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公开(公告)号：US08450616B2
公开(公告)日：2013-05-28
申请号：US12752376
申请日：2010-04-01
申请人： Chen-Chuan Chang
发明人： Chen-Chuan Chang
CPC分类号： H05K3/007 , H05K1/183 , H05K3/0035 , H05K3/06 , H05K3/062 , H05K3/108 , H05K3/428 , H05K3/4697 , H05K2201/09036 , H05K2201/09127 , H05K2201/09781 , H05K2203/0554 , Y10T29/49155 , Y10T29/49156
摘要： A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area.
摘要翻译： 提供具有去除区域的电路板。 所述电路板包括第一介电层，设置在所述第一介电层上并位于所述去除区的外围的第一耐光结构，设置在所述第一介电层上的第二介电层，设置在所述第二介电层上的电路层 设置在所述第二电介质层上并位于所述去除区域周边的第二激光阻挡结构，以及设置在所述第二电介质层上的第三电介质层。 第二个耐光结构与电路层绝缘。 在第二激光电阻结构和电路层之间存在间隙，并且第一表面上的间隙的垂直投影与第一激光结构重叠。 第三电介质层暴露出去除区域内的电路层的部分。
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公开(公告)号：US08519270B2
公开(公告)日：2013-08-27
申请号：US12782900
申请日：2010-05-19
申请人： Chen-Chuan Chang
发明人： Chen-Chuan Chang
IPC分类号： H05K1/00
CPC分类号： B32B38/10 , H05K3/4623 , H05K3/4652 , H05K3/4697 , H05K2201/0355 , H05K2201/09127 , H05K2203/107 , Y10T156/1052
摘要： A circuit board having a cavity is provided. The circuit board includes a first core layer, a second core layer, and a central dielectric layer. The first core layer includes a core dielectric layer and a core circuit layer, wherein the core circuit layer is disposed on the core dielectric layer. The second core layer is disposed on the first core layer. The central dielectric layer is disposed between the first core layer and the second core layer. The cavity runs through the second core layer and the central dielectric layer and exposes a portion of the core circuit layer.
摘要翻译： 提供具有空腔的电路板。 电路板包括第一芯层，第二芯层和中心电介质层。 第一芯层包括芯介质层和芯电路层，其中芯电路层设置在芯介质层上。 第二芯层设置在第一芯层上。 中心电介质层设置在第一芯层和第二芯层之间。 空腔穿过第二芯层和中心电介质层并暴露核心电路层的一部分。
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公开(公告)号：US08296944B2
公开(公告)日：2012-10-30
申请号：US12787426
申请日：2010-05-26
申请人： Hung-Lin Chang , Chen-Chuan Chang
发明人： Hung-Lin Chang , Chen-Chuan Chang
IPC分类号： H01K3/10
CPC分类号： H05K3/0035 , H05K3/244 , H05K3/427 , H05K3/4652 , H05K3/4697 , H05K2201/0317 , H05K2203/0361 , H05K2203/072 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a printed circuit board includes the steps of: providing a base board having a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.
摘要翻译： 一种制造印刷电路板的方法包括以下步骤：提供具有第一表面层的基板; 对所述基板执行第一图案化处理以在所述第一表面层上形成底部电路; 在底部电路上形成金属保护层; 对金属保护层进行第二图案化处理以形成图案化的金属保护层; 对基板进行积聚处理以在底部电路和图案化的金属保护层上形成第一组合层; 对所述第一累积层执行第三图案化处理以形成第一累积层电路; 对所述第一组合层执行激光制造工艺以形成空腔结构; 并清除图案化的金属保护层。
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公开(公告)号：US20100252303A1
公开(公告)日：2010-10-07
申请号：US12752376
申请日：2010-04-01
申请人： Chen-Chuan Chang
发明人： Chen-Chuan Chang
CPC分类号： H05K3/007 , H05K1/183 , H05K3/0035 , H05K3/06 , H05K3/062 , H05K3/108 , H05K3/428 , H05K3/4697 , H05K2201/09036 , H05K2201/09127 , H05K2201/09781 , H05K2203/0554 , Y10T29/49155 , Y10T29/49156
摘要： A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area.
摘要翻译： 提供具有去除区域的电路板。 所述电路板包括第一介电层，设置在所述第一介电层上并位于所述去除区的外围的第一耐光结构，设置在所述第一介电层上的第二介电层，设置在所述第二介电层上的电路层 设置在所述第二电介质层上并位于所述去除区域周边的第二激光阻挡结构，以及设置在所述第二电介质层上的第三电介质层。 第二个耐光结构与电路层绝缘。 在第二激光电阻结构和电路层之间存在间隙，并且第一表面上的间隙的垂直投影与第一激光结构重叠。 第三电介质层暴露出去除区域内的电路层的部分。
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公开(公告)号：US20120255165A1
公开(公告)日：2012-10-11
申请号：US13352553
申请日：2012-01-18
申请人： Chen-Chuan Chang
发明人： Chen-Chuan Chang
IPC分类号： H05K3/00
CPC分类号： H05K1/0204 , H01L33/642 , H01L33/644 , H05K3/022 , H05K3/4046 , H05K2201/066 , H05K2201/10106 , H05K2201/10416 , H05K2203/0323 , H05K2203/061 , H05K2203/063 , Y10T29/49124 , Y10T29/49126
摘要： A method for fabricating a heat dissipation substrate is disclosed. The method includes the steps of: providing a substrate, wherein the substrate includes a metal layer, an insulation layer, and a first conductive layer, of which the insulation layer is positioned between the metal layer and the first conductive layer, and the metal layer is thicker than the first conductive layer; removing the partial metal layer for forming a metal bulk; providing an adhesive layer, wherein the adhesive layer includes an opening, and the opening is corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, wherein the hole is positioned under the metal bulk; forming a third conductive layer in the hole.
摘要翻译： 公开了一种制造散热基板的方法。 该方法包括以下步骤：提供衬底，其中衬底包括金属层，绝缘层和第一导电层，绝缘层位于金属层和第一导电层之间，金属层 比第一导电层厚; 去除用于形成金属体的部分金属层; 提供粘合剂层，其中所述粘合剂层包括开口，并且所述开口对应于所述金属体; 提供第二导电层; 层叠第二导电层，粘合剂层和基板; 在所述绝缘层和所述第一导电层中形成孔，其中所述孔位于所述金属体下方; 在孔中形成第三导电层。
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公开(公告)号：US20100299917A1
公开(公告)日：2010-12-02
申请号：US12787426
申请日：2010-05-26
申请人： Hung-Lin Chang , Chen-Chuan Chang
发明人： Hung-Lin Chang , Chen-Chuan Chang
IPC分类号： H05K3/36
CPC分类号： H05K3/0035 , H05K3/244 , H05K3/427 , H05K3/4652 , H05K3/4697 , H05K2201/0317 , H05K2203/0361 , H05K2203/072 , Y10T29/49126 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a printed circuit board is disclosed. The method comprises the steps of: providing a base board, wherein the base board comprises a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.
摘要翻译： 公开了一种印刷电路板的制造方法。 该方法包括以下步骤：提供基板，其中基板包括第一表面层; 对所述基板执行第一图案化处理以在所述第一表面层上形成底部电路; 在底部电路上形成金属保护层; 对金属保护层进行第二图案化处理以形成图案化的金属保护层; 对基板进行积聚处理以在底部电路和图案化的金属保护层上形成第一组合层; 对所述第一累积层执行第三图案化处理以形成第一累积层电路; 对所述第一组合层执行激光制造工艺以形成空腔结构; 并清除图案化的金属保护层。
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公开(公告)号：US09247631B2
公开(公告)日：2016-01-26
申请号：US13352553
申请日：2012-01-18
申请人： Chen-Chuan Chang
发明人： Chen-Chuan Chang
CPC分类号： H05K1/0204 , H01L33/642 , H01L33/644 , H05K3/022 , H05K3/4046 , H05K2201/066 , H05K2201/10106 , H05K2201/10416 , H05K2203/0323 , H05K2203/061 , H05K2203/063 , Y10T29/49124 , Y10T29/49126
摘要： A method, for fabricating a heat dissipation substrate, includes the steps of: providing a substrate, with the substrate including a metal layer, an insulation layer, and a first conductive layer, with the insulation layer positioned between the metal layer and the first conductive layer, and with the metal layer thicker than the first conductive layer; removing part of the metal layer for forming a metal bulk; providing an adhesive layer including an opening, with the opening corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, with the hole positioned under the metal bulk; and forming a third conductive layer in the hole.
摘要翻译： 一种用于制造散热基板的方法，包括以下步骤：提供衬底，其中衬底包括金属层，绝缘层和第一导电层，绝缘层位于金属层和第一导电层之间 并且金属层比第一导电层厚; 去除用于形成金属体的金属层的一部分; 提供包括开口的粘合层，所述开口对应于所述金属体; 提供第二导电层; 层叠第二导电层，粘合剂层和基板; 在所述绝缘层和所述第一导电层中形成孔，所述孔位于所述金属体下; 以及在所述孔中形成第三导电层。
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公开(公告)号：US20110284267A1
公开(公告)日：2011-11-24
申请号：US12782900
申请日：2010-05-19
申请人： Chen-Chuan Chang
发明人： Chen-Chuan Chang
CPC分类号： B32B38/10 , H05K3/4623 , H05K3/4652 , H05K3/4697 , H05K2201/0355 , H05K2201/09127 , H05K2203/107 , Y10T156/1052
摘要： A circuit board having a cavity is provided. The circuit board includes a first core layer, a second core layer, and a central dielectric layer. The first core layer includes a core dielectric layer and a core circuit layer, wherein the core circuit layer is disposed on the core dielectric layer. The second core layer is disposed on the first core layer. The central dielectric layer is disposed between the first core layer and the second core layer. The cavity runs through the second core layer and the central dielectric layer and exposes a portion of the core circuit layer.
摘要翻译： 提供具有空腔的电路板。 电路板包括第一芯层，第二芯层和中心电介质层。 第一芯层包括芯介质层和芯电路层，其中芯电路层设置在芯介质层上。 第二芯层设置在第一芯层上。 中心电介质层设置在第一芯层和第二芯层之间。 空腔穿过第二芯层和中心电介质层并暴露核心电路层的一部分。
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