公开(公告)号：US5531020A

公开(公告)日：1996-07-02

申请号：US112225

申请日：1993-08-27

Applicant: David Durand ,  Roger A. Iannetta, Jr.

Inventor： David Durand ,  Roger A. Iannetta, Jr.

IPC: C09J163/00 ,  H01B1/22 ,  H01L21/48 ,  H01L21/60 ,  H01R4/04 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/28 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L24/83 ,  C09J163/00 ,  H01B1/22 ,  H01L21/4867 ,  H01L24/29 ,  H01L24/81 ,  H01R4/04 ,  H05K3/1258 ,  H05K3/321 ,  H01L2224/13111 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/3025 ,  H05K1/095 ,  H05K1/181 ,  H05K2201/0125 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2203/0307 ,  H05K2203/0568 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K3/0023 ,  H05K3/107 ,  H05K3/28 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of making a planar, subsurface electronic circuit having at least one electronic circuit component assembled therewith is disclosed. First, three dimensional, essentially square channels interspersed with lands are formed within a dielectric material on a substrate. The channels are then filled in one pass with a curable polymeric material containing a conductive metal filler so that the upper surfaces of the circuit trace formed by this conductive material are at essentially the same level as the upper surface of the lands. Circuit components are place to engage the conductive material. The curable material is then cured after placing the electronic component(s).

Abstract translation: 公开了一种制造具有组装的至少一个电子电路部件的平面的地下电子电路的方法。 首先，在衬底上的电介质材料内形成散布有焊盘的三维，基本上为方形的通道。 然后将通道用含有导电金属填料的可固化聚合物材料一次填充，使得由该导电材料形成的电路迹线的上表面基本上与焊盘的上表面相同。 电路元件是与导电材料接合的地方。 然后在放置电子部件之后固化可固化材料。

公开(公告)号：US5455394A

公开(公告)日：1995-10-03

申请号：US112226

申请日：1993-08-27

Applicant: David Durand ,  Chon M. Wong ,  Roger A. Iannetta, Jr.

Inventor： David Durand ,  Chon M. Wong ,  Roger A. Iannetta, Jr.

IPC: H01L21/60 ,  H01L23/495 ,  H05K1/18

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: A polymer lead frame is made from a flexible substrate with flexible conductive traces. The generally square lead frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

Abstract translation: 聚合物引线框架由具有柔性导电迹线的柔性基板制成。 大致正方形的引线框架具有从拐角向中心部分延伸的对角切口，以及位于模具的占位面积内的中心孔。 模具直接粘合到引线框架上，优选地与各向异性的导电粘合剂粘合。 将模具放置在引线框架在夹具中。 施加保持力以固定模具，并且如果需要，在固化周期期间施加固化力。 固定装置允许将组件运送到固化炉并允许施加固化力。 模具具有接触垫，其特征在于非平面的非凸起状表面，其凹陷具有至少约各向异性导电粘合剂中导电颗粒直径的约七分之一的深度。

公开(公告)号：US5631191A

公开(公告)日：1997-05-20

申请号：US440924

申请日：1995-05-15

Applicant: David Durand ,  Chon M. Wong ,  Roger A. Iannetta, Jr.

Inventor： David Durand ,  Chon M. Wong ,  Roger A. Iannetta, Jr.

IPC: H01L21/60 ,  H01L23/495

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15173

Abstract: A polymer lead-frame is made from a flexible substrate with flexible conductive traces. The generally square lead-frame has diagonal cutouts partially extending from the corners towards the center, as well as a central hole that lies within a footprint of the die. The die is bonded directly to the lead frame, preferably with anisotropic, electrically conductive adhesive. The die is placed with the lead frame in a fixture. A holding force is applied to secure the die and, if necessary, a curing force is applied during a cure cycle. The fixture allows transport of the assembly to a curing oven and allows application of the curing force. The die has contact pads characterized by a non-planar, non-bump-like surface with concavities having depths of at least about one-seventh the diameter of conductive particles in the anisotropic conductive adhesive.

Abstract translation: 聚合物引线框架由具有柔性导电迹线的柔性基板制成。 大致正方形的引线框架具有从拐角向中心部分延伸的对角切口，以及位于模具的占位面积内的中心孔。 模具直接粘合到引线框架上，优选地与各向异性导电粘合剂粘合。 将模具放置在引线框架在夹具中。 施加保持力以固定模具，并且如果需要，在固化周期期间施加固化力。 固定装置允许将组件运送到固化炉并允许施加固化力。 模具具有接触垫，其特征在于非平面的非凸起状表面，其凹陷具有至少约各向异性导电粘合剂中导电颗粒直径的约七分之一的深度。