公开(公告)号：US20090189288A1

公开(公告)日：2009-07-30

申请号：US12357453

申请日：2009-01-22

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC分类号： H01L23/49

CPC分类号： B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

摘要： A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

摘要翻译： 描述了一种方法，其具有提供具有多个可焊接位置的表面的步骤; 使用电线毛细管工具将导线接合到每个可焊接位置; 控制毛细管工具相对于基底的位置; 在将导线形成线接合位置之后，当毛细管工具远离表面移动毛细管工具相对于表面移动时，形成具有预定形状的导线。

公开(公告)号：US07495342B2

公开(公告)日：2009-02-24

申请号：US10736890

申请日：2003-12-16

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

摘要： A method is described having the steps of providing a surface having a plurality of wire bondable locations, wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

摘要翻译： 描述了一种方法，其具有提供具有多个可焊接位置的表面的步骤，使用线毛细管工具将导线引导到每个可接合线的位置; 控制毛细管工具相对于基底的位置; 在将导线形成线接合位置之后，当毛细管工具远离表面移动毛细管工具相对于表面移动时，形成具有预定形状的导线。

公开(公告)号：US20080164896A1

公开(公告)日：2008-07-10

申请号：US12052823

申请日：2008-03-21

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Daniel Peter Morris ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Yun-Hsin Liao ,  Daniel Peter Morris ,  Da-Yuan Shih

IPC分类号： G01R1/073

CPC分类号： G01R1/07307 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/06772 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/78301 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1627 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention is directed to structures having a plurality of discrete insulated elongated electrical conductors projecting from a support surface which are useful as probes for testing of electrical interconnections to electronic devices, such as integrated circuit devices and other electronic components and particularly for testing of integrated circuit devices with rigid interconnection pads and multi-chip module packages with high density interconnection pads and the apparatus for use thereof and to methods of fabrication thereof. Coaxial probe structures are fabricated by the methods described providing a high density coaxial probe.

摘要翻译： 本发明涉及具有从支撑表面突出的多个离散绝缘细长电导体的结构，其可用作用于测试电子装置（例如集成电路装置和其它电子部件）的电互连的探针，特别是用于集成 具有刚性互连焊盘的电路装置和具有高密度互连焊盘的多芯片模块封装以及其使用的装置及其制造方法。 通过提供高密度同轴探针的方法制造同轴探针结构。

公开(公告)号：US20080117612A1

公开(公告)日：2008-05-22

申请号：US11929991

申请日：2007-10-30

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： H05K7/06 ,  H05K1/02 ,  G01R31/26

CPC分类号： G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080117611A1

公开(公告)日：2008-05-22

申请号：US11929853

申请日：2007-10-30

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： H05K7/06 ,  H05K1/02 ,  G01R31/26

CPC分类号： G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US20080112149A1

公开(公告)日：2008-05-15

申请号：US11930016

申请日：2007-10-30

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： H05K7/06 ,  H05K1/02 ,  G01R31/26

CPC分类号： G01R1/0735 ,  G01R1/06744 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07378 ,  G01R3/00

摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

公开(公告)号：US06526655B2

公开(公告)日：2003-03-04

申请号：US09871536

申请日：2001-05-31

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC分类号： H01R900

CPC分类号： B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

摘要： A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

摘要翻译： 描述了一种方法，其具有提供具有多个可焊接位置的表面的步骤; 使用电线毛细管工具将导线接合到每个可焊接位置; 控制毛细管工具相对于基底的位置; 在将导线形成线接合位置之后，当毛细管工具远离表面移动毛细管工具相对于表面移动时，形成具有预定形状的导线。

公开(公告)号：US06300780B1

公开(公告)日：2001-10-09

申请号：US09088394

申请日：1998-06-01

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Maurice Heathcote Norcott ,  Da-Yuan Shih ,  George Frederick Walker

IPC分类号： G01R3102

CPC分类号： G01R1/07371 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

摘要： A high density test probe for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transfer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

摘要翻译： 用于测试晶圆形式的高密度和高性能集成电路或分立芯片的高密度测试探头。 测试探针由嵌入柔性或高模量弹性体材料的细长电导体的密集阵列形成。 使用陶瓷集成电路芯片封装基板等标准封装基板来提供空间变压器。 电线被连接到空间变压器表面上的接触焊盘阵列。 由多层集成电路芯片封装基板形成的空间传输。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并与空间变压器电接触的线阵列。 空间变压器可以具有一个引脚阵列，它们在空间变压器的与细长导体所接合的相反的表面上。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。

公开(公告)号：US06295729B1

公开(公告)日：2001-10-02

申请号：US09164470

申请日：1998-10-01

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC分类号： H01R900

CPC分类号： B23K20/007 ,  B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07307 ,  G01R1/07371 ,  G01R3/00 ,  H01L21/4853 ,  H01L21/4896 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1134 ,  H01L2224/13016 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49194 ,  Y10T29/4921 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/00012

摘要： A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.

公开(公告)号：US06206273B1

公开(公告)日：2001-03-27

申请号：US09251864

申请日：1999-02-17

申请人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

发明人： Brian Samuel Beaman ,  Keith Edward Fogel ,  Paul Alfred Lauro ,  Da-Yuan Shih

IPC分类号： B23K3100

CPC分类号： G01R1/0675 ,  G01R1/07314 ,  G01R3/00 ,  Y10T29/4914

摘要： The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are formed by cutting with one or more blades. The shape of the blades determines the shape of the probetips. The probetips can be coated with other conductive materials to enhance the hardness and profile of protuberances formed at the probetip ends by the blade-cutting process. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer. The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.

摘要翻译： 本发明涉及一种高密度测试探针，其提供用于测试晶片形式的高密度和高性能集成电路或作为离散芯片的装置。 测试探针由细长电导体的密集阵列形成，其通过用一个或多个刀片切割形成。 叶片的形状决定了先兆的形状。 可以使用其他导电材料涂覆先知，以通过叶片切割工艺增强在突齿端部处形成的突起的硬度和轮廓。 电线与接触位置阵列一样密集。 围绕着向外突出的线的阵列设置模具。 液体弹性体设置在模具中以填充电线之间的空间。 弹性体被固化并且模具被去除，留下布置在弹性体中并与空间变压器电接触的线阵列。 空间变压器可以具有一个引脚阵列，它们在空间变压器的与细长导体所接合的相反的表面上。 这些销插入第二空间变压器（例如印刷电路板）上的插座中以形成探针组件。 或者，插入器电连接器可以设置在第一和第二空间变压器之间。