公开(公告)号：US20170012030A1

公开(公告)日：2017-01-12

申请号：US15151730

申请日：2016-05-11

Applicant: DELTA ELECTRONICS,INC.

Inventor： Tao WANG ,  Zhenqing ZHAO ,  Zeng LI ,  Kai LU

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/498 ,  H01L25/07

CPC classification number: H01L25/162 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/12035 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13023 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1426 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The present disclosure provides a power module with the integration of a control circuit at least, including: a power substrate; a power device mounted on the power substrate; and at least one control substrate which supports the control circuit, is electrically connected with the power substrate and disposed at an angle of inclination on a surface of the power substrate on which the power device is mounted; wherein the angle of inclination is greater than or equal to 45 degrees and smaller than or equal to 135 degrees. In the power module provided by the present disclosure, only the power substrate as well as the connections between the control substrate and the power substrate occupies the footprint area of the power module, and thus the horizontal footprint area of the power module is effectively reduced and thereby the power density of the power module is increased.

Abstract translation: 本公开提供了一种至少具有集成控制电路的功率模块，包括：功率基板; 安装在电源基板上的电源装置; 并且至少一个支撑所述控制电路的控制基板与所述电力基板电连接并且以与所述电力设备安装在所述电力基板上的倾斜角成角度地配置; 其中所述倾斜角度大于或等于45度且小于或等于135度。 在本公开提供的功率模块中，仅功率基板以及控制基板与功率基板之间的连接占据功率模块的覆盖区域，因此有效地减小了功率模块的水平占用面积， 从而增加了功率模块的功率密度。

公开(公告)号：US20160254218A1

公开(公告)日：2016-09-01

申请号：US15051852

申请日：2016-02-24

Applicant: DELTA ELECTRONICS,INC.

Inventor： Shouyu HONG ,  Kai LU ,  Zhenqing ZHAO

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/97 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

Abstract: The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate.

Abstract translation: 本公开公开了一种功率转换电路的封装模块及其制造方法。 电力转换电路的封装模块包括基板，成形层和多个销。 功率器件组装在衬底上，多个引脚电连接到功率器件，成型层用功率器件覆盖衬底的表面，并且至少一个引脚的接触表面被配置为电连接外部 电路暴露。 成型层包括主帽体部和帽帽部，主帽体部和帽帽部形成帽状成型层，帽帽部用于增加爬电距离 位于模制层顶部的销的接触表面与基底的底部之间。

公开(公告)号：US20170025379A1

公开(公告)日：2017-01-26

申请号：US15209777

申请日：2016-07-14

Applicant: DELTA ELECTRONICS, INC.

Inventor： Le LIANG ,  Kai LU ,  Zhen-Qing ZHAO ,  Zeng LI

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L23/3114 ,  H01L23/49838 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/16227 ,  H01L2924/1033 ,  H01L2924/1205 ,  H01L2924/13091 ,  H01L2924/15747

Abstract: A power module package includes a single-layered circuit board, a first electronic component, and a second electronic component. The single-layered circuit board includes an insulating substrate and a conductive layer thereon. A bottom surface of the conductive layer touches a top surface of the insulating substrate. The insulating substrate has plural first openings to allow the conductive layer to be exposed from the bottom surface of the insulating substrate. The first electronic component is disposed on a top surface of the conductive layer. The second electronic component is disposed on the bottom surface of the insulating substrate and received in the first openings. The second electronic component is connected to the conductive layer via the first openings. At least one of the first electronic component and the second electronic component is a bare die.

Abstract translation: 功率模块封装包括单层电路板，第一电子部件和第二电子部件。 单层电路板包括绝缘基板和导电层。 导电层的底表面接触绝缘基板的顶表面。 绝缘基板具有多个第一开口，以允许导电层从绝缘基板的底表面露出。 第一电子部件设置在导电层的顶表面上。 第二电子部件设置在绝缘基板的底面上并被接收在第一开口内。 第二电子部件经由第一开口连接到导电层。 第一电子部件和第二电子部件中的至少一个是裸模。

公开(公告)号：US20160381785A1

公开(公告)日：2016-12-29

申请号：US15081365

申请日：2016-03-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Tao WANG ,  Le LIANG

IPC: H05K1/02 ,  H01L25/065 ,  H01L23/31 ,  H01L23/367 ,  H05K1/11 ,  H01L23/495

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

Abstract translation: 一种成型型电力模块包括：引线框，包括第一步骤和第二步骤; 第一平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第一台阶; 以及第二平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第二台阶，其中，所述第一平面功率器件的第一表面和所述第一表面的第一表面 第二平面功率器件彼此面对，其垂直方向上的投影面积至少部分重叠，并且第一平面功率器件至少具有与第二平面功率器件的电极电连接的一个电极。

公开(公告)号：US20160254217A1

公开(公告)日：2016-09-01

申请号：US14918837

申请日：2015-10-21

Applicant: Delta Electronics, Inc.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Shouyu HONG ,  Tao WANG ,  Le LIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

Abstract translation: 本公开公开了一种功率转换电路的封装模块及其制造方法。 电源转换电路的封装模块可表面安装在系统板上。 功率转换电路的封装模块包括：基板，功率器件模具，模制层和多个引脚。 基板具有金属层，绝缘基板层和导热层。 绝缘基板层设置在金属层与导热层之间。 功率器件管芯耦合到金属层。 衬底的金属层上的器件嵌入成型层中。 多个引脚电耦合到金属层并且嵌入到模制层中，电耦合到系统板的每个引脚的至少接触表面被暴露，并且接触表面平行和/或垂直于 导热层。 具有这种结构的封装模块占地面积小，便于批量生产。

公开(公告)号：US20160113107A1

公开(公告)日：2016-04-21

申请号：US14819446

申请日：2015-08-06

Applicant: DELTA ELECTRONICS, INC.

Inventor： Tao WANG ,  Zhen-Qing ZHAO ,  Kai LU ,  Zheng-Fen WAN ,  Hai-Bin XU

IPC: H05K1/02

CPC classification number: H01L24/00 ,  H01L2224/32225 ,  H01L2224/33 ,  H05K3/3431 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2201/2036 ,  Y02P70/613

Abstract: The disclosure discloses a power module. The power module includes a substrate, a power chip, a bonding material, and at least one spacer. The substrate includes a circuit-patterned layer. The power chip bonded to the circuit-patterned layer by the bonding material. The spacer is located between the circuit-patterned layer and the power chip, so as to keep the power chip away from the circuit-patterned layer in a distance.

Abstract translation: 本公开公开了一种电源模块。 功率模块包括基板，功率芯片，接合材料和至少一个间隔件。 衬底包括电路图案层。 功率芯片通过接合材料结合到电路图案层。 间隔物位于电路图案层和功率芯片之间，以便将功率芯片远离电路图案层远离。