NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME
    1.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME 审中-公开
    氮化物半导体发光器件及其制造方法

    公开(公告)号:US20110300652A1

    公开(公告)日:2011-12-08

    申请号:US13211107

    申请日:2011-08-16

    IPC分类号: H01L33/60

    摘要: There is provided a nitride semiconductor light emitting device and a manufacturing method of the same. The nitride semiconductor light emitting device including: a substrate for growing a nitride single crystal, the substrate having electrical conductivity; a p-type nitride semiconductor layer formed on the substrate; an active layer formed on the p-type nitride semiconductor layer, the active layer including a plurality of quantum barrier layers and a plurality of quantum well layers deposited alternately on each other; an n-type nitride semiconductor layer formed on the active layer; a p-electrode formed on a bottom of the substrate; and an n-electrode formed on a top of the n-type nitride semiconductor layer.

    摘要翻译: 提供了一种氮化物半导体发光器件及其制造方法。 所述氮化物半导体发光器件包括:用于生长氮化物单晶的衬底,所述衬底具有导电性; 在该基板上形成的p型氮化物半导体层; 形成在p型氮化物半导体层上的有源层,所述有源层包括彼此交替沉积的多个量子势垒层和多个量子阱层; 形成在有源层上的n型氮化物半导体层; 形成在所述基板的底部上的p电极; 以及形成在n型氮化物半导体层的顶部上的n电极。

    Nitride semiconductor light emitting device and manufacturing method of the same
    3.
    发明申请
    Nitride semiconductor light emitting device and manufacturing method of the same 审中-公开
    氮化物半导体发光器件及其制造方法相同

    公开(公告)号:US20080078986A1

    公开(公告)日:2008-04-03

    申请号:US11902396

    申请日:2007-09-21

    IPC分类号: H01L33/00

    摘要: There is provided a nitride semiconductor light emitting device and a manufacturing method of the same. The nitride semiconductor light emitting device including: a substrate for growing a nitride single crystal, the substrate having electrical conductivity; a p-type nitride semiconductor layer formed on the substrate; an active layer formed on the p-type nitride semiconductor layer, the active layer including a plurality of quantum barrier layers and a plurality of quantum well layers deposited alternately on each other; an n-type nitride semiconductor layer formed on the active layer; a p-electrode formed on a bottom of the substrate; and an n-electrode formed on a top of the n-type nitride semiconductor layer.

    摘要翻译: 提供了一种氮化物半导体发光器件及其制造方法。 所述氮化物半导体发光器件包括:用于生长氮化物单晶的衬底,所述衬底具有导电性; 在该基板上形成的p型氮化物半导体层; 形成在p型氮化物半导体层上的有源层,所述有源层包括彼此交替沉积的多个量子势垒层和多个量子阱层; 形成在有源层上的n型氮化物半导体层; 形成在所述基板的底部上的p电极; 以及形成在n型氮化物半导体层的顶部上的n电极。

    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME
    5.
    发明申请
    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM INCLUDING THE SAME 审中-公开
    发光装置,发光装置包装和包括其的照明系统

    公开(公告)号:US20120119254A1

    公开(公告)日:2012-05-17

    申请号:US13357980

    申请日:2012-01-25

    IPC分类号: H01L33/32 H01L33/00

    摘要: Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a first conductive type first semiconductor layer, an active layer, a second conductive type second semiconductor layer, a reliability enhancement layer, and a second conductive type third semiconductor layer. The active layer is disposed on the first conductive type first semiconductor layer. The second conductive type second semiconductor layer is disposed on the active layer. The reliability enhancement layer is disposed on the second conductive type second semiconductor layer. The second conductive type third semiconductor layer is disposed on the reliability enhancement layer and comprises a light extraction pattern. The reliability enhancement layer and the active layer are spaced apart from each other by a distance of 0.3 μm to 5 μm.

    摘要翻译: 提供了一种发光器件,发光器件封装和照明系统。 发光器件包括第一导电型第一半导体层,有源层,第二导电型第二半导体层,可靠性增强层和第二导电型第三半导体层。 有源层设置在第一导电类型的第一半导体层上。 第二导电型第二半导体层设置在有源层上。 可靠性增强层设置在第二导电型第二半导体层上。 第二导电类型的第三半导体层设置在可靠性增强层上并且包括光提取图案。 可靠性增强层和有源层彼此隔开0.3μm至5μm的距离。

    Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device
    6.
    发明授权
    Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device 有权
    III族氮化物半导体薄膜,其制造方法和III族氮化物半导体发光器件

    公开(公告)号:US07955957B2

    公开(公告)日:2011-06-07

    申请号:US12612206

    申请日:2009-11-04

    摘要: Disclosed herein is a high-quality group III-nitride semiconductor thin film and group III-nitride semiconductor light emitting device using the same. To obtain the group III-nitride semiconductor thin film, an AlInN buffer layer is formed on a (1-102)-plane (so called r-plane) sapphire substrate by use of a MOCVD apparatus under atmospheric pressure while controlling a temperature of the substrate within a range from 850 to 950 degrees Celsius, and then, GaN-based compound, such as GaN, AlGaN or the like, is epitaxially grown on the buffer layer at a high temperature. The group III-nitride semiconductor light emitting device is fabricated by using the group III-nitride semiconductor thin film as a base layer.

    摘要翻译: 本文公开了使用该III族氮化物半导体薄膜的高质量III族氮化物半导体薄膜和III族氮化物半导体发光器件。 为了获得III族氮化物半导体薄膜,在(1-102)面(所谓的r面)蓝宝石衬底上通过使用MOCVD装置在大气压下形成AlInN缓冲层,同时控制 衬底在850至950摄氏度的范围内,然后在高温下在缓冲层上外延生长GaN基化合物,例如GaN,AlGaN等。 通过使用III族氮化物半导体薄膜作为基底层来制造III族氮化物半导体发光器件。

    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
    8.
    发明申请
    LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
    发光装置,发光装置包装和照明系统

    公开(公告)号:US20140054542A1

    公开(公告)日:2014-02-27

    申请号:US13969811

    申请日:2013-08-19

    IPC分类号: H01L33/12

    摘要: The light emitting device includes a first conductive semiconductor layer; a second conductive semiconductor layer on the first conductive semiconductor layer; and an active layer between the first and second conductive semiconductor layers. The active layer includes a plurality of well layers and a plurality of barrier layers, wherein the well layers include a first well layer and a second well layer adjacent to the first well layer. The barrier layers include a first barrier layer disposed between the first and second well layers, and the first barrier layer includes a plurality of semiconductor layers having an energy bandgap wider than an energy bandgap of the first well layer. At least two layers of the plurality of semiconductor layers are adjacent to the first and second well layers, and have aluminum contents greater than that of the other layer.

    摘要翻译: 发光器件包括第一导电半导体层; 在所述第一导电半导体层上的第二导电半导体层; 以及第一和第二导电半导体层之间的有源层。 有源层包括多个阱层和多个势垒层,其中阱层包括与第一阱层相邻的第一阱层和第二阱层。 阻挡层包括设置在第一阱层和第二阱层之间的第一势垒层,并且第一势垒层包括具有比第一阱层的能带隙宽的能带隙的多个半导体层。 多个半导体层中的至少两层与第一和第二阱层相邻,并且铝含量大于另一层的铝含量。

    Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device
    10.
    发明申请
    Group III-nitride semiconductor thin film, method for fabricating the same, and group III-nitride semiconductor light emitting device 有权
    III族氮化物半导体薄膜,其制造方法和III族氮化物半导体发光器件

    公开(公告)号:US20070045654A1

    公开(公告)日:2007-03-01

    申请号:US11512380

    申请日:2006-08-30

    IPC分类号: H01L33/00

    摘要: Disclosed herein is a high-quality group III-nitride semiconductor thin film and group III-nitride semiconductor light emitting device using the same. To obtain the group III-nitride semiconductor thin film, an AlInN buffer layer is formed on a (1-102)-plane (so called r-plane) sapphire substrate by use of a MOCVD apparatus under atmospheric pressure while controlling a temperature of the substrate within a range from 850 to 950 degrees Celsius, and then, GaN-based compound, such as GaN, AlGaN or the like, is epitaxially grown on the buffer layer at a high temperature. The group III-nitride semiconductor light emitting device is fabricated by using the group III-nitride semiconductor thin film as a base layer.

    摘要翻译: 本文公开了使用该III族氮化物半导体薄膜的高质量III族氮化物半导体薄膜和III族氮化物半导体发光器件。 为了获得III族氮化物半导体薄膜,在(1-102)面(所谓的r面)蓝宝石衬底上通过使用MOCVD装置在大气压下形成AlInN缓冲层,同时控制 衬底在850至950摄氏度的范围内,然后在高温下在缓冲层上外延生长GaN基化合物,例如GaN,AlGaN等。 通过使用III族氮化物半导体薄膜作为基底层来制造III族氮化物半导体发光器件。