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公开(公告)号：US07375421B2
公开(公告)日：2008-05-20
申请号：US11147864
申请日：2005-06-08
CPC分类号： H01L25/50 , H01L23/5384 , H01L23/5387 , H01L23/5389 , H01L24/97 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06593 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H05K1/185 , H05K1/189 , H05K2201/055 , H01L2924/00014 , H01L2924/00
摘要： Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.
摘要翻译： 变薄和堆叠对于用于各种移动设备，智能卡，存储卡等的电路模块是必不可少的。 这些要求使得电路模块的制造由于分层而更复杂或更不可靠。 提供了一种多层结构的电路模块，其通过将半导体芯片和无源部件嵌入由热塑性树脂制成的片材中而形成; 在电路块的边界处折叠由在其上设置有布线图案的电路块形成的模块片，以堆叠成层; 并通过施加热和压力进行热粘合和集成模块片。 结果，可以以简单的方式制造高可靠性的电路模块。
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公开(公告)号：US07297876B2
公开(公告)日：2007-11-20
申请号：US10918274
申请日：2004-08-13
IPC分类号： H05K1/16
CPC分类号： H05K1/185 , H01L21/4846 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/16 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K2201/0129 , H05K2201/09036 , H05K2201/10674 , H05K2203/1189 , Y10T29/4913 , H01L2224/82 , H01L2924/00
摘要： Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.
摘要翻译： 对热塑性树脂膜进行热处理，最终成为绝缘树脂层，并将膜压在膜上形成凹槽的模具上。 接下来，从薄膜的背面将电子部件压配合到树脂薄膜中，从而从凹槽的底部露出部件的电极。 然后将薄膜冷却固化。 将薄膜剥离模具，然后用导电膏填充凹槽，并固化糊料以形成电路图案。 上述过程允许将电极与包含电子部件的电路板的电路图案正向地导通，并且在电路图案的布线之间实现更窄的间距。
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公开(公告)号：US07233069B2
公开(公告)日：2007-06-19
申请号：US10947177
申请日：2004-09-23
CPC分类号： H05K3/247 , H01L2924/0002 , H05K1/095 , H05K2201/0266 , H05K2201/035 , H01L2924/00
摘要： An interconnection substrate includes: an interconnection layer region where at least a first conductor layer and a second conductor layer are vertically stacked in that order on a substrate, with the first conductor layer and second conductor layer containing conductive particles and a binder, wherein the first conductor layer and second conductor layer stacked in the interconnection layer region have conductive particles different in average particle size from each other. As a result, only an intended region can have low resistance.
摘要翻译： 互连基板包括：互连层区域，其中至少第一导体层和第二导体层在基板上依次垂直堆叠，第一导体层和第二导体层包含导电颗粒和粘合剂，其中第一 堆叠在互连层区域中的导体层和第二导体层具有彼此平均粒径不同的导电粒子。 结果，只有预期的区域可以具有低电阻。
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4.发明申请公开(公告)号：US20060014403A1
公开(公告)日：2006-01-19
申请号：US11175448
申请日：2005-07-07
IPC分类号： H01R12/00
CPC分类号： H05K3/361 , H01R12/52 , H01R43/0207 , H05K3/107 , H05K2201/0129 , H05K2201/0376 , H05K2201/10977 , H05K2203/0278 , H05K2203/065
摘要： First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.
摘要翻译： 第一电路板10包括通过加热软化并具有熔融特性的第一树脂基材12和形成在第一树脂基材12的表面上的多个第一导体图案14和第二电路板20， 形成与第一导体图案14相同的间距的第二导体图案24。 在该结构中，第一导体图案14和第二导体图案24彼此机械接触以提供导电; 第一树脂基材12覆盖第一导体图案14和第二导体图案24，并且被接合到第二电路板20的第二树脂基材22，从而将第一电路板10和第二电路板20彼此连接。
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公开(公告)号：US07353600B2
公开(公告)日：2008-04-08
申请号：US10940933
申请日：2004-09-15
CPC分类号： H05K3/005 , H05K3/0011 , H05K3/4015 , H05K3/4644 , H05K2201/0108 , H05K2201/083 , H05K2201/10242 , H05K2203/0108 , H05K2203/104 , H05K2203/1189 , H05K2203/308 , Y10T29/49147 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165
摘要： A circuit board fabrication method including: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 so as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and forming second conductive interconnection 6 onto interlevel insulator layer 42 to include opening 5.
摘要翻译： 一种电路板制造方法，包括：在绝缘体基板1上形成第一导电布线2; 将用于将第一导电互连2和第二导电互连6电绝缘的层间绝缘体层42的树脂膜41施加到绝缘体基板1上; 在施加树脂膜41之前，使柱状构件3立在第一导电布线2的规定位置上，或者将柱状构件3压入树脂膜41中，以到达第一导电布线2的附近或第 在施加树脂膜41之后的第一导电互连2的部分; 硬化树脂膜41以形成层间绝缘体层42; 拉出柱状构件3以在层间绝缘体层42中形成开口5; 以及在层间绝缘体层42上形成第二导电布线6以包括开口5。
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公开(公告)号：US20050275088A1
公开(公告)日：2005-12-15
申请号：US11147864
申请日：2005-06-08
IPC分类号： H01L21/98 , H01L23/48 , H01L23/538 , H01L25/065 , H01R4/58 , H05K1/18
CPC分类号： H01L25/50 , H01L23/5384 , H01L23/5387 , H01L23/5389 , H01L24/97 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/0652 , H01L2225/06541 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2225/06593 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H05K1/185 , H05K1/189 , H05K2201/055 , H01L2924/00014 , H01L2924/00
摘要： Thinning and stacking are essential for circuit modules used for mobile devices of various kinds, smart cards, memory cards and the like. These demands make the manufacture of the circuit modules more complicated or less reliable due to delamination. A circuit module of a multilayer structure is provided which is formed by embedding semiconductor chips and passive components in a sheet made from a thermoplastic resin; folding a module sheet, which is formed of circuit blocks provided with wiring patterns thereon, at the boundaries of the circuit blocks so as to be stacked into layers; and thermal-bonding and integrating the module sheet by applying heat and pressure. As a result, a highly reliable circuit module can be manufactured in a simple manner.
摘要翻译： 变薄和堆叠对于用于各种移动设备，智能卡，存储卡等的电路模块是必不可少的。 这些要求使得电路模块的制造由于分层而更复杂或更不可靠。 提供了一种多层结构的电路模块，其通过将半导体芯片和无源部件嵌入由热塑性树脂制成的片材中而形成; 在电路块的边界处折叠由在其上设置有布线图案的电路块形成的模块片，以堆叠成层; 并通过施加热和压力进行热粘合和集成模块片。 结果，可以以简单的方式制造高可靠性的电路模块。
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公开(公告)号：US20050079707A1
公开(公告)日：2005-04-14
申请号：US10947177
申请日：2004-09-23
CPC分类号： H05K3/247 , H01L2924/0002 , H05K1/095 , H05K2201/0266 , H05K2201/035 , H01L2924/00
摘要： An interconnection substrate include: interconnection layer 12 region where at least first conductor layer 16 and second conductor layer 18 are vertically stacked in that order on substrate 10, first conductor layer 16 and second conductor layer 18 containing conductive particles and a binder, wherein first conductor layer 16 and second conductor layer 18 stacked in the interconnection layer 12 region have conductive particles different in average particle size from each other. As a result, only intended region can have low resistance.
摘要翻译： 互连基板包括：互连层12，其中至少第一导体层16和第二导体层18在基板10上依次垂直堆叠，第一导体层16和包含导电颗粒和粘合剂的第二导体层18，其中第一导体 堆叠在互连层12区域中的层16和第二导体层18具有彼此平均粒径不同的导电粒子。 结果，只有预期的区域可以具有低电阻。
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公开(公告)号：US20050060886A1
公开(公告)日：2005-03-24
申请号：US10940933
申请日：2004-09-15
CPC分类号： H05K3/005 , H05K3/0011 , H05K3/4015 , H05K3/4644 , H05K2201/0108 , H05K2201/083 , H05K2201/10242 , H05K2203/0108 , H05K2203/104 , H05K2203/1189 , H05K2203/308 , Y10T29/49147 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165
摘要： A circuit board fabrication method comprising the steps of: forming first conductive interconnection 2 onto insulator substrate 1; applying resin film 41, which is to be interlevel insulator layer 42 for electrically insulating first conductive interconnection 2 and second conductive interconnection 6, onto insulator substrate 1; either making pillar-like member 3 stand on a prescribed position on first conductive interconnection 2 before applying resin film 41, or press fitting pillar-like member 3 into resin film 41 in such a manner as to reach either a surface vicinity of first conductive interconnection 2 or a portion of first conductive interconnection 2 after applying resin film 41; hardening resin film 41 to form interlevel insulator layer 42; pulling out pillar-like member 3 to form opening 5 in interlevel insulator layer 42; and (f) forming second conductive interconnection 6 onto interlevel insulator layer 42 in such a manner as to include opening 5.
摘要翻译： 一种电路板制造方法，包括以下步骤：在绝缘体基板1上形成第一导电布线2; 将用于将第一导电互连2和第二导电互连6电绝缘的层间绝缘体层42的树脂膜41施加到绝缘体基板1上; 在施加树脂膜41之前，使柱状构件3在第一导电布线2上的规定位置上立起，或者将柱状构件3按压到树脂膜41中，使其到达第一导电互连 2或第一导电互连2的一部分; 硬化树脂膜41以形成层间绝缘体层42; 拉出柱状构件3以在层间绝缘体层42中形成开口5; 和（f）以包括开口5的方式在层间绝缘体层42上形成第二导电布线6。
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9.发明授权公开(公告)号：US07229293B2
公开(公告)日：2007-06-12
申请号：US11175448
申请日：2005-07-07
IPC分类号： H01R12/00
CPC分类号： H05K3/361 , H01R12/52 , H01R43/0207 , H05K3/107 , H05K2201/0129 , H05K2201/0376 , H05K2201/10977 , H05K2203/0278 , H05K2203/065
摘要： First circuit board 10 including first resin base material 12 which is softened by heating and has a fusing property, and a plurality of first conductor patterns 14 formed on a surface of first resin base material 12, and second circuit board 20 on which a plurality of second conductor patterns 24 are formed with the same pitch as that of first conductor patterns 14 are provided. In the configuration, first conductor patterns 14 and second conductor patterns 24 are brought into mechanical contact with each other to provide electrical conduction; first resin base material 12 covers first conductor patterns 14 and second conductor patterns 24 and is bonded to second resin base material 22 of second circuit board 20, thereby connecting first circuit board 10 and second circuit board 20 to each other.
摘要翻译： 第一电路板10包括通过加热软化并具有熔融特性的第一树脂基材12和形成在第一树脂基材12的表面上的多个第一导体图案14和第二电路板20， 形成与第一导体图案14相同的间距的第二导体图案24。 在该结构中，第一导体图案14和第二导体图案24彼此机械接触以提供导电; 第一树脂基材12覆盖第一导体图案14和第二导体图案24，并且被接合到第二电路板20的第二树脂基材22，从而将第一电路板10和第二电路板20彼此连接。
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公开(公告)号：US20050045379A1
公开(公告)日：2005-03-03
申请号：US10918274
申请日：2004-08-13
IPC分类号： H01L21/48 , H01L21/60 , H01L23/12 , H01L23/482 , H01L23/538 , H05K1/00 , H05K1/03 , H05K1/09 , H05K1/18 , H05K3/00 , H05K3/10 , H05K3/12
CPC分类号： H05K1/185 , H01L21/4846 , H01L21/568 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/16 , H01L2224/76155 , H01L2224/82102 , H01L2224/97 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2924/1815 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H05K1/095 , H05K3/107 , H05K3/1258 , H05K2201/0129 , H05K2201/09036 , H05K2201/10674 , H05K2203/1189 , Y10T29/4913 , H01L2224/82 , H01L2924/00
摘要： Apply heat to thermoplastic resin film, which is eventually to become an insulating resin layer, and press the film against a mold for forming grooves on a surface of the film. Next, press-fit an electronic component into the resin film from a back-face of the film, thereby exposing electrodes of the component from a bottom of the grooves. Then cool the film for curing. Peel the film off the mold, then fill the grooves with conductive paste, and cure the paste for forming circuit patterns. The foregoing procedure allows bringing the electrodes positively into conduction with the circuit patterns of a circuit board incorporating the electronic component, and achieving a narrower pitch between routings of the circuit patterns.
摘要翻译： 对热塑性树脂膜进行热处理，最终成为绝缘树脂层，并将膜压在膜上形成凹槽的模具上。 接下来，从薄膜的背面将电子部件压配合到树脂薄膜中，从而从凹槽的底部露出部件的电极。 然后将薄膜冷却固化。 将薄膜剥离模具，然后用导电膏填充凹槽，并固化糊料以形成电路图案。 上述过程允许将电极与包含电子部件的电路板的电路图案正向地导通，并且在电路图案的布线之间实现更窄的间距。
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