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    Memory card and its manufacturing method
    1.
    发明授权
    Memory card and its manufacturing method 有权
    存储卡及其制造方法

    公开(公告)号：US07220915B1

    公开(公告)日：2007-05-22

    申请号：US11060263

    申请日：2005-02-17

    申请人： Chul Woo Park ,  Sang Jae Jang ,  Sung Su Park ,  Choon Heung Lee ,  Suk Gu Ko

    发明人： Chul Woo Park ,  Sang Jae Jang ,  Sung Su Park ,  Choon Heung Lee ,  Suk Gu Ko

    IPC分类号： H05K3/28 ,  H01L23/02 ,  H01L23/495

    CPC分类号： G11C29/48 ,  G11C29/1201 ,  H01L23/49855 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A memory card comprising a circuit board having opposed upper and lower circuit board surfaces, at least one test pad disposed on the upper circuit board surface, and a conductive pattern disposed on the lower circuit board surface and electrically connected to the test pad. Electrically connected to the conductive pattern of the circuit board is a leadframe which includes a plurality of leads, each of the leads having a signal pad portion. At least one electronic circuit element is attached to the lower circuit board surface and electrically connected to the leadframe and to the conductive pattern of the circuit board. A body at least partially encapsulates the circuit board, the leadframe and the electronic circuit element such that the test pad of the circuit board is exposed in an upper body surface of the body, and the signal pad portions of the leads of the leadframe are exposed in a lower body surface of the body.

    摘要翻译： 一种存储卡，包括具有相对的上电路板表面和下电路板表面的电路板，设置在上电路板表面上的至少一个测试焊盘和布置在下电路板表面上并电连接到测试焊盘的导电图案。 电连接到电路板的导电图案的是引线框架，其包括多个引线，每个引线具有信号焊盘部分。 至少一个电子电路元件附接到下电路板表面并电连接到引线框架和电路板的导电图案。 主体至少部分地封装电路板，引线框架和电子电路元件，使得电路板的测试焊盘暴露在主体的上体表面中，并且引线框的引线的信号焊盘部分被暴露 在身体的下半身表面。

    Memory card and its manufacturing method
    3.
    发明授权
    Memory card and its manufacturing method 有权
    存储卡及其制造方法

    公开(公告)号：US07201327B1

    公开(公告)日：2007-04-10

    申请号：US10967462

    申请日：2004-10-18

    申请人： Chul Woo Park ,  Sang Jae Jang ,  Sung Su Park ,  Choon Heung Lee ,  Suk Gu Ko

    发明人： Chul Woo Park ,  Sang Jae Jang ,  Sung Su Park ,  Choon Heung Lee ,  Suk Gu Ko

    IPC分类号： G06K19/06

    CPC分类号： G06K19/077 ,  G06K19/07732 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012

    摘要： A memory card comprising a die paddle having opposed, generally planar first and second die paddle surfaces and multiple peripheral edge segments. Disposed along and in spaced relation to one of the peripheral edge segments of the die paddle is a plurality of contacts, each of which has opposed, generally planar first and second contact surfaces. An inner body partially encapsulates the die paddle and the contacts, the first contact surface of each of the contacts and the first die paddle surface of the die paddle being exposed in and substantially flush with a generally planar first inner body surface of the inner body. The inner body further defines a generally planar second inner body surface which is disposed in opposed relation to the first inner body surface, the second contact surface of each of the contacts being exposed in the second inner body surface. At least one electronic circuit element is attached to the first die paddle surface and electrically connected to at least one of the contacts. An outer body partially encapsulates the inner body such that the first die paddle surface, the first contact surface of each of the contacts, the first inner body surface and the electronic circuit element are covered by the outer body, with the second inner body surface and hence the second contact surface of each of the contacts not being covered by the outer body and thus exposed.

    摘要翻译： 一种存储卡，其包括具有相对的，大致平面的第一和第二管芯片表面和多个外围边缘部分的管芯焊盘。 与模板的周边边缘部分中的一个相互间隔设置有多个触点，每个触点具有相对的大致平面的第一和第二接触表面。 内部主体部分地封装管芯焊盘和触头，每个触头的第一接触表面和管芯焊盘的第一裸片焊盘表面暴露于内部主体的大致平面的第一内部主体表面并基本上与其平齐。 内体进一步限定大致平坦的第二内体表面，其以与第一内体表面相对的方式设置，每个触头的第二接触表面暴露在第二内体表面中。 至少一个电子电路元件附接到第一裸片表面并电连接到至少一个触点。 外部主体部分地封装内部主体，使得第一裸片表面，每个触点的第一接触表面，第一内部主体表面和电子电路元件被外部主体覆盖，具有第二内部主体表面和 因此每个触点的第二接触表面不被外体覆盖并因此被暴露。

    Modular memory card and method of making same
    4.
    发明授权
    Modular memory card and method of making same 有权
    模块化存储卡及其制作方法

    公开(公告)号：US07837120B1

    公开(公告)日：2010-11-23

    申请号：US11288906

    申请日：2005-11-29

    申请人： Sang Jae Jang ,  Chul Woo Park ,  Choon Heung Lee

    发明人： Sang Jae Jang ,  Chul Woo Park ,  Choon Heung Lee

    IPC分类号： G06K19/06

    CPC分类号： G06K19/07732

    摘要： In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. The module is inserted into a complementary cavity formed within a case of the memory card, such case generally defining the outer appearance of the memory card. The module is secured within the cavity of the case through the use of an adhesive. In each embodiment of the present invention, the module is uniquely configured to prevent adhesive leakage from within the corresponding cavity of the case of the memory card when the module is secured within the cavity.

    摘要翻译： 根据本发明，提供了存储卡的多个实施例，每个实施例包括至少包括安装有电子电路装置的印刷电路板的模块。 模块被插入形成在存储卡的壳体内的互补空腔中，这种情况通常限定存储卡的外观。 模块通过使用粘合剂固定在外壳的腔内。 在本发明的每个实施例中，模块被独特地构造成当模块固定在空腔内时，防止粘合剂从存储卡的壳体的相应空腔内泄漏。

    Multiple cover memory card
    6.
    发明授权
    Multiple cover memory card 有权
    多盖存储卡

    公开(公告)号：US07359204B1

    公开(公告)日：2008-04-15

    申请号：US11355092

    申请日：2006-02-15

    申请人： Sang Jae Jang ,  Chul Woo Park ,  Jong Woon Choi ,  Jae Dong Kim ,  Choon Heung Lee ,  Chang Deok Lee

    发明人： Sang Jae Jang ,  Chul Woo Park ,  Jong Woon Choi ,  Jae Dong Kim ,  Choon Heung Lee ,  Chang Deok Lee

    IPC分类号： H05K7/20

    CPC分类号： H05K5/0256 ,  G06K19/07 ,  G06K19/07732

    摘要： A memory card including a module comprising at least a printed circuit board having an electronic circuit device mounted thereto and at least one I/O pad and at least one test pad disposed thereon. The module is inserted into a complementary cavity formed within a case of the memory card, such case generally defining the outer appearance of the memory card. The module is secured within the cavity of the case through the use of an adhesive. In each embodiment of the present invention, first and second covers are movably attached to a case for selectively covering or exposing the I/O pads and the test features/pads of the module of the memory card.

    摘要翻译： 一种存储卡，包括至少包括安装有电子电路装置的印刷电路板和至少一个I / O焊盘和至少一个设置在其上的测试焊盘的模块。 模块被插入形成在存储卡的壳体内的互补空腔中，这种情况通常限定存储卡的外观。 模块通过使用粘合剂固定在外壳的腔内。 在本发明的每个实施例中，第一和第二盖可移动地附接到壳体，用于选择性地覆盖或暴露存储卡模块的I / O焊盘和测试特征/焊盘。

    Enhanced durability memory card
    7.
    发明授权
    Enhanced durability memory card 有权
    增强耐用性记忆卡

    公开(公告)号：US07375975B1

    公开(公告)日：2008-05-20

    申请号：US11263428

    申请日：2005-10-31

    申请人： Sang Jae Jang ,  Chul Woo Park ,  Choon Heung Lee

    发明人： Sang Jae Jang ,  Chul Woo Park ,  Choon Heung Lee

    IPC分类号： H05K5/03 ,  H05K9/00

    CPC分类号： G06K19/07745 ,  G06K19/07728 ,  G06K19/07732 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00

    摘要： In accordance with the present invention, there is provided multiple embodiments of a memory card, each embodiment including a case which is cooperatively engaged to a module comprising at least a printed circuit board having an electronic circuit device mounted thereto. In each embodiment of the present invention, the case is reinforced by a stiffener which effectively increases the mechanical strength of the fully fabricated memory card, thus providing the capability to withstand typical bending and twisting tests. The stiffener may be provided in any one of a plurality of different shapes or profiles, and may embedded within one or more of various locations within the case.

    摘要翻译： 根据本发明，提供了存储卡的多个实施例，每个实施例包括与至少包括安装有电子电路装置的印刷电路板的模块配合地接合的壳体。 在本发明的每个实施例中，通过加强件增强了外壳，该加强件有效地增加了完全制造的存储卡的机械强度，从而提供了经受典型的弯曲和扭曲试验的能力。 加强件可以以多种不同形状或轮廓中的任何一种形式提供，并且可以嵌入壳体内的各种位置的一个或多个中。

    Semiconductor device having architecture for reducing area and semiconductor system including the same
    9.
    发明授权
    Semiconductor device having architecture for reducing area and semiconductor system including the same 有权
    具有用于减小面积的结构的半导体器件和包括其的半导体系统

    公开(公告)号：US08238148B2

    公开(公告)日：2012-08-07

    申请号：US12652190

    申请日：2010-01-05

    申请人： Ho Jung Kim ,  Chul Woo Park ,  Sang Beom Kang ,  Jung Min Lee ,  Hyun Ho Choi

    发明人： Ho Jung Kim ,  Chul Woo Park ,  Sang Beom Kang ,  Jung Min Lee ,  Hyun Ho Choi

    IPC分类号： G11C11/00 ,  G11C7/10 ,  G11C7/00 ,  G11C8/00

    CPC分类号： G11C7/1039 ,  G11C7/1033 ,  G11C7/1051 ,  G11C7/106 ,  G11C7/1069 ,  G11C7/1078 ,  G11C7/1087 ,  G11C7/1096 ,  G11C13/0004 ,  G11C2207/107

    摘要： A semiconductor device having an architecture for reducing an area is provided. The semiconductor device includes a memory cell array including a plurality of non-volatile memory cells, a plurality of registers each configured to store pre-fetch unit data, and a write driver circuit configured to write pre-fetch unit data sequentially output from the plurality of registers to the memory cell array during a write operation. The semiconductor device also includes a sense amplifier circuit configured to sense and amplify pre-fetch unit data sequentially output from the memory cell array and to sequentially store the amplified pre-fetch unit data in the plurality of registers, respectively, during a read operation.

    摘要翻译： 提供了具有用于减小面积的架构的半导体器件。 半导体器件包括存储单元阵列，该存储单元阵列包括多个非易失性存储器单元，多个寄存器，每个寄存器被配置为存储预取单元数据;以及写入驱动器电路，被配置为写入从多个单元顺序地输出的预取单元数据 的寄存器在写操作期间到存储单元阵列。 半导体器件还包括读出放大器电路，其被配置为感测并放大从存储单元阵列顺序输出的预取单元数据，并且在读取操作期间分别顺序地将放大的预取单元数据存储在多个寄存器中。