAWA , Satoru NARIZUKA , Saori SHIOTA , Shota WATANABE , Shintaro SASAKI , Susumu IWASAKI
摘要: Disclosed are a water-repellent protective film forming agent for forming a water-repellent protective film on a silicon element-containing surface of a wafer and a water-repellent protective film forming liquid chemical in which the water-repellent protective film forming agent is dissolved in an organic solvent, characterized in that the water-repellent protective film forming agent consists of at least one kind of silicon compound selected from the group consisting of a sulfonimide derivative represented by the following general formula [1], a sulfonimide derivative represented by the following general formula [2] and a sulfonmethide derivative represented by the following general formula [3].
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公开(公告)号:US20170004963A1
公开(公告)日:2017-01-05
申请号:US15264776
申请日:2016-09-14
发明人: Masanori SAITO , Shinobu ARATA , Takashi SAIO , Soichi KUMON , Hidehisa NANAI , Yoshinori AKAMATSU
IPC分类号: H01L21/02 , H01L21/311
CPC分类号: H01L21/02068 , C11D1/002 , C11D1/004 , C11D1/04 , C11D1/40 , C11D11/0047 , H01L21/02057 , H01L21/0212 , H01L21/027 , H01L21/306 , H01L21/31127
摘要: Disclosed is a liquid chemical for forming a water-repellent protecting film on a wafer. The liquid chemical is a liquid chemical containing a water-repellent-protecting-film-forming agent for forming the water-repellent protecting film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The liquid chemical is characterized in that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant. The water-repellent protecting film formed with the liquid chemical is capable of preventing a pattern collapse of the wafer, in a cleaning step.
摘要翻译: 公开了一种用于在晶片上形成防水保护膜的液体化学品。 液体化学品是含有防水保护膜形成剂的液体化学品,用于形成防水保护膜,在清洁其表面上具有精细不均匀图案的晶片时,至少含有 至少一种选自钛,氮化钛,钨,铝,铜,锡,氮化钽,钌和硅的至少一种物质的不平坦图案的凹陷部分的表面的一部分,至少在 凹部。 液体化学品的特征在于防水保护膜形成剂是水不溶性表面活性剂。 在清洁步骤中,用液体化学品形成的防水保护膜能够防止晶片的图案塌陷。
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