Abstract:
A representative embodiment of the invention provides an infrared (IR) imaging system adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates, (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object.
Abstract:
A representative embodiment of the invention provides an infrared (IR) imaging system adapted to (i) convert an IR image of an object into mechanical displacements of a plurality of movable plates, (ii) use the mechanical displacements to impart a corresponding spatial phase modulation pattern onto a beam of visible light, and (iii) apply spatial filtering to convert the spatial phase modulation pattern into a visible image of the object.
Abstract:
A representative embodiment of the invention provides an infrared (IR) detector having a movable plate supported at an offset distance from a substrate by a suspension arm. In response to a temperature difference between the plate and the substrate generated by the incident IR radiation, the suspension arm deforms and changes the offset distance for the plate. In one embodiment, the suspension arm has three rod-shaped bimorph transducers that lie within a plane that is parallel to the substrate. The transducers are also parallel to one another, with the transducer that is attached to an anchor of the suspension arm being located between the two transducers that are attached to the plate.
Abstract:
A micro-electro-mechanical system (MEMS) actuator device is disclosed. The MEMS actuator device has an actuated element that is rotatably connected to a support structure via torsional members. The torsional members provide a restoring force to keep the actuated element planar to the surface of an underlying substrate. The surface of the substrate has electrodes formed thereon. The electrodes are adapted to receive an electrical potential. When an electrical potential is applied to certain of the electrodes, an electrostatic force is generated which causes the actuated element to rotate out of plane. The electrodes have three components. At least a portion of two of the components is within the tilting area of the actuated element. The third is outside the tilting area of the actuated element. The tilting area is defined as the surface area of the actuated element as projected onto the underlying substrate.
Abstract:
A micro-electro-mechanical (MEM) optical device having a reduced footprint for increasing yield on a substrate. The MEM device includes an optical element having an outer edge and supported by a support structure disposed on a substrate. The support structure is mechanically connected to the substrate through first and second pairs of beams which move the structure to an active position for elevating the optic device above the substrate. When in an elevated position, the optical device can be selectively tilted for deflecting optic signals. The beams are connected at one end to the support structure, at the other end to the substrate and are disposed so that the first and second beam ends are located proximate the optical device outer edge. In a preferred embodiment, a stiction force reducing element is included on the outer edge of the optical device for reducing the contact area between the optic device edge and the substrate.
Abstract:
As discussed herein, there is presented an apparatus comprising micro-posts. The apparatus includes a substrate having a planar surface, a plurality of micro-posts located on the planar surface, wherein each micro-post has a base portion on the planar surface and a post portion located on a top surface of the corresponding base portion, and wherein side surfaces of the base portions intersect the planar surface at oblique angles.
Abstract:
As discussed herein, there is presented an apparatus comprising micro-posts. The apparatus includes a substrate having a planar surface, a plurality of micro-posts located on the planar surface, wherein each micro-post has a base portion on the planar surface and a post portion located on a top surface of the corresponding base portion, and wherein side surfaces of the base portions intersect the planar surface at oblique angles.
Abstract:
A representative embodiment of the invention provides an infrared (IR) detector having a movable plate supported at an offset distance from a substrate by a suspension arm. In response to a temperature difference between the plate and the substrate generated by the incident IR radiation, the suspension arm deforms and changes the offset distance for the plate. In one embodiment, the suspension arm has three rod-shaped bimorph transducers that lie within a plane that is parallel to the substrate. The transducers are also parallel to one another, with the transducer that is attached to an anchor of the suspension arm being located between the two transducers that are attached to the plate.
Abstract:
A radio frequency circuit structure for transmitting radio signals includes a lower guide portion having a plurality of photocurable layers deposited on a substrate and an upper guide portion interfacing with the lower guide portion to define a guiding geometry. The upper guide portion may also include a plurality of photocurable layers deposited on a second substrate. A method for fabricating the radio frequency circuit structure includes depositing the plurality of photocurable layers on the substrate. A portion of each photocurable layer of the plurality of photocurable layers is exposed to ultraviolet light to form a latent image. The plurality of photocurable layers is developed to remove the portions not exposed to ultraviolet light to form a guide portion. The guide portion may be metalized and closed to form a guiding geometry. A lower guide portion may be closed by an upper guide portion formed in substantially the same manner as the lower guide portion.
Abstract:
An optical communication system comprising first and second planar substrates and an alignment assembly. The first substrate of a semiconductor material, is located on a planar surface of a sub-mount and having a planar first edge. The second substrate of a different second material, is located on said planar surface of said sub-mount and having a planar second edge. The alignment assembly is located on said sub-mount, said alignment assembly including rigid standoff structures configured to fixedly vertically align said first and second edges above said sub-mount such that each optical output of one of said lasers is vertically aligned with the end of one of said light-guiding structures.