公开(公告)号：US20190261531A1

公开(公告)日：2019-08-22

申请号：US16404854

申请日：2019-05-07

Applicant: Delta Electronics,Inc.

Inventor： Le LIANG ,  Zhenqing ZHAO

IPC: H05K7/14 ,  H01L25/07

Abstract: A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

公开(公告)号：US20180082980A1

公开(公告)日：2018-03-22

申请号：US15826714

申请日：2017-11-30

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le LIANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H01L25/065 ,  H01L23/495 ,  H01L23/433 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49555 ,  H01L23/49575 ,  H01L25/0657

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

公开(公告)号：US20160358837A1

公开(公告)日：2016-12-08

申请号：US15071215

申请日：2016-03-16

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le LIANG ,  Shou-Yu HONG ,  Zhen-Qing ZHAO

IPC: H01L23/367 ,  H01L23/31 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498 ,  H01L23/29 ,  H01L21/56

CPC classification number: H01L25/0655 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49555 ,  H01L23/49575 ,  H01L25/0657

Abstract: A package module includes a power module, a first thermal dissipating component and a packaging plastic. The power module includes a substrate and at least one power semiconductor component disposed on the substrate. The first thermal dissipating component is disposed over the power module. The packaging plastic covers the power module and the first thermal dissipating component, wherein a portion of the first thermal dissipating component is exposed from the packaging plastic.

Abstract translation: 封装模块包括电源模块，第一散热元件和封装塑料。 功率模块包括基板和设置在基板上的至少一个功率半导体部件。 第一散热部件设置在功率模块上。 包装塑料覆盖电源模块和第一散热部件，其中第一散热部件的一部分从包装塑料露出。

公开(公告)号：US20170112001A1

公开(公告)日：2017-04-20

申请号：US15291155

申请日：2016-10-12

Applicant: DELTA ELECTRONICS,INC.

Inventor： Le LIANG ,  Zhenqing ZHAO

IPC: H05K5/00 ,  H05K7/14 ,  H05K5/02

CPC classification number: H05K7/1432 ,  H01L25/07 ,  H01L2224/48247

Abstract: Disclosed is a stack structure and its manufacturing method. The stack structure includes at least two stacked modules, wherein at least one of the modules is a power module; at least one metal connection component which is in integrated structure and comprises a first end, a second end and a connection portion with the first end being electrically connected to one of the modules and the second end being electrically connected to the other module; at least one molding compound packaging the at least one module and the end of the metal connection component which is electrically connected to the module, respectively.

公开(公告)号：US20170025379A1

公开(公告)日：2017-01-26

申请号：US15209777

申请日：2016-07-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le LIANG ,  Kai LU ,  Zhen-Qing ZHAO ,  Zeng LI

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L23/3114 ,  H01L23/49838 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/16227 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/13091 ,  H01L2924/15747

Abstract: A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.

Abstract translation: 功率模块封装包括单层电路板，第一电子部件和第二电子部件。 单层电路板包括绝缘基板和导电层。 导电层的底表面接触绝缘基板的顶表面。 绝缘基板具有多个第一开口，以允许导电层从绝缘基板的底表面露出。 第一电子部件设置在导电层的顶表面上。 第二电子部件设置在绝缘基板的底面上并被接收在第一开口内。 第二电子部件经由第一开口连接到导电层。 第一电子部件和第二电子部件中的至少一个是裸模。

公开(公告)号：US20160381785A1

公开(公告)日：2016-12-29

申请号：US15081365

申请日：2016-03-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Tao WANG ,  Le LIANG

IPC: H05K1/02 ,  H01L25/065 ,  H01L23/31 ,  H01L23/367 ,  H05K1/11 ,  H01L23/495

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

Abstract translation: 一种成型型电力模块包括：引线框，包括第一步骤和第二步骤; 第一平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第一台阶; 以及第二平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第二台阶，其中，所述第一平面功率器件的第一表面和所述第一表面的第一表面 第二平面功率器件彼此面对，其垂直方向上的投影面积至少部分重叠，并且第一平面功率器件至少具有与第二平面功率器件的电极电连接的一个电极。

公开(公告)号：US20160254217A1

公开(公告)日：2016-09-01

申请号：US14918837

申请日：2015-10-21

Applicant: Delta Electronics, Inc.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Shouyu HONG ,  Tao WANG ,  Le LIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

Abstract translation: 本公开公开了一种功率转换电路的封装模块及其制造方法。 电源转换电路的封装模块可表面安装在系统板上。 功率转换电路的封装模块包括：基板，功率器件模具，模制层和多个引脚。 基板具有金属层，绝缘基板层和导热层。 绝缘基板层设置在金属层与导热层之间。 功率器件管芯耦合到金属层。 衬底的金属层上的器件嵌入成型层中。 多个引脚电耦合到金属层并且嵌入到模制层中，电耦合到系统板的每个引脚的至少接触表面被暴露，并且接触表面平行和/或垂直于 导热层。 具有这种结构的封装模块占地面积小，便于批量生产。