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    Structures & Methods for Combining Carbon Nanotube Array and Organic Materials as a Variable Gap Interposer for Removing Heat from Solid-State Devices
    7.
    发明申请
    Structures & Methods for Combining Carbon Nanotube Array and Organic Materials as a Variable Gap Interposer for Removing Heat from Solid-State Devices 审中-公开
    将碳纳米管阵列和有机材料作为可变间隙插入件组合的结构和方法，用于从固态器件中去除热量

    公开(公告)号：US20090302295A1

    公开(公告)日：2009-12-10

    申请号：US12365377

    申请日：2009-02-04

    申请人： Peter Schwartz ,  Carlos Dangelo

    发明人： Peter Schwartz ,  Carlos Dangelo

    IPC分类号： H01L45/00 ,  H01L21/20

    CPC分类号： H01L23/373 ,  B82Y10/00 ,  H01L23/3735 ,  H01L23/4275 ,  H01L23/433 ,  H01L24/13 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511

    摘要： One embodiment involves an article of manufacture that includes: a copper substrate plate with a front surface and a back surface; a blocking (barrier) layer on top of a single surface of the copper substrate; and a thermal interface material (TIM) on top of the single surface of the copper substrate. The thermal interface material comprises: a layer of carbon nanotubes that contains catalyst nanoparticles and, a filler material between and in contact with the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate and strongly attached to a blocking (barrier) layer. The TIM made of CNT array plus the elastic filler material is interposed between copper plate and the hot surface of a solid-state device. The TIM composite material adjusts to variable gap thickness to make optimal thermal contact area between opposing surfaces. The sandwich structure may include a non-uniform, variable gap TIM that can change during thermal cycles of operation. In some embodiments, the copper substrate plate is configured to be incorporated in a peripheral structure of a heat spreader. In some embodiments, the thermal interface material is on top of both the top and bottom surfaces of the copper substrate plug.

    摘要翻译： 一个实施例涉及一种制品，其包括：具有前表面和后表面的铜基板; 在铜基板的单个表面的顶部上的阻挡（阻挡）层; 以及在铜基板的单个表面顶部的热界面材料（TIM）。 热界面材料包括：含有催化剂纳米颗粒的碳纳米管层和在碳纳米管之间并与其接触的填充材料。 碳纳米管的取向基本上垂直于铜基底的单个表面并且牢固地附着到阻挡（阻挡）层。 由CNT阵列加上弹性填充材料制成的TIM夹在铜板和固态器件的热表面之间。 TIM复合材料调整到可变间隙厚度，以使相对表面之间的最佳热接触面积。 夹层结构可以包括在操作的热循环期间可以改变的不均匀的可变间隙TIM。 在一些实施例中，铜基板被构造成结合在散热器的外围结构中。 在一些实施例中，热界面材料位于铜基底塞的顶表面和底表面之上。