摘要:
A noise reduced photon detector incorporates an array (10) of semiconductor diode detector elements (12). Each element (12) has an extrinsic active layer (20) sandwiched between two layers (18, 22) of wider bandgap and mutually opposite conductivity type. These layers are in turn sandwiched between two further layers (16, 24) of wider bandgap than the active layer (20) and of higher doping than the other layers (18, 22). A mirror (34) extends round much the array (10) and isolates each element (12) from photons emitted by other elements (12). In operation the elements (12) are reverse biased and exhibit negative luminescence which reduces their photon emission. These two effects reduce unwanted photon generation and absorption, and consequently photon noise is also reduced.
摘要:
A semiconductor device in the form of a metal insulator field effect transistor (MISFET) (200) is constructed as a heterostructure of narrow bandgap In.sub.1-x Al.sub.x Sb semiconductor materials. The MISFET (200) is formed from four semiconducting layers (112 to 118) arranged in series as follows: a heavily doped p-type first layer (112), a heavily doped relatively wider bandgap p-type second layer (114), a lightly doped p-type third layer (116) and a heavily doped n-type fourth layer (118). A source (202) and a drain (204) are formed in the fourth layer (118) and a gate (116/205) in the third layer. An n.sup.+ p.sup.- junction (124) is formed between the third and fourth layers and a p.sup.+ p.sup.- junction (122) between the second and third layers. The second layer (114) provides a conduction band potential energy barrier to minority carrier (electron) flow to the gate (116/205), and is sufficiently wide to prevent tunnelling of minority carriers therebetween. The first and second layers (112, 114) in combination provide a p.sup.+ p.sup.+ excluding contact to the third layer (116). The n.sup.+ p.sup.- junction (124) between the third and fourth layers (116, 118) is an extracting contact; when reverse biased in operation, this junction (124) extracts minority carriers from the region of the third layer (116) adjacent the collector (118/204). In operation, the third layer (116) incorporating the gate (205) becomes depleted of charge carriers and therefore exhibits greatly reduced leakage current. In consequence, the MISFET (200) has good dynamic range in terms of controllable drain current. The invention also provides bipolar transistors (300, 400 ) and related devices.
摘要:
A detector, of photosensitive semiconductor material with input and output bias contacts. To improve both frequency response and spatial resolution, minority carriers having tendency to accumulate in the vicinity of the output bias contact are instead rapidly swept out, being driven towards this contact by a concentrated electric field. To produce a local field concentration, the output bias contact may be extended towards the input bias contact, or the detector material near this contact may be configured by slotting or tapering.
摘要:
A thermal imaging system including a biassed elongate detector element of photoconductive material, over which an image of a thermal scene is scanned at a velocity that is matched to the drift velocity of photocarriers generated in the element. In order to improve responsivity and detectivity the length of the detector element or the magnitudes of bias and scan velocity are selected so that the time taken to scan the detector element from one end to a read-out region of the detector element is greater than the lifetime of the photocarriers generated in the element. In order to avoid loss of resolution by photocarrier diffusion the photocarrier lifetime of the detector material is of relatively low value. The system may include one detector element only, or it may include several detector elements arranged in parallel. Furthermore, one or more additional read-out regions, each formed by a pair of conductors, may be included in the detector element between the bias contact at one end of the element and the read-out region already mentioned.
摘要:
An infra-red detector (10) comprises a detector region (38) and a collector region separated by a barrier region. Operation of these regions is controlled by potentials applied to respective gate electrodes (30, 34, 32), insulated from the detector, barrier and collector regions by an insulating oxide layer (36). The detector, barrier, and collector regions may be arranged on a silicon substrate (24). In operation, photo-excited electrons are generated in the detector region and these cross the barrier region for readout from the collector region.
摘要:
A thermal imaging system (10) which is accoupled and by scanning recreates a thermal image by superimposing measured variations in infrared emission from a scene (22) onto a reference level supplied by a light emitting diode (28). The diode (28) is both a positive and negative luminescent emitter. Emitted flux is current controlled to be equivalent to black body radiation at a range of temperatures which may be colder or hotter than ambient. A signal generated with the system (10) switches between scene and diode observation is a measure of the difference between the mean scene temperature and the diode effective temperature. In response to this digital, control means adjust the bias current through the diode (28) in order to reduce the temperature difference. The reference temperature converges towards the mean scene temperature as this process is repeated. Absolute temperature is thus restored and some image defects removed.
摘要:
An infra red photo detector system comprises a piece of detector material, such as Cd.sub.x Hg.sub.1-x Te, InSb, InAs, etc, carrying at least a pair of spaced electrodes. An optical arrangement directs a small spot of radiation onto the detector. The position of the small spot on the much larger detector is found by applying an electrical bias between the electrodes causing a drift of photo carriers. The bias may be of alternating polarity and the detector output measured at each polarity. Alternatively a high frequency bias may be applied and the A.C. offset from the detector used to indicate spot position. Alternatively the spot position may be modulated or swept along the detector by a mirror moving in a sawtooth scanning action.
摘要:
A thermal imaging device having both serial and parallel content is provided by a number of infra-red radiation detector strips supported side by side on an insulating substrate, each strip having a number of read-out regions. To allow connection from the side of the device to the innermost detector strips, conductors err end across outer strips. These conductors may extend over the strips and over insulating material therebetween. Alternatively the conductors may be in the form of conductive tracks embodied in a substrate of semiconductor material. The strips may be indented at the read-out regions to provide, with very close spacing, sufficient room for contact between the read-out regions and the conductive tracks. Preformed aluminium contact pads may be used between bridging links to the read-out regions and the conductive tracks the contact pads and preformed tracks being centered during preformation to ensure a good ohmic contact.
摘要:
An infrared detector comprises a thin film of photo-responsive material on transparent dielectric material with an array of planar antennae adjacent to the film surface. The antennae are separate from ohmic contacts arranged to connect the film to an external circuit. The antennae concentrate radiation in fringe fields at antenna edges and extremities interacting with the photo-responsive material. The detectors may be photovoltaic or photoconductive. The antennae may be rectangular, bow-tie, cruciform, elliptic, circular or square, and are dimensioned for resonance (preferably half-wavelength resonance) at frequencies within the photo-responsive material absorption band. Half-wavelength resonant antennae are best matched by F/0.7 optics. The detector may be a reticulated array. The dielectric material may be formed as a lens.
摘要:
A photodetector (10) of the non-equilibrium kind incorporates three successively disposed sections (14, 16, 18) of like layer construction. Each of the sections (e.g. 14) contains three layers (14A, 14B, 14C) of semiconductor materials of the Cd.sub.x Hg.sub.1-x Te alloy system (CMT). The central layer (14B) of each section (14) is of narrow bandgap CMT, i.e. x=0.19 or 0.265 for absorption at 3-5 .mu.m or 8-12 .mu.m, and has very low doping (10.sup.15 cm.sup.-3) providing intrinsic conductivity. It is 1.5 .mu.m thick, less than one third of an optical absorption length. The outer layers of each section (14A, 14B) are 10 .mu.m thick and are of wide bandgap CMT, i.e. x=0.4. They have respective n and p type dopant concentrations of 3.times.10.sup.16 cm.sup.-3 providing extrinsic conductivity. Each central layer (14B) is therefore bounded by an excluding contact (14AB) and an extracting contact (14BC), which depress its carrier concentration to an extrinsic level under the action of electrical bias. This simulates cooling to low temperature. The central layers (14B to 18B) have a collective thickness (4.5 .mu.m) approaching an optical absorption length (6 .mu.m). A mirror (20) is arranged to return through the photodetector (10) radiation transmitted by it. This presents a total active region thickness six times that of an individual central region (14B) and greater than an optical absorption length. The photodetector (10) consequently has high quantum efficiency despite the deficiencies of n-type CMT material in this regard.