Nitride semiconductor light-emitting device and process for producing the same
    1.
    发明授权
    Nitride semiconductor light-emitting device and process for producing the same 失效
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US08664687B2

    公开(公告)日:2014-03-04

    申请号:US10898204

    申请日:2004-07-26

    IPC分类号: H01L33/00

    摘要: Provided are a nitride semiconductor light-emitting device comprising a polycrystalline or amorphous substrate made of AlN; a plurality of dielectric patterns formed on the AlN substrate and having a stripe or lattice structure; a lateral epitaxially overgrown-nitride semiconductor layer formed on the AlN substrate having the dielectric patterns by Lateral Epitaxial Overgrowth; a first conductive nitride semiconductor layer formed on the nitride semiconductor layer; an active layer formed on the first conductive nitride semiconductor layer; and a second conductive nitride semiconductor layer formed on the active layer; and a process for producing the same.

    摘要翻译: 提供一种氮化物半导体发光器件,其包括由AlN制成的多晶或非晶衬底; 形成在所述AlN基板上并具有条纹或格子结构的多个电介质图案; 通过横向外延生长形成在具有电介质图案的AlN衬底上的侧向外延氮化半导体层; 形成在所述氮化物半导体层上的第一导电氮化物半导体层; 形成在所述第一导电氮化物半导体层上的有源层; 以及形成在所述有源层上的第二导电氮化物半导体层; 及其制造方法。

    NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
    2.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US20110300652A1

    公开(公告)日:2011-12-08

    申请号:US13211107

    申请日:2011-08-16

    IPC分类号: H01L33/60

    摘要: There is provided a nitride semiconductor light emitting device and a manufacturing method of the same. The nitride semiconductor light emitting device including: a substrate for growing a nitride single crystal, the substrate having electrical conductivity; a p-type nitride semiconductor layer formed on the substrate; an active layer formed on the p-type nitride semiconductor layer, the active layer including a plurality of quantum barrier layers and a plurality of quantum well layers deposited alternately on each other; an n-type nitride semiconductor layer formed on the active layer; a p-electrode formed on a bottom of the substrate; and an n-electrode formed on a top of the n-type nitride semiconductor layer.

    摘要翻译: 提供了一种氮化物半导体发光器件及其制造方法。 所述氮化物半导体发光器件包括:用于生长氮化物单晶的衬底,所述衬底具有导电性; 在该基板上形成的p型氮化物半导体层; 形成在p型氮化物半导体层上的有源层,所述有源层包括彼此交替沉积的多个量子势垒层和多个量子阱层; 形成在有源层上的n型氮化物半导体层; 形成在所述基板的底部上的p电极; 以及形成在n型氮化物半导体层的顶部上的n电极。

    Nitride semiconductor light emitting device and manufacturing method of the same
    4.
    发明申请
    Nitride semiconductor light emitting device and manufacturing method of the same 审中-公开
    氮化物半导体发光器件及其制造方法相同

    公开(公告)号:US20080078986A1

    公开(公告)日:2008-04-03

    申请号:US11902396

    申请日:2007-09-21

    IPC分类号: H01L33/00

    摘要: There is provided a nitride semiconductor light emitting device and a manufacturing method of the same. The nitride semiconductor light emitting device including: a substrate for growing a nitride single crystal, the substrate having electrical conductivity; a p-type nitride semiconductor layer formed on the substrate; an active layer formed on the p-type nitride semiconductor layer, the active layer including a plurality of quantum barrier layers and a plurality of quantum well layers deposited alternately on each other; an n-type nitride semiconductor layer formed on the active layer; a p-electrode formed on a bottom of the substrate; and an n-electrode formed on a top of the n-type nitride semiconductor layer.

    摘要翻译: 提供了一种氮化物半导体发光器件及其制造方法。 所述氮化物半导体发光器件包括:用于生长氮化物单晶的衬底,所述衬底具有导电性; 在该基板上形成的p型氮化物半导体层; 形成在p型氮化物半导体层上的有源层,所述有源层包括彼此交替沉积的多个量子势垒层和多个量子阱层; 形成在有源层上的n型氮化物半导体层; 形成在所述基板的底部上的p电极; 以及形成在n型氮化物半导体层的顶部上的n电极。

    White light emitting device
    6.
    发明授权
    White light emitting device 有权
    白色发光装置

    公开(公告)号:US07935974B2

    公开(公告)日:2011-05-03

    申请号:US12399619

    申请日:2009-03-06

    IPC分类号: H01L33/00

    摘要: The invention relates to a monolithic white light emitting device using wafer bonding or metal bonding. In the invention, a conductive submount substrate is provided. A first light emitter is bonded onto the conductive submount substrate by a metal layer. In the first light emitter, a p-type nitride semiconductor layer, a first active layer, an n-type nitride semiconductor layer and a conductive substrate are stacked sequentially from bottom to top. In addition, a second light emitter is formed on a partial area of the conductive substrate. In the second light emitter, a p-type AlGaInP-based semiconductor layer, an active layer and an n-type AlGaInP-based semiconductor layer are stacked sequentially from bottom to top. Further, a p-electrode is formed on an underside of the conductive submount substrate and an n-electrode is formed on a top surface of the n-type AlGaInP-based semiconductor layer.

    摘要翻译: 本发明涉及使用晶片接合或金属接合的单片白光发光器件。 在本发明中,提供导电基座。 第一发光体通过金属层粘合在导电基座上。 在第一光发射器中,从底部到顶部依次层叠p型氮化物半导体层,第一有源层,n型氮化物半导体层和导电性基板。 此外,在导电基板的局部区域上形成第二发光体。 在第二发光体中,从底部到顶部依次层叠p型AlGaInP系半导体层,有源层及n型AlGaInP系半导体层。 另外,在导体基座基板的下侧形成有p电极,在n型AlGaInP系半导体层的上表面形成n电极。

    White light emitting device
    9.
    发明授权
    White light emitting device 有权
    白色发光装置

    公开(公告)号:US07514720B2

    公开(公告)日:2009-04-07

    申请号:US11442961

    申请日:2006-05-31

    IPC分类号: H01L29/201

    摘要: The invention relates to a monolithic white light emitting device using wafer bonding or metal bonding. In the invention, a conductive submount substrate is provided. A first light emitter is bonded onto the conductive submount substrate by a metal layer. In the first light emitter, a p-type nitride semiconductor layer, a first active layer, an n-type nitride semiconductor layer and a conductive substrate are stacked sequentially from bottom to top. In addition, a second light emitter is formed on a partial area of the conductive substrate. In the second light emitter, a p-type AlGaInP-based semiconductor layer, an active layer and an n-type AlGaInP-based semiconductor layer are stacked sequentially from bottom to top. Further, a p-electrode is formed on an underside of the conductive submount substrate and an n-electrode is formed on a top surface of the n-type AlGaInP-based semiconductor layer.

    摘要翻译: 本发明涉及使用晶片接合或金属接合的单片白光发光器件。 在本发明中,提供导电基座。 第一发光体通过金属层粘合在导电基座上。 在第一光发射器中,从底部到顶部依次层叠p型氮化物半导体层,第一有源层,n型氮化物半导体层和导电性基板。 此外,在导电基板的局部区域上形成第二发光体。 在第二发光体中,从底部到顶部依次层叠p型AlGaInP系半导体层,有源层及n型AlGaInP系半导体层。 另外,在导体基座基板的下侧形成有p电极,在n型AlGaInP系半导体层的上表面形成n电极。