公开(公告)号：US20130252418A1

公开(公告)日：2013-09-26

申请号：US13874509

申请日：2013-05-01

申请人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE J. MCCARTHY ,  ERIC D. PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA W. SEMKOW ,  THOMAS A. WASSICK

发明人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE J. MCCARTHY ,  ERIC D. PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA W. SEMKOW ,  THOMAS A. WASSICK

IPC分类号： H01L21/768

CPC分类号： H01L21/7685 ,  H01L21/321 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13017 ,  H01L2224/13027 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/181 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

摘要翻译： 本发明的实施例包括无铅焊料互连结构和用于制造无铅互连结构的方法。 该结构包括具有最后金属层的半导体衬底，附着于最后金属层的铜基座，附着于铜基座的阻挡层，与阻挡层连接的阻挡保护层，以及与该阻挡层相接触的无铅焊料层 铜底座的最小一侧。

公开(公告)号：US20130249066A1

公开(公告)日：2013-09-26

申请号：US13427940

申请日：2012-03-23

申请人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE JOHANNA MCCARTHY ,  ERIC DANIEL PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA WALERIA SEMKOW ,  THOMAS ANTHONY WASSICK

发明人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE JOHANNA MCCARTHY ,  ERIC DANIEL PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA WALERIA SEMKOW ,  THOMAS ANTHONY WASSICK

IPC分类号： H01L23/495 ,  H01L21/28

CPC分类号： H01L21/7685 ,  H01L21/321 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13017 ,  H01L2224/13027 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/181 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.