Method of etching a magnetic material
    4.
    发明授权
    Method of etching a magnetic material 失效
    蚀刻磁性材料的方法

    公开(公告)号:US07105361B2

    公开(公告)日:2006-09-12

    申请号:US10338059

    申请日:2003-01-06

    IPC分类号: H01L21/302

    CPC分类号: H01L43/12

    摘要: A method of patterning a layer of magnetic material to form isolated magnetic regions. The method forms a mask on a film stack comprising a layer of magnetic material such that the protected and unprotected regions are defined. The unprotected regions are etched in a high temperature environment to form isolated magnetic regions.

    摘要翻译: 图案化磁性材料层以形成隔离的磁性区域的方法。 该方法在包含磁性材料层的薄膜叠层上形成掩模,使得限定保护区和未保护区。 未受保护的区域在高温环境中被蚀刻以形成隔离的磁性区域。

    Method of etching ferroelectric layers
    7.
    发明授权
    Method of etching ferroelectric layers 失效
    腐蚀铁电层的方法

    公开(公告)号:US06943039B2

    公开(公告)日:2005-09-13

    申请号:US10365008

    申请日:2003-02-11

    摘要: Method of etching a ferroelectric layer includes etching an upper electrode and partially through a ferroelectric layer. A dielectric material is subsequently deposited upon the upper electrode and the partially etched ferroelectric layer. A second etch step completely etches through the remaining portion of the ferroelectric layer and also etches lower electrodes. A random access memory apparatus is constructed that includes a first conductive layer, a dielectric layer disposed upon the first conductive layer, a second conductive layer disposed upon the dielectric layer, where such layers form a stack having a sidewall. Further, the sidewall has a protective dielectric film disposed thereon and extending from the second layer down to the dielectric layer.

    摘要翻译: 蚀刻铁电体层的方法包括:蚀刻上部电极,部分地通过铁电体层。 随后将电介质材料沉积在上电极和部分蚀刻的铁电层上。 第二蚀刻步骤完全蚀刻穿过铁电层的剩余部分并蚀刻下电极。 构造了随机存取存储装置,其包括第一导电层,设置在第一导电层上的电介质层,设置在电介质层上的第二导电层,其中这些层形成具有侧壁的叠层。 此外,侧壁具有设置在其上并从第二层向下延伸到电介质层的保护电介质膜。

    Method for removing conductive residue
    8.
    发明授权
    Method for removing conductive residue 失效
    去除导电残渣的方法

    公开(公告)号:US06933239B2

    公开(公告)日:2005-08-23

    申请号:US10342087

    申请日:2003-01-13

    IPC分类号: H01L21/3213 H01L21/302

    CPC分类号: H01L43/12 H01L21/32136

    摘要: A method for removing conductive residue from a layer on a semiconductor substrate by exposing the substrate to a gas comprising a fluorine containing gas and a hydrogen containing gas. In one embodiment, the gas is excited to form a plasma that removes the conductive residue during fabrication of a magneto-resistive random access memory (MRAM) device.

    摘要翻译: 一种通过将衬底暴露于包含含氟气体和含氢气体的气体从半导体衬底上的层去除导电残留物的方法。 在一个实施例中,气体被激发以形成在制造磁阻随机存取存储器(MRAM)器件期间除去导电残留物的等离子体。