公开(公告)号：US20130249066A1

公开(公告)日：2013-09-26

申请号：US13427940

申请日：2012-03-23

申请人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE JOHANNA MCCARTHY ,  ERIC DANIEL PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA WALERIA SEMKOW ,  THOMAS ANTHONY WASSICK

发明人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE JOHANNA MCCARTHY ,  ERIC DANIEL PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA WALERIA SEMKOW ,  THOMAS ANTHONY WASSICK

IPC分类号： H01L23/495 ,  H01L21/28

CPC分类号： H01L21/7685 ,  H01L21/321 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13017 ,  H01L2224/13027 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/181 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

公开(公告)号：US20070187433A1

公开(公告)日：2007-08-16

申请号：US11670158

申请日：2007-02-01

申请人： Tyson Webster ,  M. Deeds ,  James Livingston ,  Andy Swain ,  David Holden ,  Kenneth Bird

发明人： Tyson Webster ,  M. Deeds ,  James Livingston ,  Andy Swain ,  David Holden ,  Kenneth Bird

IPC分类号： G01F11/10

CPC分类号： B65D47/04 ,  B65D83/06 ,  G01F11/46

摘要： A metering and dispensing closure for a container wherein two rotatable disks rotate in conjunction with a stationary cap member to afford accurate measuring of a powder material and dispensing of it. The disks and the container cap afford a consistent measuring of the powder material, as well as provide a variety of drive members which can be utilized with the dispensing closure.

摘要翻译： 用于容器的计量和分配封闭件，其中两个可旋转盘与固定盖构件一起旋转以提供粉末材料的精确测量和分配。 盘和容器盖提供粉末材料的一致的测量，以及提供可以与分配闭合件一起使用的各种驱动构件。

公开(公告)号：US20060263912A1

公开(公告)日：2006-11-23

申请号：US11133427

申请日：2005-05-19

申请人： Ronald Arroyo ,  Kenneth Bird ,  William Ciarfella ,  Bret Elison ,  Gary Goth ,  Terrance Kueper ,  Thoi Nguyen ,  Roger Weekly

发明人： Ronald Arroyo ,  Kenneth Bird ,  William Ciarfella ,  Bret Elison ,  Gary Goth ,  Terrance Kueper ,  Thoi Nguyen ,  Roger Weekly

IPC分类号： H01L21/66 ,  G01N25/68 ,  G01N25/00 ,  G01K15/00

CPC分类号： G01K7/425 ,  H01L23/34 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.

摘要翻译： 考虑到基于被测设备（DUT）根据电气性能标准进行操作的能力来评估热解决方案的热性能的系统和布置。 实施例可以包括与DUT耦合以确定操作结温度的测试器。 在一些实施例中，测量的结温度可以是客户安装中DUT的预期的工作结温。 在其他实施例中，测试器可以包括基于测量的结温度和测试仪与客户安装之间的已知差异来计算投影的工作结温度的逻辑。 在客户安装中确定DUT的工作结温后，将工作结温与最大结温进行比较，以便DUT的正常工作。 有利的是，最大结温度可以基于DUT线的项目目标而变化。

公开(公告)号：US20130252418A1

公开(公告)日：2013-09-26

申请号：US13874509

申请日：2013-05-01

申请人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE J. MCCARTHY ,  ERIC D. PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA W. SEMKOW ,  THOMAS A. WASSICK

发明人： CHARLES L. ARVIN ,  KENNETH BIRD ,  CHARLES C. GOLDSMITH ,  SUNG K. KANG ,  MINHUA LU ,  CLARE J. MCCARTHY ,  ERIC D. PERFECTO ,  SRINIVASA S.N. REDDY ,  KRYSTYNA W. SEMKOW ,  THOMAS A. WASSICK

IPC分类号： H01L21/768

CPC分类号： H01L21/7685 ,  H01L21/321 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/742 ,  H01L24/81 ,  H01L2224/0382 ,  H01L2224/0401 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/13017 ,  H01L2224/13027 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13562 ,  H01L2224/13566 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/181 ,  H01L2924/01028 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.

摘要翻译： 本发明的实施例包括无铅焊料互连结构和用于制造无铅互连结构的方法。 该结构包括具有最后金属层的半导体衬底，附着于最后金属层的铜基座，附着于铜基座的阻挡层，与阻挡层连接的阻挡保护层，以及与该阻挡层相接触的无铅焊料层 铜底座的最小一侧。

公开(公告)号：US20070194056A1

公开(公告)日：2007-08-23

申请号：US11670128

申请日：2007-02-01

申请人： Tyson Webster ,  M. Deeds ,  James Livingston ,  Andy Swain ,  Christopher Webb ,  Shirley Webb ,  David Holden ,  Kenneth Bird

发明人： Tyson Webster ,  M. Deeds ,  James Livingston ,  Andy Swain ,  Christopher Webb ,  Shirley Webb ,  David Holden ,  Kenneth Bird

IPC分类号： G01F11/10 ,  B65D88/54

CPC分类号： G01F11/46

摘要： A metering and dispensing closure for a container wherein two rotatable disks rotate in conjunction with a stationary cap member to afford accurate measuring of a powder material and dispensing of it. The disks and the container cap afford a consistent measuring of the powder material, as well as provide a variety of drive members which can be utilized with the dispensing closure.

公开(公告)号：US20090318539A1

公开(公告)日：2009-12-24

申请号：US12278855

申请日：2007-02-08

申请人： John Robertson ,  Kenneth Bird Smith

发明人： John Robertson ,  Kenneth Bird Smith

IPC分类号： A61K31/713 ,  C12N15/85

CPC分类号： A61K48/00 ,  A61K9/146 ,  A61K9/1647 ,  A61K9/1682

摘要： A process for preparing a particle comprising a biological molecule typically a DNA plasmid, and a carrier polymer, typically poly-lactic acid (PLA), in which an organic solvent solution of the biological molecule and the carrier polymer in an organic solvent medium, nearly saturated with the biological molecule, is prepared, then this solution is contacted with an antisolvent substance, typically supercritical carbon dioxide to separate a particle comprising the biological molecule and the carrier polymer. High loadings of the biological molecule in the particle can be achieved.

摘要翻译： 制备包含通常为DNA质粒的生物分子的颗粒和通常为聚乳酸（PLA）的载体聚合物的方法，其中生物分子和载体聚合物的有机溶剂溶液在有机溶剂介质中几乎 与生物分子饱和，然后将该溶液与抗溶剂物质（通常为超临界二氧化碳）接触以分离包含生物分子和载体聚合物的颗粒。 可以实现颗粒中生物分子的高负荷。