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    FILM COOLING OF TURBINE BLADES OR VANES
    5.
    发明申请
    FILM COOLING OF TURBINE BLADES OR VANES 有权
    涡轮叶片或风扇的薄膜冷却

    公开(公告)号：US20140255200A1

    公开(公告)日：2014-09-11

    申请号：US14235060

    申请日：2012-07-13

    申请人： Liang Guo ,  John David Maltson ,  Yuying Yan

    发明人： Liang Guo ,  John David Maltson ,  Yuying Yan

    IPC分类号： F01D5/18 ,  F01D5/14

    CPC分类号： F01D5/147 ,  F01D5/145 ,  F01D5/186 ,  F01D9/041 ,  F05D2240/12 ,  F05D2260/202

    摘要： The present invention relates to a turbine assembly having an aerofoil and/or an end wall each having an outer surface with a structure for directing a flow of a cooling medium at the outer surface. The structure at the outer surface has at least a first groove and a second groove extending in the outer surface from a leading to a trailing edge and being oriented in at least two different directions with a deflection angle (α) towards each other, with the deflection angle (α) having a component in a span wise direction of the aerofoil. The structure at the outer surface of the end wall has at least a first groove and a second groove extending in an axial direction of the turbine assembly, matching an outer profile of the aerofoil and oriented in at least two different directions with a deflection angle (α) towards each other.

    摘要翻译： 本发明涉及一种具有机翼和/或端壁的涡轮组件，每个翼片和/或端壁都具有外表面，该外表面具有用于引导冷却介质在外表面的流动的结构。 外表面上的结构具有至少第一凹槽和第二凹槽，该第二凹槽和第二凹槽在外表面中从引导向后缘延伸，并且在至少两个不同的方向上以相对于彼此的偏转角（α）定向， 偏转角（α）在机翼的跨度方向上具有分量。 在端壁的外表面处的结构具有至少第一凹槽和在涡轮组件的轴向方向上延伸的第二凹槽，其匹配翼型的外轮廓并且在至少两个不同方向上以偏转角（ α）朝向彼此。

    Integrated method for high-density interconnection of electronic components through stretchable interconnects
    7.
    发明授权
    Integrated method for high-density interconnection of electronic components through stretchable interconnects 失效
    电子元件通过可伸缩互连实现高密度互连的集成方法

    公开(公告)号：US08349727B2

    公开(公告)日：2013-01-08

    申请号：US13083111

    申请日：2011-04-08

    申请人： Liang Guo ,  Stephen P. DeWeerth

    发明人： Liang Guo ,  Stephen P. DeWeerth

    IPC分类号： H01L21/4763

    CPC分类号： H05K3/4644 ,  A61N1/0543 ,  H01L23/5387 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0652 ,  H01L2224/04105 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K1/0283 ,  H05K1/185 ,  H05K3/4691 ,  H05K2201/09509 ,  H01L2924/00

    摘要： Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer electronics such as elastic displays, skin-like electronic sensors, etc. In particular, stretchable neural implants provide improved performances as to cause less mechanical stress and thus fewer traumas to surrounding soft tissues. Such SMCMs usually comprise of various electronic components attached to or embedded in a polydimethylsiloxane (PDMS) substrate and wired through stretchable interconnects. However, reliably and compactly connecting the electronic components to PDMS-based stretchable interconnects is very challenging. This invention describes an integrated method for high-density interconnection of electronic components through stretchable interconnects in an SMCM. This invention has applications in high-density SMCMs, as well as high-density stretchable/conformable neural interfaces.

    摘要翻译： 可伸缩的多芯片模块（SMCM）能够承受大的机械变形并符合曲面。 这些SMCM可以在诸如弹性显示器，皮肤样电子传感器等的弹性消费电子产品中发现它们的用途。特别地，可拉伸的神经植入物提供改善的性能，从而导致较少的机械应力，从而减少周围软组织的创伤。 这样的SMCM通常包括连接到或嵌入在聚二甲基硅氧烷（PDMS）衬底中并通过可拉伸互连线布线的各种电子部件。 然而，将电子元件可靠且紧凑地连接到基于PDMS的可拉伸互连是非常具有挑战性的。 本发明描述了一种用于通过SMCM中的可伸缩互连实现电子部件的高密度互连的集成方法。 本发明可应用于高密度SMCM，以及高密度可伸缩/神经接口。