摘要:
A liquid photocurable composition containing a photopolymerizable polyurethane compound having a repeating unit represented by the following formula: B—[X]n[Y]m—B, where X is represented by the formula: and Y is represented by the formula: —OOCHN—A—NHCOO(R2)—, A is a structural unit derived from a polyisocyanate compound, B is same or different and a structural unit derived from a hydroxy compound having at least one photopolymerizable unsaturated group at molecular terminals respectively and optionally containing an ether linkage, R1 is a structural unit derived from a carboxyl group-containing polyol compound, R2 is a structural unit derived from a polyol compound, n is an integer of 1 to 10, m is an integer of 1 to 10, provided that one X and one Y are bonded to each other, or three or more of X and/or Y are bonded to each other, and optionally containing a photopolymerizable compound other than the photopolymerizable polyurethane compound.
摘要翻译:含有具有由下式表示的重复单元的光聚合性聚氨酯化合物的液体光固化性组合物:B- [X] n [Y] mB,其中X由下式表示:Y由下式表示:-OOCHN-A -NHCOO(R2) - ,A是衍生自多异氰酸酯化合物的结构单元,B相同或不同,并且衍生自在分子末端具有至少一个光聚合性不饱和基团且任选地含有醚键的羟基化合物的结构单元, R1是衍生自含羧基的多元醇化合物的结构单元,R2是来自多元醇化合物的结构单元,n是1〜10的整数,m是1〜10的整数,条件是一个X和一个 Y彼此键合,或者X和/或Y中的三个或更多个彼此键合,并且任选地含有除光聚合性聚氨酯化合物以外的光聚合性化合物。
摘要:
An organic solvent based photocurable resist composition containing a photopolymerizable polyurethane compound having a repeating unit represented by the following formula: B—[X]n[Y]m—B, where X is represented by the formula: and Y is represented by the formula: —OOCHN—A—NHCOO(R2)—, A is a structural unit derived from a polyisocyanate compound, B is same or different and a structural unit derived from a hydroxy compound having at least one photopolymerizable unsaturated group at molecular terminals respectively and optionally containing an ether linkage, R1 is a structural unit derived from a carboxyl group-containing polyol compound, R2 is a structural unit derived from a polyol compound, n is an integer of 1 to 10, m is an integer of 1 to 10, provided that one X and one Y are bonded to each other, or three or more of X and/or Y are bonded to each other.
摘要:
A photosensitive resin composition characterized by comprising (A) a resin having at least one aprotic onium salt represented by the general formula: —COO−·W+ (1) and/or the general formula: (in each of the above general formulas, W+ represents wherein, Z represents a nitrogen atom or phosphorus atom; Y represents a sulfur atom; R1, R2, R3 and R4 each represents an organic group having 1 to 30 carbon atoms), (B) a compound having two or more vinylether groups in a molecule and (C) a compound which generates an acid upon irradiation with actinic energy rays.
摘要:
An inorganic film-forming coating composition prepared by adding a basic compound (B) to a titanium-containing water based solution (A) obtained by reacting a hydrogen peroxide water with at least one titanium compound selected from the group consisting of a hydrolizable titanium compound, a low condensation product of the hydrolizable titanium compound, titanium hydroxide and a low condensation product of the titanium hydroxide; and an inorganic film-forming method by use of the coating composition.
摘要:
The present invention provides a method of forming a conductive pattern, comprising the steps of: (1) depositing a conductive coating-forming resin layer and an energy beam-sensitive coating layer on a substrate in this order; (2) irradiating a surface of the energy beam-sensitive coating layer with an active energy beam or heat rays directly or through a mask, so as to obtain a desired pattern; (3) developing the energy beam-sensitive coating layer to form a resist pattern coating from the energy beam-sensitive coating layer; and (4) removing revealed portions of the conductive coating-forming resin layer by development. The present invention also provides a method of forming a conductive pattern, comprising the step (1), the step (2), and the step of: (3′) developing the energy beam-sensitive coating layer and the conductive coating-forming resin layer simultaneously.
摘要:
A negative type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm and a large spectral luminous efficiency; the composition being a liquid or a solid resin composition containing a photocurable resin, a photoreaction initiator and if necessary, a photosensitizing dye; an absorbancy of an unexposed film formed from this composition being 0.5 or less within the range of the maximum wavelength .+-.30 nm selected from the range of the maximum wavelength of the safelight. By the use of this negative type photosensitive resin composition, it is possible to form a resist pattern which is excellent in safe operativity, operational efficiency, the quality stability of products, and the like.
摘要:
A pattern-forming method which comprises the following steps: (1) laminating an actinic ray-curable coating film layer onto the surface of an insulating film-forming resin layer. (2) irradiating directly or through a photomask an actinic ray or host wave thereonto so as to obtain a predetermined pattern. (3) subjecting the actinic ray-curable coating film layer to a developing treatment to form a resist pattern coating film consisting of the actinic ray-curable coating film layer, (4) and subjecting the insulating film-forming resin layer to a developing treatment, followed by removing.
摘要:
The present invention provides a visible laser-curable photosensitive composition wherein a photocuring resin having photosensitive group which is crosslinkable or polymerizable upon light exposure, is mixed with a photopolymerization inititor system consisting of a coumarin type pigment of particular structure and a titanocene compound. This composition has an unexpectedly high sensitivity to visible laser.
摘要:
A liquid or a solid positive type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm, wherein an absorbancy of an unexposed film formed from this composition is 0.5 or less within the range of the maximum wavelength ±30 nm selected from the range of the maximum wavelength of the safelight; and a method for forming a resist pattern is also disclosed which comprises (1) a step of applying a positive type photosensitive resin composition onto a substrate to form a photosensitive film thereon, (2) a step of exposing the photosensitive film so as to obtain a desired pattern, and (3) a step of performing a developing treatment to form a resist pattern, wherein at least one step of the steps (1) to (3) is carried out under the irradiation circumstance of the safelight having a high spectral luminous efficiency in which the maximum wavelength of an emission spectrum of a light source is within the range of 500 to 620 nm.
摘要:
A visible light curable resin composition containing a photocurable resin, a photoreaction initiator and a photosensitizer having the formula (1). The composition has a very high sensitivity to a general-purpose visible light laser, so that a high-speed scanning exposure is possible by the laser, and an extremely fine high resolution can be obtained. In addition, the composition can be used for coating or printing under safelight irradiating conditions and under bright circumstantial conditions without any thickening of the composition, and hence the composition can exert excellent noticeable effects in points of safe operativity, operational efficiency and the stability of products. Formula (1) is as follows: ##STR1## wherein rings X.sub.1 and X.sub.2 are each an optionally substituted pyrrole ring; Y is H, CN, optionally substituted alkyl, aralkyl, aryl, heteroaryl or alkenyl group; and Z.sub.1 and Z.sub.2 are halogen, optionally substituted alkyl, alkoxy, alkylthio, aralkyl, aralkyloxy, aryl, aryloxy, arylthio, heteroaryl, heteroaryloxy or heteroarylthio group, provided that at least one of substituents on the pyrrole rings X.sub.1 and X.sub.2, groups Z.sub.1 and Z.sub.2 is the alkoxy, aralkyloxy or aryloxy group.