Liquid chemical for forming protecting film

    公开(公告)号:US10236175B2

    公开(公告)日:2019-03-19

    申请号:US15264776

    申请日:2016-09-14

    摘要: Disclosed is a liquid chemical for forming a water-repellent protecting film on a wafer. The liquid chemical is a liquid chemical containing a water-repellent-protecting-film-forming agent for forming the water-repellent protecting film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The liquid chemical is characterized in that the water-repellent-protecting-film-forming agent is a water-insoluble surfactant. The water-repellent protecting film formed with the liquid chemical is capable of preventing a pattern collapse of the wafer, in a cleaning step.

    Liquid chemical for forming protecting film
    2.
    发明授权
    Liquid chemical for forming protecting film 有权
    用于形成保护膜的液体化学品

    公开(公告)号:US09496131B2

    公开(公告)日:2016-11-15

    申请号:US14478466

    申请日:2014-09-05

    IPC分类号: H01L21/02 C11D11/00

    CPC分类号: H01L21/02068 C11D11/0047

    摘要: Disclosed is a liquid chemical for forming a water-repellent protecting film. The liquid chemical contains an agent for forming a water-repellent protecting film, and a solvent. The agent is for provided to form a water-repellent protecting film on a wafer after a cleaning step for the wafer and before a drying step for the wafer, the wafer having at its surface an uneven pattern and containing at least one kind element of titanium, tungsten, aluminum, copper, tin, tantalum and ruthenium at surfaces of recessed portions of the uneven pattern, the water-repellent protecting film being formed at least on the surfaces of the recessed portions. The liquid chemical is characterized in that the agent for forming a water-repellent protecting film is a compound represented by the following general formula [1].

    Water-Repellent Protective Film, and Chemical Solution for Forming Protective Film
    3.
    发明申请
    Water-Repellent Protective Film, and Chemical Solution for Forming Protective Film 审中-公开
    防水保护膜和防腐膜的化学溶液

    公开(公告)号:US20150179433A1

    公开(公告)日:2015-06-25

    申请号:US14415507

    申请日:2013-07-04

    IPC分类号: H01L21/02 C09K3/18

    摘要: A surface treatment was conducted by using a liquid chemical containing a water-repellent protective film forming agent represented by the following general formula [1], subsequent to a step of cleaning a metal-based wafer and prior to a step of drying the wafer. (R1 represents a C1-C18 monovalent hydrocarbon group the hydrogen elements of which may partially or entirely be replaced with a fluorine element(s). R2 mutually independently represents a monovalent organic group having a C1-C18 hydrocarbon group the hydrogen elements of which may partially or entirely be replaced with a fluorine element(s). “a” is an integer of from 0 to 2.)

    摘要翻译: 在清洗金属基晶片的步骤之前和干燥晶片之前,使用含有由以下通式[1]表示的防水保护膜形成剂的液体化学品进行表面处理。 (R 1表示可以部分或全部被氟元素代替的氢原子的C1〜C18单价烃基,R2相互独立地表示具有C1-C18烃基的一价有机基团,其氢元素可以 部分或全部被氟元素代替,“a”为0至2的整数。)

    Method for Preparing Liquid Chemical for Forming Water Repellent Protective Film
    4.
    发明申请
    Method for Preparing Liquid Chemical for Forming Water Repellent Protective Film 审中-公开
    液体化学制备防水防水膜的方法

    公开(公告)号:US20140311379A1

    公开(公告)日:2014-10-23

    申请号:US14361240

    申请日:2012-11-19

    IPC分类号: H01L21/02

    摘要: A method for preparing a liquid chemical for forming a water-repellant protective film, the liquid chemical having a solvent and an agent for forming a water-repellant protective film, the liquid chemical being for forming a water-repellent protective film at least on surfaces of recessed portions of an uneven pattern of a wafer having the uneven pattern at its surface, the method including: a first refinement step for eliminating the elements (metal impurities) Na, Mg, K, Ca, Mn, Fe, Cu, Li, Al, Cr, Ni, Zn and Ag in a solvent by distilling the solvent or by a particle-eliminating membrane and an ion exchange resin membrane; a mixing step for mixing the solvent after the first refinement step and an agent for forming a water-repellant protective film; and a second refinement step for eliminating particles in a liquid chemical after the mixing step by a particle-eliminating membrane.

    摘要翻译: 一种制备用于形成防水保护膜的液体化学品的方法,具有溶剂的液体化学品和用于形成防水保护膜的试剂,所述液体化学品至少在表面上形成防水保护膜 该方法包括:第一精炼步骤,用于除去Na,Mg,K,Ca,Mn,Fe,Cu,Li等元素(金属杂质)的元素(金属杂质) Al,Cr,Ni,Zn和Ag在溶剂中通过蒸馏溶剂或通过除颗粒膜和离子交换树脂膜; 混合步骤,用于在第一精制步骤之后混合溶剂和形成防水保护膜的试剂; 以及第二细化步骤,用于通过除去颗粒的膜在混合步骤之后消除液体化学品中的颗粒。

    Water Repellent Protective Film Forming Agent, Liquid Chemical for Forming Water Repellent Protective Film, and Wafer Cleaning Method Using Liquid Chemical
    5.
    发明申请
    Water Repellent Protective Film Forming Agent, Liquid Chemical for Forming Water Repellent Protective Film, and Wafer Cleaning Method Using Liquid Chemical 审中-公开
    防水保护膜成型剂,防水防水膜的液体化学品和使用液体化学品的晶片清洗方法

    公开(公告)号:US20130146100A1

    公开(公告)日:2013-06-13

    申请号:US13667236

    申请日:2012-11-02

    IPC分类号: B08B3/04 C07F7/12

    摘要: A water repellent protective film forming agent is provided for forming a protective film on a wafer that has an uneven pattern at its surface. The protective film is formed at least on surfaces of recessed portions of the wafer at the time of cleaning the wafer. The wafer is a wafer that contains a material including silicon element at least at the surfaces of the recessed portions of the uneven pattern or a wafer that contains at least one kind of material selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride and ruthenium at least at a part of the surfaces of the recessed portions of the uneven pattern. The water repellent protective film forming agent is provided to contain a silicon compound represented by the following general formula [1]: R1aSiX4-a  [1]

    摘要翻译: 提供防水保护膜形成剂,用于在其表面具有不均匀图案的晶片上形成保护膜。 在清洁晶片时,至少在晶片的凹部的表面上形成保护膜。 晶片是至少在不均匀图案的凹部的表面上含有包含硅元素的材料的晶片,或包含选自钛,氮化钛,钨,铝中的至少一种材料的晶片 ,铜,锡,氮化钽和钌,至少在凹凸图案的凹部的一部分表面。 提供防水保护膜形成剂以包含由以下通式[1]表示的硅化合物:R1aSiX4-a [1]