公开(公告)号：US20210047497A1

公开(公告)日：2021-02-18

申请号：US17081446

申请日：2020-10-27

Applicant: Daikin Industries, LTD.

Inventor： Hirokazu KOMORI ,  Junpei TERADA ,  Hiroyuki SENDAN ,  Tadahiro YABU ,  Yukihiro FUKAGAWA ,  Kenta MURAYAMA ,  Tomohiro SHIROMARU ,  Toshio MIYATANI ,  Masahiro KONDOU ,  Hiroyuki HAMADA

IPC: C08K3/36 ,  B29C64/153 ,  B29C64/314 ,  B33Y70/00

Abstract: A shaping material for a powder bed fusion method, including a powder of a fluororesin, wherein the fluororesin has a D50 of 30 μm or more and 200 μm or less, and the fluororesin has a D10 of 12 μm or more.

公开(公告)号：US20240215161A1

公开(公告)日：2024-06-27

申请号：US18600472

申请日：2024-03-08

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hirokazu KOMORI ,  Hiroyuki YOSHIMOTO ,  Masaji KOMORI ,  Yuki UEDA ,  Junpei TERADA

IPC: H05K1/03 ,  B32B5/02 ,  B32B15/082 ,  B32B15/20 ,  B32B17/10 ,  B32B27/12 ,  B32B27/20 ,  B32B27/32 ,  C08F214/26 ,  C08J5/18 ,  C08K3/36 ,  C08K7/18

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/024 ,  B32B15/082 ,  B32B15/20 ,  B32B17/10 ,  B32B27/12 ,  B32B27/20 ,  B32B27/322 ,  C08F214/262 ,  C08J5/18 ,  C08K3/36 ,  C08K7/18 ,  B32B2262/101 ,  B32B2264/1021 ,  B32B2457/08 ,  C08F2800/10 ,  C08J2327/18 ,  H05K2201/015

Abstract: A laminate, including a fluororesin sheet; and a base material. The fluororesin sheet including a fluororesin composition containing: a melt moldable fluororesin; and a silica. The fluororesin is a tetrafluoroethylene-perfluoro(alkyl vinyl ether) copolymer and/or a tetrafluoroethylene-hexafluoropropylene copolymer having 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; a blending ratio of the spherical silica to a total amount of the fluororesin and the silica is 50% by mass or higher and 70% by mass or lower; the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower and a melt flow rate (MFR) of 1.0 g/10 min or higher and 30 g/10 min or lower. Also disclosed is a substrate for circuits including the fluororesin sheet used as a part in a multilayer structure.

公开(公告)号：US20240092061A1

公开(公告)日：2024-03-21

申请号：US18495857

申请日：2023-10-27

Applicant: THE UNIVERSITY OF TOKYO ,  DAIKIN INDUSTRIES, LTD.

Inventor： Keisuke NAGATO ,  Kota AONO ,  Yusuke EBIHARA ,  Masayuki NAKAO ,  Yuki UEDA ,  Shingo OKUNO ,  Hirokazu KOMORI ,  Akiyoshi YAMAUCHI ,  Yosuke KISHIKAWA

IPC: B32B15/08 ,  B32B15/20

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B2307/50 ,  B32B2311/12 ,  B32B2398/10

Abstract: A joined article including: a resin (1) having a linear expansion coefficient at 30° C. to 200° C. of 17 ppm/° C. or higher and a thickness of 5 to 100 μm; and a metal joined to a surface of the resin (1) and having a thickness of 5 to 50 μm. The resin (1) includes a heat-affected layer that is close to the metal and that occupies 80% or less of the thickness of the resin (1), and the joined article is a dielectric material for a substrate. Also disclosed is a substrate including the joined article and a resin (2) stacked on the joined article.

公开(公告)号：US20250145781A1

公开(公告)日：2025-05-08

申请号：US19018051

申请日：2025-01-13

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Masahiko KAWAMURA ,  Tatsuya HIGUCHI ,  Kenzo TAKAHASHI ,  Hirokazu KOMORI ,  Hideaki TENKAJI ,  Junpei TERADA ,  Nobuyuki KOMATSU

IPC: C08J5/18 ,  B32B15/082

Abstract: Provided is a fluororesin film with high uniformity in adhesion strength of the film. A fluororesin film that is a film comprising a fluororesin-containing composition, wherein at least one surface of the fluororesin film has an average value of contact angles for water measured at 5 points with intervals of 100 mm in a travel direction of 105° or less and an average value of contact angles for n-hexadecane measured at 5 points with intervals of 100 mm in the travel direction of 45° or less at locations of center and 100 mm from respective left and right ends.

公开(公告)号：US20230167269A1

公开(公告)日：2023-06-01

申请号：US18094935

申请日：2023-01-09

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hirokazu KOMORI ,  Junpei Terada ,  Hiroyuki Sendan ,  Tadahiro Yabu ,  Yukihiro Fukagawa ,  Kenta Murayama ,  Tomohiro Shiromaru ,  Toshio Miyatani ,  Masahiro Kondou ,  Hiroyuki Hamada

IPC: C08K3/36 ,  B33Y70/00 ,  B29C64/314 ,  B29C64/153 ,  B33Y70/10

CPC classification number: C08K3/36 ,  B29C64/153 ,  B29C64/314 ,  B33Y70/00 ,  B33Y70/10 ,  B29K2027/18

Abstract: A molded body which is formed from a shaping material containing a fluororesin powder. The fluororesin powder has a D50 of 30 µm or more and 200 µm or less and a D10 of 12 µm or more. Also disclosed is a method for forming a molded body from a shaping material containing the fluororesin powder, the method including controlling the temperature of the fluororesin powder; and irradiating the fluororesin powder with a laser at the controlled temperature to fuse the same.

公开(公告)号：US20220135767A1

公开(公告)日：2022-05-05

申请号：US17575695

申请日：2022-01-14

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hirofumi MUKAE ,  Hirokazu KOMORI ,  Masaji KOMORI ,  Hideki KONO ,  Ayane NAKAUE

IPC: C08K3/38 ,  C08F214/26 ,  H05K1/03 ,  B32B15/082 ,  B32B27/20 ,  B32B27/30

Abstract: A resin composition for a circuit board, containing a melt-fabricable fluororesin and a particulate boron nitride. The particulate boron nitride has a ratio (b)/(a) of 1.0 or higher, wherein (a) represents a proportion of particles having a particle size of 14.6 to 20.6 μm and (b) represents a proportion of particles having a particle size of 24.6 to 29.4 μm. Also disclosed is a molded article for a circuit board obtained from the resin composition, a laminate for a circuit board including a metal layer (A1) and a layer (B) obtained from the resin composition, and a circuit board including a metal layer (A2) and a layer (B) obtained from the resin composition.

公开(公告)号：US20210345485A1

公开(公告)日：2021-11-04

申请号：US17279629

申请日：2019-12-24

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Hirokazu KOMORI ,  Hiroyuki YOSHIMOTO ,  Masaji KOMORI ,  Yuki UEDA ,  Junpei TERADA

IPC: H05K1/03 ,  B32B27/32 ,  B32B27/20 ,  B32B15/082 ,  B32B15/20 ,  B32B5/02 ,  B32B27/12 ,  C08F214/26 ,  C08K3/36 ,  C08K7/18 ,  C08J5/18

Abstract: A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

公开(公告)号：US20170231088A1

公开(公告)日：2017-08-10

申请号：US15501949

申请日：2015-08-05

Applicant: NIPPON KAYAKU KABUSHIKI KAISHA ,  DAIKIN INDUSTRIES, LTD.

Inventor： Yasumasa AKATUKA ,  Shigeru MOTEKI ,  Hirokazu KOMORI ,  Takeshi INABA

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/06 ,  H05K1/09

CPC classification number: H05K1/036 ,  B32B7/02 ,  B32B7/04 ,  B32B7/06 ,  B32B15/08 ,  B32B15/082 ,  B32B15/20 ,  B32B27/08 ,  B32B27/12 ,  B32B27/16 ,  B32B27/20 ,  B32B27/285 ,  B32B27/30 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2262/101 ,  B32B2264/101 ,  B32B2264/102 ,  B32B2264/107 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/408 ,  B32B2307/538 ,  B32B2307/732 ,  B32B2307/734 ,  B32B2307/748 ,  B32B2457/00 ,  H05K1/034 ,  H05K1/09 ,  H05K3/06 ,  H05K3/381 ,  H05K3/4644 ,  H05K2201/015 ,  H05K2203/097

Abstract: Provided is a double-sided circuit substrate being a laminate of: a composite material comprising a fluorine resin and a glass cloth; and a copper foil having a two-dimensional roughness Ra in a mat surface (a surface that comes in contact with the resin) of less than 0.2 μm. Ideally, a surface of the fluorine resin has an O content of at least 1.0%, as observed using ESCA.

公开(公告)号：US20250168974A1

公开(公告)日：2025-05-22

申请号：US19028921

申请日：2025-01-17

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Kenzo TAKAHASHI ,  Nobuyuki KOMATSU ,  Tatsuya HIGUCHI ,  Takeshi HAZAMA ,  Mayuko TATEMICHI ,  Hirokazu KOMORI ,  Hideaki TENKAJI ,  Masahiko KAWAMURA

IPC: H05K1/03 ,  C08F214/26

Abstract: Provided is a fluororesin long film that has high uniformity and does not deform when bonded to metal foil. A fluororesin long film including a fluororesin in which the number of unstable functional groups is less than 350 per 1×106 carbon atoms, where a difference between each average film thickness in a travel direction at every 5 mm in a width direction and an average film thickness of entire surface is within 2 μm.

公开(公告)号：US20230265309A1

公开(公告)日：2023-08-24

申请号：US18311305

申请日：2023-05-03

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuki UEDA ,  Shingo OKUNO ,  Hirokazu KOMORI ,  Yasukazu NAKATANI ,  Akiyoshi YAMAUCHI

IPC: C09D127/12 ,  C09D7/47 ,  C09D7/61 ,  H05K1/03

CPC classification number: C09D127/12 ,  C09D7/47 ,  C09D7/61 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/015

Abstract: An aqueous coating material composition containing fluororesin particles (A) that can be melt-molded, further comprising silica particles (B), a non-fluorinated surfactant (C) and water (D), wherein the fluororesin particles (A) have an average particle size of 0.05 to 1000 μm, wherein the silica particles (B) have an average particle size of 0.1 to 20 μm, wherein the fluororesin particles (A) and the silica particles (B) have a blending ratio: Fluororesin particles (A)/Silica particles (B)=10/90 to 90/10 (mass ratio), and wherein a content of fluororesin particles (A) is 15 to 80 mass % relative to 100 mass % of solid content of the coating material. Also disclosed is a coated article including a coating layer formed by applying the aqueous coating material composition.