-
公开(公告)号：US08720052B2
公开(公告)日：2014-05-13
申请号：US12993138
申请日：2009-05-20
申请人： Daniel J. Theis , Brian K. Nelson , James N. Dobbs , Samuel Kidane , Ronald P. Swanson , Daniel H. Carlson , Grant F. Tiefenbruck , Karl K. Stensvad
发明人： Daniel J. Theis , Brian K. Nelson , James N. Dobbs , Samuel Kidane , Ronald P. Swanson , Daniel H. Carlson , Grant F. Tiefenbruck , Karl K. Stensvad
IPC分类号： H01K3/22
CPC分类号： H05K3/1283 , H05K1/0393 , H05K2201/062 , H05K2203/0143 , H05K2203/1131 , H05K2203/1545
摘要： A method of applying a conductive pattern of metal onto a web of indefinite length material. This method includes applying a metal containing composition onto the web in a predefined pattern, providing a roll having a very low thermal mass, and conveying the patterned web around the roll while simultaneously applying heat energy to the metal containing composition thereby converting the metal to a conductive pattern. This allows for flexible circuitry to be fabricated in an inexpensive roll-to-roll process.
摘要翻译： 将金属导电图案施加到不定长材料的幅材上的方法。 该方法包括以预定图案将含金属的组合物施加到纤维网上，提供具有非常低的热质量的辊，并且将图案化的卷材围绕辊传送，同时向含金属的组合物施加热能，从而将金属转化为 导电图案。 这允许以便宜的卷对卷工艺制造柔性电路。
-
公开(公告)号：US20110067234A1
公开(公告)日：2011-03-24
申请号：US12993138
申请日：2009-05-20
申请人： Daniel J. Theis , Brian K. Nelson , James N. Dobbs , Samuel Kidane , Ronald P. Awanson , Daniel H. Carlson , Grant F. Tiefenbruck , Karl K. Stensvad
发明人： Daniel J. Theis , Brian K. Nelson , James N. Dobbs , Samuel Kidane , Ronald P. Awanson , Daniel H. Carlson , Grant F. Tiefenbruck , Karl K. Stensvad
IPC分类号： H05K3/10
CPC分类号： H05K3/1283 , H05K1/0393 , H05K2201/062 , H05K2203/0143 , H05K2203/1131 , H05K2203/1545
摘要： A method of applying a conductive pattern of metal onto a web of indefinite length material. This method includes applying a metal containing composition onto the web in a predefined pattern, providing a roll having a very low thermal mass, and conveying the patterned web around the roll while simultaneously applying heat energy to the metal containing composition thereby converting the metal to a conductive pattern. This allows for flexible circuitry to be fabricated in an inexpensive roll-to-roll process.
摘要翻译： 将金属导电图案施加到不定长材料的幅材上的方法。 该方法包括以预定图案将含金属的组合物施加到纤维网上，提供具有非常低的热质量的辊，并且将图案化的卷材围绕辊传送，同时向含金属的组合物施加热能，从而将金属转化为 导电图案。 这允许以便宜的卷对卷工艺制造柔性电路。
-
公开(公告)号：US08663537B2
公开(公告)日：2014-03-04
申请号：US13474938
申请日：2012-05-18
IPC分类号： B29C45/73
CPC分类号： B29C45/73 , B29C2045/7393
摘要： A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.
摘要翻译： 一种用于注射成型的散热器，具有至少一个具有后部段的承载路径，其中散热片的至少一个非承载动态传热区的至少一部分从后向侧向偏移 承载路径的段。
-
公开(公告)号：US20130307189A1
公开(公告)日：2013-11-21
申请号：US13474938
申请日：2012-05-18
IPC分类号： B29C45/73
CPC分类号： B29C45/73 , B29C2045/7393
摘要： A heatsink for use in injection molding, with at least one load-bearing path with a rearward segment, wherein at least a portion of at least one non-load-bearing, dynamic heat-transfer zone of the heatsink is laterally offset from the rearward segment of the load-bearing path.
摘要翻译： 一种用于注射成型的散热器，具有至少一个具有后部段的承载路径，其中散热片的至少一个非承载动态传热区的至少一部分从后向侧向偏移 承载路径的段。
-
公开(公告)号：US09614113B2
公开(公告)日：2017-04-04
申请号：US14236700
申请日：2012-07-30
IPC分类号： H01L31/048 , H01L31/049
CPC分类号： H01L31/0481 , H01L31/0322 , H01L31/048 , H01L31/049 , Y02B10/12 , Y02E10/50
摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a barrier stack adjacent the electronic device; and a weatherable sheet adjacent the barrier stack opposite the electronic device. The assembly additionally comprises a protective layer in contact with the electronic device and the weatherable sheet. The present application allows for the combination of any of the disclosed elements.
-
公开(公告)号：US09997657B2
公开(公告)日：2018-06-12
申请号：US13175495
申请日：2011-07-01
IPC分类号： B32B27/08 , B32B27/36 , B32B27/42 , B32B7/12 , B32B7/02 , H01L31/048 , B32B17/10 , B32B27/30 , B32B27/28 , B32B27/32 , B32B27/34
CPC分类号： H01L31/0481 , B32B7/02 , B32B7/12 , B32B17/10018 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/286 , B32B27/302 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2255/10 , B32B2255/20 , B32B2307/412 , B32B2307/416 , B32B2307/42 , B32B2307/546 , B32B2307/71 , B32B2307/712 , B32B2307/7246 , B32B2307/732 , B32B2327/12 , B32B2367/00 , B32B2457/12 , B32B2551/00 , Y02E10/50 , Y10T428/24942 , Y10T428/2495 , Y10T428/31663 , Y10T428/31667
摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.
-
公开(公告)号：US20150243816A1
公开(公告)日：2015-08-27
申请号：US14421030
申请日：2013-08-15
申请人： Alan K. NACHTIGAL , ANDREW T. RUFF , CHRISTOPHER S. LYONS , Guy D. JOLY , Joseph C. SPAGNOLA , Mark D. WEIGEL , Michael D. DELMORE , Samuel KIDANE , Thomas P. KLUN , 3M INNOVATIVE PROPERTIES COMPANY
发明人： Aan K. Nachtigal , Andrew T. Ruff , Christopher S. Lyons , Guy D. Joly , Joseph C. Spagnola , Mark D. Weigel , Michael D. Delmore , Samuel Kidane , Thomas P. Lun
IPC分类号： H01L31/048 , B32B37/12 , B32B37/10 , H01L51/44
CPC分类号： H01L31/0481 , B32B27/06 , B32B27/30 , B32B37/1018 , B32B37/12 , B32B2307/40 , B32B2307/412 , B32B2307/546 , B32B2307/7265 , B32B2307/748 , B32B2333/08 , B32B2457/20 , C23C14/08 , H01L51/448
摘要： The present disclosure generally relates to methods of forming barrier assemblies. Some embodiments include application and removal of a protective layer followed by application of a topsheet. Some embodiments include application and removal of a protective layer including a release agent and a monomer.
摘要翻译： 本公开一般涉及形成屏障组件的方法。 一些实施方案包括施加和去除保护层，然后施加顶片。 一些实施方案包括施加和去除包括脱模剂和单体的保护层。
-
公开(公告)号：US20120003448A1
公开(公告)日：2012-01-05
申请号：US13175598
申请日：2011-07-01
IPC分类号： B32B7/02
CPC分类号： H01L31/0481 , B32B7/02 , B32B7/12 , B32B17/10018 , B32B27/08 , B32B27/281 , B32B27/283 , B32B27/286 , B32B27/302 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2255/10 , B32B2255/20 , B32B2307/412 , B32B2307/416 , B32B2307/42 , B32B2307/546 , B32B2307/71 , B32B2307/712 , B32B2307/7246 , B32B2307/732 , B32B2327/12 , B32B2367/00 , B32B2457/12 , B32B2551/00 , Y02E10/50 , Y10T428/24942 , Y10T428/2495 , Y10T428/31663 , Y10T428/31667
摘要： An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.
摘要翻译： 提供了一种包括介于第一聚合物膜基材和压敏粘合剂层的第一主表面之间的阻挡膜的组合件。 第一聚合物膜基材具有第一热膨胀系数，在一些实施方案中为高达每百万开氏百万分之50。 压敏粘合剂层具有与设置在第二聚合物膜基材上的第一主表面相对的第二主表面。 第二聚合物膜基底通常耐紫外线降解。 在一些实施方案中，第二聚合物膜基材具有比第一热膨胀系数高至少40ppm /开氏度的第二热膨胀系数。 组件对可见光和红外光透射。
-
公开(公告)号：US20140283910A1
公开(公告)日：2014-09-25
申请号：US14236692
申请日：2012-07-30
IPC分类号： H01L31/048
CPC分类号： H01L31/0481 , H01L31/03928 , H01L31/048 , H02S20/23 , Y02B10/12 , Y02E10/541
摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film is transparent and flexible and the barrier stack and the substrate are insulated from the environment.
摘要翻译： 本申请涉及一种包括电子器件和多层膜的组件。 多层膜包括邻近电子器件的衬底，与电子器件相对的衬底相邻的势垒层，以及与衬底相对的阻挡层的邻近的耐候性片。 多层膜是透明和柔性的，并且阻挡层叠层和衬底与环境绝缘。
-
公开(公告)号：US20140230892A1
公开(公告)日：2014-08-21
申请号：US14236729
申请日：2012-07-31
申请人： Mark D. Weigel , Samuel Kidane
发明人： Mark D. Weigel , Samuel Kidane
IPC分类号： H01L31/048
CPC分类号： H01L31/048 , H01L31/03926 , H01L31/049 , H01L51/448 , Y02E10/549
摘要： The present application is directed to an assembly comprising an electronic device, and a multilayer film. The multilayer film comprises a substrate adjacent the electronic device, a barrier stack adjacent the substrate opposite the electronic device, and a weatherable sheet adjacent the barrier stack opposite the substrate. The multilayer film has been fused.
摘要翻译： 本申请涉及一种包括电子器件和多层膜的组件。 多层膜包括邻近电子器件的衬底，与电子器件相对的衬底相邻的势垒层，以及与衬底相对的阻挡层的邻近的耐候性片。 多层薄膜已经融合。
-
-
-
-
-
-
-
-
-
搜索结果
13 条记录 (耗时 0.086 秒)
