摘要:
An electronic package structure is provided which comprises a metal core PCB, an energy storage device and at least one electronic component. The at least one electronic component is disposed between the metal core PCB and the energy storage device. The metal core PCB defines at least a through hole. A thermal passage is disposed in the through hole. An insulating layer is disposed in the through hole and located between the metal layer of the metal core PCB and the thermal passage to prevent the electric coupling between the thermal passage and the metal layer. The energy storage device comprises at least a connecting pin in thermal contact with the thermal passage.
摘要:
An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.
摘要:
An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.
摘要:
A page-width array printing device includes a page-width array printing mechanism including at least one page-width array printing module. The page-width array printing module includes a printing platform, a first page-width array printing unit and a second page-width array printing unit. The first page-width array printing unit includes a plurality of first inkjet cartridges. The second page-width array printing unit includes a plurality of second inkjet cartridges. The first page-width array printing unit and the second page-width array printing unit are in parallel with each other. The first inkjet cartridges and the second inkjet cartridges are staggered and independently and detachably disposed on the printing platform. Each of the first inkjet cartridges and the second inkjet cartridges includes an inkjet chip. The inkjet chip includes four ink supply channels and a plurality of nozzles so as to perform a monochromatic or polychromatic page-width array printing operation.
摘要:
A method of determining the reliability of a high-voltage PMOS (HVPMOS) device includes determining a bulk resistance of the HVPMOS device, and evaluating the reliability of the HVPMOS device based on the bulk resistance.
摘要:
A stapler has a supporting base, a magazine assembly, a trigger assembly and a leg-flatting device. The trigger assembly has a trigger lever and a pushing element. The pushing element is mounted pivotally on the trigger lever with a pivot and has two pushing arms extending toward the supporting base. The leg-flatting device is mounted on the supporting base and has a sliding base, a moving base and an anvil element. The sliding base is slidably mounted on the supporting base and has a pushed segment corresponding to and selectively pushed by the pushing arms. The moving base is selectively blocked by the sliding base to keep the moving base from moving downwardly before the sliding base sliding relative to the supporting base and has an elongated hole. The anvil element is mounted in the elongated hole in the moving base.
摘要:
A method for controlling the color contrast of a multi-wavelength light-emitting diode (LED) made according to the present invention is disclosed. The present invention includes at least the step of increasing the junction temperature of a multi-quantum-well LED, such that holes are distributed in a deeper quantum-well layer of the LED to increase luminous intensity of the deeper quantum-well layer, thereby controlling the relative intensity ratios of the multiple wavelengths emitted by the LED. The step of increasing junction temperature of the multi-quantum-well LED is achieved either by controlling resistance through modulating thickness of a p-type electrode layer of the LED or by modifying the mesa area size to control its relative heat radiation surface area.
摘要:
Within a method for fabricating a microelectronic fabrication, and the microelectronic fabrication fabricated employing the method, there is formed within the microelectronic fabrication a capacitor structure upon a conductor stud layer formed into a first via defined by a patterned dielectric layer to reach a one of a pair of patterned conductor layers within the microelectronic fabrication prior to forming through the patterned dielectric layer a second via to reach the other of the pair of patterned conductor layers within the microelectronic fabrication. The method provides the resulting microelectronic fabrication with enhanced reliability and performance.
摘要:
A device includes a substrate, a gate dielectric over the substrate, and a gate electrode over the gate dielectric. A drain region and a source region are disposed on opposite sides of the gate electrode. Insulation regions are disposed in the substrate, wherein edges of the insulation regions are in contact with edges of the drain region and the source region. A dielectric mask includes a portion overlapping a first interface between the drain region and an adjoining portion of the insulation regions. A drain silicide region is disposed over the drain region, wherein an edge of the silicide region is substantially aligned to an edge of the first portion of the dielectric mask.
摘要:
A page-width array printing device includes a page-width array printing mechanism including at least one page-width array printing module. The page-width array printing module includes a printing platform, a first page-width array printing unit and a second page-width array printing unit. The first page-width array printing unit includes a plurality of first inkjet cartridges. The second page-width array printing unit includes a plurality of second inkjet cartridges. The first page-width array printing unit and the second page-width array printing unit are in parallel with each other. The first inkjet cartridges and the second inkjet cartridges are staggered and independently and detachably disposed on the printing platform. Each of the first inkjet cartridges and the second inkjet cartridges includes an inkjet chip. The inkjet chip includes four ink supply channels and a plurality of nozzles so as to perform a monochromatic or polychromatic page-width array printing operation.