公开(公告)号：US07344998B2

公开(公告)日：2008-03-18

申请号：US10943081

申请日：2004-09-15

Applicant: Chun-Te Lin ,  Ta-Te Chen

Inventor： Chun-Te Lin ,  Ta-Te Chen

IPC: H01L21/302 ,  H01L21/461

CPC classification number: C23F1/16 ,  C23F1/20 ,  C23F1/26 ,  H01L21/32134

Abstract: In order to use an etching solution of less complicated composition for recovering used wafers, embodiments of the present invention provide a recovering method, and also provide a kind of wafer, which is used as a process control wafer or dummy wafer, and fabrication methods. In one embodiment, a wafer-recovering method comprises providing a first wafer, wherein the first wafer has a base, a first conductive layer on the base, and a second conductive layer on the first conductive layer. The method further comprises removing the first and second conductive layers with an acidic solution to obtain a second wafer; and washing the second wafer with a liquid. The second conductive layer is formed on the first conductive layer in a deposition process, and the first conductive layer is more easily removed by the acidic solution than the second conductive layer.

Abstract translation: 为了使用复杂组合物用于回收使用过的晶片的蚀刻溶液，本发明的实施例提供了一种恢复方法，并且还提供了一种用作过程控制晶片或虚设晶片的晶片，以及制造方法。 在一个实施例中，晶片恢复方法包括提供第一晶片，其中第一晶片具有基极，基极上的第一导电层和第一导电层上的第二导电层。 该方法还包括用酸性溶液去除第一和第二导电层以获得第二晶片; 并用液体洗涤第二晶片。 第二导电层在沉积工艺中形成在第一导电层上，并且第一导电层比第二导电层更容易被酸性溶液除去。

公开(公告)号：US20050258138A1

公开(公告)日：2005-11-24

申请号：US10943081

申请日：2004-09-15

Applicant: Chun-Te Lin ,  Ta-Te Chen

Inventor： Chun-Te Lin ,  Ta-Te Chen

IPC: B44C1/22 ,  C23F1/00 ,  C23F1/20 ,  C23F1/26 ,  H01L21/00 ,  H01L21/3213

CPC classification number: C23F1/16 ,  C23F1/20 ,  C23F1/26 ,  H01L21/32134

Abstract: In order to use an etching solution of less complicated composition for recovering used wafers, embodiments of the present invention provide a recovering method, and also provide a kind of wafer, which is used as a process control wafer or dummy wafer, and fabrication methods. In one embodiment, a wafer-recovering method comprises providing a first wafer, wherein the first wafer has a base, a first conductive layer on the base, and a second conductive layer on the first conductive layer. The method further comprises removing the first and second conductive layers with an acidic solution to obtain a second wafer; and washing the second wafer with a liquid. The second conductive layer is formed on the first conductive layer in a deposition process, and the first conductive layer is more easily removed by the acidic solution than the second conductive layer.

Abstract translation: 为了使用复杂组合物用于回收使用过的晶片的蚀刻溶液，本发明的实施例提供了一种恢复方法，并且还提供了一种用作过程控制晶片或虚设晶片的晶片，以及制造方法。 在一个实施例中，晶片恢复方法包括提供第一晶片，其中第一晶片具有基极，基极上的第一导电层和第一导电层上的第二导电层。 该方法还包括用酸性溶液去除第一和第二导电层以获得第二晶片; 并用液体洗涤第二晶片。 第二导电层在沉积工艺中形成在第一导电层上，并且第一导电层比第二导电层更容易被酸性溶液除去。

公开(公告)号：US09618990B2

公开(公告)日：2017-04-11

申请号：US13676042

申请日：2012-11-13

Applicant: Shih-Chin Lu ,  Chung-Chi Tsou ,  Chun-Te Lin

Inventor： Shih-Chin Lu ,  Chung-Chi Tsou ,  Chun-Te Lin

IPC: G06F1/00 ,  G06F1/30 ,  G06F1/32

CPC classification number: G06F1/30 ,  G06F1/3212 ,  G06F1/324 ,  Y02D10/126 ,  Y02D10/174

Abstract: A power management method is suitable for an electronic device including a controller, a processor and a battery, and includes following steps. A first power is provided to the electronic device by a power adapter, and a maximum value of the first power is smaller than a maximum value of a rated consumed power of the electronic device. A power state of a second power of the battery is obtained by the controller. A control signal is generated according to the power state, and the processor adjusts an operation performance of the processor based on the control signal. The operation performance of the processor is continuously adjusted according to the power state.

公开(公告)号：US08122241B2

公开(公告)日：2012-02-21

申请号：US11826704

申请日：2007-07-18

Applicant: Chun-Te Lin ,  Yi-Hung Shen

Inventor： Chun-Te Lin ,  Yi-Hung Shen

IPC: H04L29/06

CPC classification number: H04L63/0428 ,  H04L9/3226

Abstract: A method for delivering a confidential e-mail is disclosed. The application software loads a first e-mail, checks if an attached file of the first e-mail is encrypted, opens a second e-mail for delivering a password of the attached file when the attached file is encrypted, and loads at least one receiver of the first e-mail to the second e-mail for sending the second e-mail.

Abstract translation: 公开了一种递送机密电子邮件的方法。 应用软件加载第一个电子邮件，检查第一个电子邮件的附加文件是否被加密，打开第二个电子邮件，用于在附加文件加密时传递附件文件的密码，并加载至少一个 接收第一个电子邮件的第二个电子邮件发送第二个电子邮件。

公开(公告)号：US08531009B2

公开(公告)日：2013-09-10

申请号：US12205443

申请日：2008-09-05

Applicant: Chun-Te Lin ,  Tzu-Ying Kuo ,  Shu-Ming Chang

Inventor： Chun-Te Lin ,  Tzu-Ying Kuo ,  Shu-Ming Chang

IPC: H01L23/48 ,  H01L21/58

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/18 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14

Abstract: This invention provides a package structure of three-dimensional stacking dice and its manufacturing method. This invention employs the Through-Silicon-Vias (TSVs) technology to establish vertical electrical connection of the three-dimensional stacking dice and a redistribution layer between a blind hole-on-pad and a vertical through hole formed by the TSVs technology to direct the electrical connection from a first surface to an opposite second surface of this structure. In addition, this invention employs a conductive bump completely covering the pads jointed together between the stacking dice to avoid breakage of the pads. The reliability of the three-dimensional stacking dice of the present invention is increased.

Abstract translation: 本发明提供三维堆叠骰子的包装结构及其制造方法。 本发明采用通硅通孔（TSV）技术来建立三维叠层骰子的垂直电连接，以及由盲孔在衬垫和由TSV技术形成的垂直通孔之间的再分布层，以引导 从该结构的第一表面到相对的第二表面的电连接。 此外，本发明使用完全覆盖在堆叠骰子之间连接在一起的焊盘的导电凸块，以避免焊盘的破损。 本发明的三维堆叠骰子的可靠性提高。

公开(公告)号：US20130124892A1

公开(公告)日：2013-05-16

申请号：US13676042

申请日：2012-11-13

Applicant: Shih-Chin Lu ,  Chung-Chi Tsou ,  Chun-Te Lin

Inventor： Shih-Chin Lu ,  Chung-Chi Tsou ,  Chun-Te Lin

IPC: G06F1/26

CPC classification number: G06F1/30 ,  G06F1/3212 ,  G06F1/324 ,  Y02D10/126 ,  Y02D10/174

Abstract: A power management method is suitable for an electronic device including a controller, a processor and a battery, and includes following steps. A first power is provided to the electronic device by a power adapter, and a maximum value of the first power is smaller than a maximum value of a rated consumed power of the electronic device. A power state of a second power of the battery is obtained by the controller. A control signal is generated according to the power state, and the processor adjusts an operation performance of the processor based on the control signal. The operation performance of the processor is continuously adjusted according to the power state.

Abstract translation: 电源管理方法适用于包括控制器，处理器和电池的电子设备，并且包括以下步骤。 通过电源适配器向电子设备提供第一功率，并且第一功率的最大值小于电子设备的额定消耗功率的最大值。 电池的第二功率的电源状态由控制器获得。 根据功率状态产生控制信号，并且处理器基于控制信号调整处理器的操作性能。 根据电源状态不断调整处理器的运行性能。

公开(公告)号：US20080109658A1

公开(公告)日：2008-05-08

申请号：US11826704

申请日：2007-07-18

Applicant: Chun-Te Lin ,  Yi-Hung Shen

Inventor： Chun-Te Lin ,  Yi-Hung Shen

IPC: H04L9/00

CPC classification number: H04L63/0428 ,  H04L9/3226

Abstract: A method for delivering a confidential e-mail is disclosed. The application software loads a first e-mail, checks if an attached file of the first e-mail is encrypted, opens a second e-mail for delivering a password of the attached file when the attached file is encrypted, and loads at least one receiver of the first e-mail to the second e-mail for sending the second e-mail.

Abstract translation: 公开了传送机密电子邮件的方法。 应用软件加载第一个电子邮件，检查第一个电子邮件的附加文件是否被加密，打开第二个电子邮件，用于在附加文件加密时传递附件文件的密码，并加载至少一个 接收第一个电子邮件的第二个电子邮件发送第二个电子邮件。

公开(公告)号：US06743075B2

公开(公告)日：2004-06-01

申请号：US10346513

申请日：2003-01-15

Applicant: Chun-Te Lin ,  Shan-An Liu ,  Chung-Ru Wu ,  Ming-Hsien Lu

Inventor： Chun-Te Lin ,  Shan-An Liu ,  Chung-Ru Wu ,  Ming-Hsien Lu

IPC: B24B4902

CPC classification number: B24B37/013 ,  B24B37/042 ,  H01L21/31053 ,  H01L21/3212

Abstract: The present invention relates to a method for determining rapidly and accurately the polishing time of a chemical mechanical polishing process for polishing target wafers to avoid any problems of under-polishing or over-polishing. An aspect of the present invention is directed to a method for determining a chemical mechanical polishing time for removing a target polishing thickness H from an uneven surface of a target wafer. The method comprises polishing a control wafer by a chemical mechanical polishing to obtain a progressive relationship of polishing thickness and respective polishing time therefor. A first polishing time T1 is determined for removing a first thickness H1 from the target wafer, in which the first thickness H1 with substantially the uneven surface removed is smaller than the target polishing thickness H of the target wafer to be removed. In some embodiments, the first polishing time T1 is determined by polishing the target wafer to remove the first thickness H1 by chemical mechanical polishing. The method comprises calculating an image polishing thickness H1′ to be removed from the control wafer with respect to the first polishing time T1 according to the progressive relationship of the polishing thickness and respective polishing time for the control wafer. A second polishing thickness H2=(H−H1) is added to the image polishing thickness H1′ to obtain an equivalent polishing thickness H1′ for the control wafer. A target polishing time is determined for removing the target polishing thickness H from the target wafer by interpolating the progressive relationship of the polishing thickness and respective polishing time for the control wafer based on the equivalent polishing thickness H′.

Abstract translation: 本发明涉及一种用于快速准确地确定用于抛光目标晶片的化学机械抛光工艺的抛光时间的方法，以避免抛光不足或过度抛光的任何问题。 本发明的一个方面涉及一种用于确定从目标晶片的不平坦表面去除目标抛光厚度H的化学机械抛光时间的方法。 该方法包括通过化学机械抛光抛光控制晶片以获得抛光厚度和相应的抛光时间的渐进关系。 确定第一抛光时间T1，用于从目标晶片去除第一厚度H1，其中去除了基本上不平坦表面的第一厚度H1小于要去除的目标晶片的目标抛光厚度H. 在一些实施例中，通过抛光目标晶片以通过化学机械抛光去除第一厚度H1来确定第一抛光时间T1。 该方法包括根据抛光厚度与控制晶片的相应抛光时间的渐进关系，相对于第一抛光时间T1计算要从控制晶片移除的图像抛光厚度H1'。 将第二研磨厚度H2 =（H-H1）添加到图像研磨厚度H1'，以获得用于控制晶片的等效抛光厚度H1'。 通过根据等效抛光厚度H'插入控制晶片的研磨厚度和各抛光时间的渐进关系来确定从目标晶片去除目标抛光厚度H的目标抛光时间。

公开(公告)号：US20110125927A1

公开(公告)日：2011-05-26

申请号：US12952210

申请日：2010-11-23

Applicant: Yi-Hung Shen ,  Chun-Te Lin

Inventor： Yi-Hung Shen ,  Chun-Te Lin

IPC: G06F3/00

CPC classification number: G06F9/543

Abstract: A personal computer system and an operation method thereof for multiple outputs are provided. In the present method, input data generated by each of a plurality of input devices of the personal computer system are received. According to an identification information of each of the input devices, each of the input data is respectively transmitted to one of a plurality of application programs. After that, each of the application programs separately generates an output result according to the received input data and displays the output result on a corresponding application program interface, wherein all of the application program interfaces displaying the corresponding output results are in one and the same display screen of the personal computer system.

Abstract translation: 提供了一种用于多个输出的个人计算机系统及其操作方法。 在本方法中，接收由个人计算机系统的多个输入装置中的每一个生成的输入数据。 根据每个输入装置的识别信息，将每个输入数据分别发送到多个应用程序之一。 之后，每个应用程序分别根据接收的输入数据生成输出结果，并将输出结果显示在相应的应用程序界面上，其中显示相应输出结果的所有应用程序界面都在同一个显示中 个人电脑系统的屏幕。

公开(公告)号：US20080100267A1

公开(公告)日：2008-05-01

申请号：US11951031

申请日：2007-12-05

Applicant: Yi-Hung Shen ,  Chun-Te Lin

Inventor： Yi-Hung Shen ,  Chun-Te Lin

IPC: H01M10/44

CPC classification number: H02J7/0075

Abstract: A method for charging and maintaining a rechargeable battery is provided. The method includes the steps of enabling a life extending mode; determining whether the electric potential of the battery is less than or substantially equal to a predetermined charging level; charging the battery when the battery is connected with a power supply; and maintaining the electric potential of the battery at the predetermined battery level, in which the predetermined battery level is set at approximately from 50% to 70% of the full capacity of the battery.

Abstract translation: 提供了一种用于对可再充电电池进行充电和维护的方法。 该方法包括启用延续模式的步骤; 确定电池的电位是否小于或基本上等于预定充电水平; 当电池与电源连接时，为电池充电; 并且将电池的电位保持在预定电池电平的预定电池电平，其中预定电池电量被设定为电池的全部容量的大约50％至70％。