公开(公告)号：US07284324B2

公开(公告)日：2007-10-23

申请号：US11197675

申请日：2005-08-04

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US07000315B2

公开(公告)日：2006-02-21

申请号：US10387203

申请日：2003-03-11

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01R43/16

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US06856225B1

公开(公告)日：2005-02-15

申请号：US09573815

申请日：2000-05-17

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01R9/03 ,  H05K7/02

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

摘要翻译： 可以用于高Q电感和变压器的片上集成的平面外微结构使得磁场方向平行于衬底平面而不需要高纵横比处理。 光刻图案的线圈结构包括具有固有应力分布的弹性构件。 固有的应力分布使形成环绕的基板远离基板偏移。 锚固部分​​保持固定到基底上。 自由部分端部成为可以通过焊接或电镀而连接到基板的第二锚固部分。 一系列单独的线圈结构可以通过它们的锚定部分接合以形成电感器和变压器。

公开(公告)号：US06947291B2

公开(公告)日：2005-09-20

申请号：US10154555

申请日：2002-05-23

申请人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

发明人： Christopher L. Chua ,  Francesco Lemmi ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu ,  David K. Fork ,  Eric Peeters ,  Decai Sun ,  Donald L. Smith ,  Linda T. Romano

IPC分类号： H01F41/04 ,  G01R1/067 ,  G01R3/00 ,  G03C5/00 ,  H01F17/00 ,  H01F17/02 ,  H01F27/29 ,  H01L21/02 ,  H01L21/60 ,  H01L21/768 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/522 ,  H01R9/03 ,  H05K7/02

CPC分类号： H01L24/13 ,  G01R1/06727 ,  G01R3/00 ,  H01F17/0033 ,  H01F17/02 ,  H01F41/041 ,  H01L21/76838 ,  H01L21/7688 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/5227 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13099 ,  H01L2224/4847 ,  H01L2224/8592 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T29/49218 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

公开(公告)号：US07453339B2

公开(公告)日：2008-11-18

申请号：US11292421

申请日：2005-12-02

申请人： David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu

发明人： David K. Fork ,  Thomas Hantschel ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu

IPC分类号： H01H51/22

CPC分类号： H01H59/0009 ,  H01H2059/0081

摘要： In one aspect, an electromechanical switching device is illustrated. The electromechanical switching device includes a relay with at least one first conductive portion, at least one second conductive portion, and at least one actuation component that moves the at least one first conductive portion and the at least one second conductive portion into and out of conductive contact. The at least one first conductive portion includes a conductive stationary end coupled to a substrate and a conductive free-floating end. The at least one actuation component includes an actuation stationary end coupled to the substrate and an actuation free-floating end. The actuation free floating end, when the at least one actuation component is not energized, curls, which curls the conductive free floating end into or out of conductive contact with the at least one second conductive portion.

摘要翻译： 在一个方面，示出了机电开关装置。 机电开关装置包括具有至少一个第一导电部分，至少一个第二导电部分和至少一个致动部件的继电器，所述至少一个致动部件将至少一个第一导电部分和至少一个第二导电部分移入和移出导电部分 联系。 所述至少一个第一导电部分包括耦合到衬底的导电固定端和导电自由浮动端。 所述至少一个致动部件包括联接到所述基板的致动固定端和致动自由浮动端。 当所述至少一个致动部件未通电时，所述致动自由浮动端部卷曲，所述自由浮动端部将所述导电自由浮动端部与所述至少一个第二导电部分导电接触或者脱离所述至少一个第二导电部分的导电接触。

公开(公告)号：US06973722B2

公开(公告)日：2005-12-13

申请号：US10715978

申请日：2003-11-17

申请人： Thomas Hantschel ,  David K. Fork ,  Dirk De Bruyker ,  Chinnwen Shih ,  Jeng Ping Lu ,  Christopher L. Chua ,  Raj B. Apte ,  Brent S. Krusor

发明人： Thomas Hantschel ,  David K. Fork ,  Dirk De Bruyker ,  Chinnwen Shih ,  Jeng Ping Lu ,  Christopher L. Chua ,  Raj B. Apte ,  Brent S. Krusor

IPC分类号： G01R1/067 ,  G01R3/00 ,  H05K3/40 ,  H01R43/16

CPC分类号： G01R1/06744 ,  G01R1/06727 ,  G01R3/00 ,  H05K3/4092 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222

摘要： Spring structures are subjected to pre-release and post-release annealing to tune their tip height to match a specified target. Post-release annealing increases tip height, and pre-release annealing decreases tip height. The amount of tuning is related to the annealing temperature and/or time. Annealing schedules are determined for a pre-fabricated cache of unreleased spring structures such that finished spring structures having a variety of target heights can be economically produced by releasing/annealing the cache according to associated annealing schedules. Selective annealing is performed using lasers and heat absorbing/reflecting materials. Localized annealing is used to generate various spring structure shapes. Both stress-engineered and strain-engineered spring structures are tuned by annealing.

摘要翻译： 弹簧结构经受预释放和后释放退火以调节其尖端高度以匹配指定的靶。 后释放退火增加尖端高度，并且预释放退火使尖端高度降低。 调谐量与退火温度和/或时间有关。 对于未发布的弹簧结构的预制缓存来确定退火计划，使得可以通过根据相关联的退火计划释放/退火高速缓存来经济地产生具有各种目标高度的成品弹簧结构。 使用激光和吸热/反射材料进行选择性退火。 定位退火用于产生各种弹簧结构形状。 应力设计和应变工程弹簧结构都通过退火进行调整。

公开(公告)号：US06720594B2

公开(公告)日：2004-04-13

申请号：US10041544

申请日：2002-01-07

申请人： Jeffrey T. Rahn ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu

发明人： Jeffrey T. Rahn ,  Koenraad F. Van Schuylenbergh ,  Jeng Ping Lu

IPC分类号： H01L2700

CPC分类号： H01L27/14609 ,  H01L27/14658 ,  H01L31/1055

摘要： Improved pixel circuits are disclosed for high fill-factor large area imager systems using continuous (e.g., amorphous silicon) sensor layers. A first approach prevents crosstalk by ensuring that each pixel is not able to go into saturation. A second approach employs a cascode transistor to maintain the bias of the sensor contact at a constant potential regardless of illumination condition. These two approaches may be combined. A resistive film connecting the pixel contacts may be used in conjunction with the second approach to prevent aliasing of signal and noise.

摘要翻译： 公开了使用连续（例如非晶硅）传感器层的高填充因子大面积成像器系统的改进的像素电路。 第一种方法通过确保每个像素不能进入饱和状态来防止串扰。 第二种方法采用共源共栅晶体管，以将传感器接触的偏压保持在恒定的电位，而与照明条件无关。 这两种方法可以组合。 连接像素触点的电阻膜可以与第二种方法一起使用，以防止信号和噪声的混叠。

公开(公告)号：US06760505B1

公开(公告)日：2004-07-06

申请号：US09708805

申请日：2000-11-08

申请人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

发明人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

IPC分类号： G02B626

CPC分类号： G02B6/3588 ,  G02B6/3512 ,  G02B6/3556 ,  G02B6/3582 ,  G02B6/359

摘要： A method of aligning optical components is described. The system utilizes a highly transmissive sensor positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor to readjust elements that maintains the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.

摘要翻译： 描述了对准光学部件的方法。 该系统利用位于光信号的光路中的高度透射的传感器来确定光信号的精确位置。 反馈回路使用高度透射传感器的输出来重新调整将光信号保持在期望位置的元件。 目前的系统特别适用于光交叉开关。

公开(公告)号：US06549691B1

公开(公告)日：2003-04-15

申请号：US09708814

申请日：2000-11-08

申请人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

发明人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

IPC分类号： G02B626

CPC分类号： G02B6/3586 ,  G02B6/3512 ,  G02B6/3556 ,  G02B6/3588 ,  G02B6/359 ,  H04Q11/0005 ,  H04Q2011/0026 ,  H04Q2011/0039 ,  H04Q2011/0058

摘要： An optical cross switch including an improved system to align optical components is described. The system utilizes a highly transmissive sensor positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor to readjust elements that maintains the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.

摘要翻译： 描述了包括改进的对准光学部件的系统的光交叉开关。 该系统利用位于光信号的光路中的高度透射的传感器来确定光信号的精确位置。 反馈回路使用高度透射传感器的输出来重新调整将光信号保持在期望位置的元件。 目前的系统特别适用于光交叉开关。

公开(公告)号：US06429417B1

公开(公告)日：2002-08-06

申请号：US09708808

申请日：2000-11-08

申请人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

发明人： Robert A. Street ,  Eric Peeters ,  Michel A. Rosa ,  Jeng Ping Lu ,  Christopher L. Chua

IPC分类号： H01L2700

CPC分类号： H01L31/1055 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/356 ,  G02B6/3588 ,  G02B26/0841 ,  H01L31/108 ,  H04Q11/0005 ,  H04Q2011/003 ,  H04Q2011/0039

摘要： A system to align optical components is described. The system utilizes a highly transmissive sensor positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor to readjust elements that maintains the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.

摘要翻译： 描述了对准光学部件的系统。 该系统利用位于光信号的光路中的高度透射的传感器来确定光信号的精确位置。 反馈回路使用高度透射传感器的输出来重新调整将光信号保持在期望位置的元件。 目前的系统特别适用于光交叉开关。