Semiconductor light-emitting device and manufacturing method thereof
    6.
    发明授权
    Semiconductor light-emitting device and manufacturing method thereof 有权
    半导体发光器件及其制造方法

    公开(公告)号:US08759814B2

    公开(公告)日:2014-06-24

    申请号:US13615548

    申请日:2012-09-13

    IPC分类号: H01L31/00

    摘要: A semiconductor light-emitting device and a manufacturing method thereof are provided, wherein the semiconductor light-emitting device includes a first type doped semiconductor structure, a light-emitting layer, a second type doped semiconductor layer, a first conductive layer and a dielectric layer. The first type doped semiconductor structure includes a base and a plurality of columns extending outward from the base. Each of the columns includes a top surface and a plurality of sidewall surfaces. The light-emitting layer is disposed on the sidewall surfaces and the top surface, wherein the surface area of the light-emitting layer gradually changes from one side adjacent to the columns to a side away from the columns. The dielectric layer exposes the first conductive layer locating on the top surface of each of the columns, wherein the dielectric layer includes at least one of a plurality of quantum dots, phosphors, and metal nanoparticles.

    摘要翻译: 提供一种半导体发光器件及其制造方法,其中半导体发光器件包括第一掺杂半导体结构,发光层,第二掺杂半导体层,第一导电层和介电层 。 第一类型掺杂半导体结构包括从基底向外延伸的基部和多个列。 每个柱包括顶表面和多个侧壁表面。 发光层设置在侧壁表面和顶表面上,其中发光层的表面积从相邻列的一侧逐渐变为离开立柱的一侧。 电介质层暴露位于每个列的顶表面上的第一导电层,其中介电层包括多个量子点,磷光体和金属纳米颗粒中的至少一个。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20140042387A1

    公开(公告)日:2014-02-13

    申请号:US13615548

    申请日:2012-09-13

    IPC分类号: H01L33/04 H01L33/44

    摘要: A semiconductor light-emitting device and a manufacturing method thereof are provided, wherein the semiconductor light-emitting device includes a first type doped semiconductor structure, a light-emitting layer, a second type doped semiconductor layer, a first conductive layer and a dielectric layer. The first type doped semiconductor structure includes a base and a plurality of columns extending outward from the base. Each of the columns includes a top surface and a plurality of sidewall surfaces. The light-emitting layer is disposed on the sidewall surfaces and the top surface, wherein the surface area of the light-emitting layer gradually changes from one side adjacent to the columns to a side away from the columns. The dielectric layer exposes the first conductive layer locating on the top surface of each of the columns, wherein the dielectric layer includes at least one of a plurality of quantum dots, phosphors, and metal nanoparticles.

    摘要翻译: 提供一种半导体发光器件及其制造方法,其中半导体发光器件包括第一掺杂半导体结构,发光层,第二掺杂半导体层,第一导电层和介电层 。 第一类型掺杂半导体结构包括从基底向外延伸的基部和多个列。 每个柱包括顶表面和多个侧壁表面。 发光层设置在侧壁表面和顶表面上,其中发光层的表面积从与列相邻的一侧逐渐变为远离柱的一侧。 电介质层暴露位于每个列的顶表面上的第一导电层,其中介电层包括多个量子点,磷光体和金属纳米颗粒中的至少一个。