公开(公告)号：US09650522B2

公开(公告)日：2017-05-16

申请号：US14762789

申请日：2014-01-16

Applicant: DIC Corporation

Inventor： Wataru Fujikawa ,  Jun Shirakami ,  Akira Murakawa ,  Yukie Saitou

IPC: H05K1/09 ,  C09D11/102 ,  B41J2/01 ,  C09D11/52 ,  B41M5/52 ,  H05K3/12 ,  H05K3/18

CPC classification number: C09D11/102 ,  B32B2307/202 ,  B32B2307/4026 ,  B32B2307/75 ,  B32B2457/00 ,  B32B2457/08 ,  B32B2457/20 ,  B41J2/01 ,  B41M5/5263 ,  C09D11/52 ,  H05K1/092 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/182 ,  H05K2203/0709

Abstract: The present invention provides an absorbing-layer-forming composition including a blocked isocyanate such that the amount of the blocked isocyanate is 50% by mass to 100% by mass of the solid content of the absorbing-layer-forming composition and an absorbing substrate, a printed item, and a conductive pattern that are formed using the absorbing-layer-forming composition. The absorbing-layer-forming composition according to the present invention can be used for forming an absorbing layer which is capable of carrying a fluid such as an ink therein and which enables good adhesion between various types of supports and a conductive layer to be achieved. In particular, using a blocked isocyanate having a number-average molecular weight of 1,000 to 5,000 further increases the adhesion between various types of supports and the conductive layer.

公开(公告)号：US09629253B2

公开(公告)日：2017-04-18

申请号：US14441605

申请日：2014-03-06

Applicant: DIC Corporation

Inventor： Sunao Yoshihara ,  Haruhiko Katsuta ,  Yoshinori Katayama ,  Jun Shirakami ,  Akira Murakawa ,  Wataru Fujikawa ,  Yukie Saitou

IPC: B05D5/12 ,  H05K3/18 ,  C23C18/30 ,  H05K1/02 ,  H05K3/20

CPC classification number: H05K3/182 ,  C23C18/30 ,  H05K1/02 ,  H05K3/207 ,  H05K2203/0108 ,  H05K2203/0709 ,  H05K2203/097

Abstract: Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

公开(公告)号：US20220363852A1

公开(公告)日：2022-11-17

申请号：US17767168

申请日：2020-09-17

Applicant: DIC Corporation

Inventor： Wataru Fujikawa ,  Akihiro Iwamoto ,  Jun Shirakami

IPC: C08J7/04 ,  C23C18/38 ,  C23C28/02 ,  C25D3/38 ,  C09D5/00 ,  C09D123/12 ,  C09D123/28 ,  C08J7/043 ,  C08J7/044 ,  H05K1/03

Abstract: A laminate that includes a substrate made of a polyolefin-based resin and is excellent in adhesion between the substrate and a metal plating layer is provided in a simple manner without roughening the surface of the substrate. In addition, a molded article, a printed wring board, and an electromagnetic wave shield using the laminate using the same are provided. Used is a laminate configured such that on a substrate (A) made of a polyolefin-based resin (a), a primer layer (B) containing a polyolefin-based resin (b) that is organic solvent soluble or water dispersible, a metal particle layer (C), and a metal plating layer (D) are sequentially laminated.

公开(公告)号：US20150068907A1

公开(公告)日：2015-03-12

申请号：US14389688

申请日：2013-03-28

Applicant: DIC Corporation

Inventor： Wataru Fujikawa ,  Yukie Saitou ,  Akira Murakawa ,  Jun Shirakami

IPC: H05K1/02 ,  H05K3/02 ,  C25D3/02 ,  H05K3/38 ,  H05K1/09 ,  H05K3/18

CPC classification number: H05K1/0296 ,  C09D11/322 ,  C09D11/52 ,  C23C18/1658 ,  C23C18/1879 ,  C23C18/1893 ,  C23C18/206 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/38 ,  C25D3/02 ,  C25D3/38 ,  H05K1/092 ,  H05K3/022 ,  H05K3/188 ,  H05K3/385 ,  H05K2203/0315 ,  H05K2203/0786

Abstract: It is an object of the present invention to provide a laminate, such as a conductive pattern, having an excellent adhesion at the interfaces between a layer that serves as a support and a conductive layer containing a conductive material and between the conductive layer and a plating layer. The present invention provides a laminate at least including a support layer (I), a conductive layer (II) having an oxidized surface, and a plating layer (III) formed on the oxidized surface of the conductive layer (II); the present invention also provides a conductive pattern and electric circuit each including such a laminate.

Abstract translation: 本发明的目的是提供一种层压体，例如导电图案，其在用作载体的层和包含导电材料的导电层之间以及导电层和镀层之间的界面处具有优异的粘附性 层。 本发明提供一种至少包括支撑层（I），具有氧化表面的导电层（II）和形成在导电层（II）的氧化表面上的镀层（III））的层压体; 本发明还提供了各自包括这种层压体的导电图案和电路。

公开(公告)号：US20150060132A1

公开(公告)日：2015-03-05

申请号：US14388700

申请日：2013-03-08

Applicant: DIC Corporation

Inventor： Akira Murakawa ,  Jun Shirakami ,  Wataru Fujikawa ,  Yukie Saitou

IPC: H05K1/09 ,  H05K9/00 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K9/0086 ,  H01L21/288 ,  H01L21/321 ,  H01L23/5328 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/097 ,  H05K3/1208 ,  H05K3/246 ,  H05K3/389 ,  H05K3/4644 ,  H05K9/0081 ,  H05K2203/0723 ,  H01L2924/00

Abstract: An object to be achieved by the present invention is to provide a conductive pattern having such a level of adhesion that a conductive layer containing a conductive substance such as silver does not separate from a primer layer with time. The present invention relates to a conductive pattern including a conductive layer (A) containing a compound (a1) having a basic nitrogen atom-containing group and a conductive substance (a2); a primer layer (B) containing a compound (b1) having a functional group [X]; and a substrate layer (C), the conductive layer (A), the primer layer (B), and the substrate layer (C) being stacked, in which a bond is formed by reacting the basic nitrogen atom-containing group of the compound (a1) contained in the conductive layer (A) with the functional group [X] of the compound (b1) contained in the primer layer (B).

Abstract translation: 通过本发明要实现的目的是提供一种具有如此粘合程度的导电图案，使得含有诸如银的导电物质的导电层随时间不会与底漆层分离。 本发明涉及包含含有具有碱性氮原子基团的化合物（a1）和导电物质（a2）的导电层（A）的导电图案。 含有具有官能团[X]的化合物（b1）的底漆层（B） 和层叠基板层（C），导电层（A），底涂层（B）和基板层（C），其中通过使化合物的碱性含氮原子基团 （B）中含有的化合物（b1）的官能团[X]的导电层（A）中含有的（a1）。

公开(公告)号：US10470312B2

公开(公告)日：2019-11-05

申请号：US14769574

申请日：2014-03-06

Applicant: DIC CORPORATION

Inventor： Sunao Yoshihara ,  Haruhiko Katsuta ,  Yoshinori Katayama ,  Jun Shirakami ,  Akira Murakawa ,  Wataru Fujikawa ,  Yukie Saitou

IPC: C25D5/02 ,  H05K3/18 ,  C25D5/56 ,  C25D7/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

公开(公告)号：US09380701B2

公开(公告)日：2016-06-28

申请号：US14775576

申请日：2014-03-06

Applicant: DIC Corporation

Inventor： Akira Murakawa ,  Jun Shirakami ,  Wataru Fujikawa ,  Yukie Saitou

IPC: H05K1/09 ,  H05K3/12 ,  B32B7/02 ,  B32B27/00 ,  G06K19/077 ,  H05K1/02 ,  H05K1/03 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

CPC classification number: H05K1/092 ,  B32B7/02 ,  B32B27/00 ,  G06K19/07722 ,  H05K1/0298 ,  H05K1/0346 ,  H05K3/1208 ,  H05K3/1283 ,  H05K3/181 ,  H05K3/246 ,  H05K3/386 ,  H05K2201/0154

Abstract: Provided is a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract translation: 本发明提供一种层叠体，其中层叠至少一层包含载体，底漆层，第一导电层，绝缘层和第二导电层的层，其中绝缘层通过涂覆至少一部分或全部 的第一导电层的表面用树脂组合物干燥树脂组合物; 并且第二导电层包括通过用含有导电物质的流体涂覆绝缘层的表面的一部分或整体而形成的第二电镀种子层，以及形成在第二镀覆种子层的表面上的第二镀层。 该层压板在层间具有高粘合性，并且即使在暴露于高温高湿环境下也能够保持高粘合性。

公开(公告)号：US09374895B2

公开(公告)日：2016-06-21

申请号：US14762783

申请日：2014-01-21

Applicant: DIC Corporation

Inventor： Akira Murakawa ,  Jun Shirakami ,  Wataru Fujikawa ,  Yukie Saitou

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H05K3/24 ,  H05K3/38 ,  C09D5/00

CPC classification number: H05K1/092 ,  C08J7/045 ,  C08J2379/08 ,  C08J2475/04 ,  C08J2475/14 ,  C09D5/00 ,  H05K1/0393 ,  H05K3/246 ,  H05K3/386 ,  H05K3/4664 ,  Y10T428/12549

Abstract: The present invention provides a laminate in which at least a layer including a support, a primer layer, a first conductive layer, an insulating layer, and a second conductive layer are laminated, wherein the insulating layer is formed by coating at least a portion of or entirety of a surface of the first conductive layer with a resin composition and drying the resin composition; and the second conductive layer includes a second plating seed layer formed by coating a portion of or entirety of a surface of the insulating layer with a fluid containing a conductive substance, and a second plating layer formed on a surface of the second plating seed layer. This laminate has high adhesion between layers and allows the high adhesion to be maintained even upon exposure to a high-temperature and high-humidity environment.

Abstract translation: 本发明提供一种叠层体，其中层叠至少一层包括载体，底漆层，第一导电层，绝缘层和第二导电层的层，其中绝缘层通过涂覆至少一部分 或整个第一导电层的表面与树脂组合物并干燥树脂组合物; 并且第二导电层包括通过用含有导电物质的流体涂覆绝缘层的表面的一部分或整体而形成的第二电镀种子层，以及形成在第二镀覆种子层的表面上的第二镀层。 该层压板在层间具有高粘合性，并且即使在暴露于高温高湿环境下也能够保持高粘合性。

公开(公告)号：US20150289383A1

公开(公告)日：2015-10-08

申请号：US14441605

申请日：2014-03-06

Applicant: DIC Corporation

Inventor： Sunao Yoshihara ,  Haruhiko Katsuta ,  Yoshinori Katayama ,  Jun Shirakami ,  Akira Murakawa ,  Wataru Fujikawa ,  Yukie Saitou

IPC: H05K3/18 ,  H05K1/02

CPC classification number: H05K3/182 ,  C23C18/30 ,  H05K1/02 ,  H05K3/207 ,  H05K2203/0108 ,  H05K2203/0709 ,  H05K2203/097

Abstract: Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern.

Abstract translation: 提供一种形成高分辨率金属图案的方法，其包括以下步骤：（1）通过用包含重均分子量为5000的聚氨酯树脂的树脂组合物涂布基材在基底上形成接收层，或 更多或者乙烯基树脂和介质，（2）通过反向胶版印刷在接收层上印刷包括用作电镀芯的颗粒的油墨在接收层上形成电镀芯图案，以及（3） 通过无电解镀覆在电镀芯图案上的金属，通过上述方法形成的高清金属图案，以及包括高分辨率金属图案的电子部件。