公开(公告)号：US20050271884A1

公开(公告)日：2005-12-08

申请号：US11180456

申请日：2005-07-13

申请人： Dongchan Ahn ,  Pamela Huey ,  Nick Shephard ,  Michael Watson

发明人： Dongchan Ahn ,  Pamela Huey ,  Nick Shephard ,  Michael Watson

IPC分类号： C08L83/04 ,  C08L83/08 ,  C09D183/05 ,  C09D183/07 ,  C09J183/04 ,  H01L23/29 ,  H01L23/31 ,  B32B9/04

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/24 ,  C08G77/80 ,  C08L83/00 ,  C08L83/08 ,  C09D183/04 ,  C09D183/08 ,  C09J183/04 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

摘要翻译： 通过混合组分制备组合物，所述组分包括：（I）每分子平均具有至少两个不饱和有机基团的聚有机硅氧烷，条件是组分（I）不含氟原子; 任选地（II）每分子平均具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，条件是组分（II）不含氟原子; （III）氢化硅烷化催化剂; （IV）有机硅氧烷，条件是（1）组分（IV）具有至少一个与组分（I），组分（II）或两者反应的官能团，（2）当组分（II）不存在时， 那么组分（Ⅳ）每分子具有平均至少两个与硅键合的氢原子，并且（3）组分（Ⅳ）以足以对组合物的固化产物提供耐化学性的量加入组合物中; 和（V）粘合促进剂。

公开(公告)号：US20050038188A1

公开(公告)日：2005-02-17

申请号：US10641810

申请日：2003-08-14

申请人： Dongchan Ahn ,  Pamela Huey ,  Nick Shephard ,  Michael Watson

发明人： Dongchan Ahn ,  Pamela Huey ,  Nick Shephard ,  Michael Watson

IPC分类号： C08L83/04 ,  C08L83/08 ,  C09D183/05 ,  C09D183/07 ,  C09J183/04 ,  H01L23/29 ,  H01L23/31 ,  B29C39/10 ,  B29C70/70 ,  B29C70/88

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/16 ,  C08G77/18 ,  C08G77/20 ,  C08G77/24 ,  C08G77/80 ,  C08L83/00 ,  C08L83/08 ,  C09D183/04 ,  C09D183/08 ,  C09J183/04 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/31663 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

公开(公告)号：US20070298223A1

公开(公告)日：2007-12-27

申请号：US11792063

申请日：2005-12-13

申请人： Cheryl Loch ,  Dongchan Ahn ,  Nick Shephard ,  James Tonge ,  Patricia Olney

发明人： Cheryl Loch ,  Dongchan Ahn ,  Nick Shephard ,  James Tonge ,  Patricia Olney

IPC分类号： C08F230/06 ,  B32B3/00 ,  C08K5/55 ,  C09D183/04

CPC分类号： C08F230/06 ,  C08K5/55 ,  C08L83/06 ,  Y10T428/24612 ,  C08L83/00 ,  C08L2666/28

摘要： Curable compositions contain (i) a free radical polymerizable organosilicon monomer, oligomer or polymer; (ii) an organoborane amine complex; optionally (iii) an amine reactive compound having amine reactive groups; and optionally (iv) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The curable compositions can be used as a rubber, tape, adhesive, foam, pressure sensitive adhesive, protective coating, thin film, thermoplastic monolithic molded part, thermosetting monolithic molded part, sealant, gasket, seal, or o-ring, die attachment adhesive, lid sealant, encapsulant, potting compound, or conformal coating. The compositions can also be used in composite articles of manufacture such as integrally bonded device including electrical and electronic connectors and scuba diving masks, in which substrates are coated or bonded together with the composition and cured.

摘要翻译： 可固化组合物含有（i）可自由基聚合的有机硅单体，低聚物或聚合物; （ii）有机硼烷胺络合物; 任选地（iii）具有胺反应性基团的胺反应性化合物; 和（iv）当与含有活性氢和催化剂的化合物混合时能产生气体的组分。 可固化组合物可用作橡胶，胶带，粘合剂，泡沫，压敏粘合剂，保护涂层，薄膜，热塑性整体模制部件，热固性整体模制部件，密封剂，垫圈，密封件或O形环，模具附接胶 ，盖密封剂，密封剂，灌封化合物或保形涂层。 组合物还可以用于复合制品中，例如包括电气和电子连接器的整体结合的装置和水肺潜水面罩，其中将基材与组合物一起涂布或粘合在一起并固化。

公开(公告)号：US08334592B2

公开(公告)日：2012-12-18

申请号：US12668495

申请日：2008-09-05

申请人： Dorab Bhagwagar ,  Donald Liles ,  Nick Shephard ,  Shengqing Xu ,  Zuchen Lin ,  G. M. Fazley Elahee

发明人： Dorab Bhagwagar ,  Donald Liles ,  Nick Shephard ,  Shengqing Xu ,  Zuchen Lin ,  G. M. Fazley Elahee

IPC分类号： H01L23/06

CPC分类号： H01L23/3737 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  Y10T428/12569 ,  Y10T428/254 ,  Y10T428/31678 ,  H01L2924/00

摘要： A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.

摘要翻译： 热界面材料包括导热金属基体和分散在其中的粗聚合物颗粒。 该复合材料可用于电子设备中的TIM1和TIM2应用。

公开(公告)号：US20210002532A9

公开(公告)日：2021-01-07

申请号：US16621756

申请日：2018-08-21

申请人： Gang Lu ,  Nick Shephard ,  Ryan C. Thomas ,  Matthew Olsen

发明人： Gang Lu ,  Nick Shephard ,  Ryan C. Thomas ,  Matthew Olsen

IPC分类号： C09J183/14 ,  C08G77/16 ,  C08G77/18 ,  C08G77/48 ,  C08G77/08

摘要： A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

公开(公告)号：US08859056B2

公开(公告)日：2014-10-14

申请号：US11913855

申请日：2006-05-10

申请人： Liam O'Neill ,  Frederic Gubbels ,  Stuart Leadley ,  Nick Shephard

发明人： Liam O'Neill ,  Frederic Gubbels ,  Stuart Leadley ,  Nick Shephard

IPC分类号： B05D5/10 ,  H05H1/24 ,  C23C4/12 ,  C09J5/02 ,  C23C4/02 ,  C23C4/18 ,  B05D1/00

CPC分类号： C09J5/02 ,  B05D1/62 ,  C23C4/02 ,  C23C4/18 ,  Y10T428/31504 ,  Y10T428/31515 ,  Y10T428/31551 ,  Y10T428/31663

摘要： A method of bonding an adherent to a substrate, wherein a primer is applied to the substrate by plasma deposition and the adherent is bonded to the primer treated surface of the substrate, and the primer contains functional groups which chemically bond to functional groups in the adherent.

摘要翻译： 将粘附剂粘合到基材上的方法，其中通过等离子体沉积将底漆施加到基底上，并将粘附剂结合到底物的引物处理表面，并且引物含有与粘附的官能团化学键合的官能团 。

公开(公告)号：US08618233B2

公开(公告)日：2013-12-31

申请号：US12517211

申请日：2007-11-07

申请人： Khristopher Alvarez ,  Nick Shephard ,  James Tonge

发明人： Khristopher Alvarez ,  Nick Shephard ,  James Tonge

IPC分类号： C08G77/08

CPC分类号： C08G77/50 ,  C08J3/243 ,  C08J2383/04 ,  C08K5/54 ,  C09D183/14 ,  Y10T428/31663

摘要： A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

摘要翻译： 聚合物通过辐射或湿气固化机制或两者固化。 聚合物通过氢化硅烷化制备。 聚合物包括式（R22SiO2 / 2）b，（R2Si03 / 2）c，（SiO4 / 2）d，（R1'）f和（R23Si01 / 2）g的单元，其中每个R1独立地是氧原子 或二价烃基; 每个R1'独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

公开(公告)号：US20100328895A1

公开(公告)日：2010-12-30

申请号：US12668480

申请日：2008-09-05

申请人： Dorab Bhagwagar ,  Donald Liles ,  Nick Shephard ,  Shengqing Xu ,  Zuchen Lin ,  G.M. Fazley Elahee

发明人： Dorab Bhagwagar ,  Donald Liles ,  Nick Shephard ,  Shengqing Xu ,  Zuchen Lin ,  G.M. Fazley Elahee

IPC分类号： H05K7/20 ,  C09K5/14 ,  B05D5/12 ,  B23K31/02 ,  B23K1/20 ,  B28B5/06

CPC分类号： H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2924/00

摘要： A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications.

摘要翻译： 复合材料包括导热金属基体和分散在其中的硅氧烷颗粒。 复合材料可用于在电子设备中形成热界面材料。 该复合材料可用于TIM1和TIM2应用。

公开(公告)号：US20100208432A1

公开(公告)日：2010-08-19

申请号：US12668495

申请日：2008-09-05

申请人： Dorab Bhagwagar ,  Donald Liles ,  Nick Shephard ,  Shengqing Xu ,  Zuchen Lin ,  G.M. Fazley Elahee

发明人： Dorab Bhagwagar ,  Donald Liles ,  Nick Shephard ,  Shengqing Xu ,  Zuchen Lin ,  G.M. Fazley Elahee

IPC分类号： H01L23/34 ,  B32B5/16 ,  B05D5/00 ,  B32B37/00 ,  B32B15/00 ,  H05K7/00 ,  C09K5/00 ,  F28F7/00

CPC分类号： H01L23/3737 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/3011 ,  Y10T428/12569 ,  Y10T428/254 ,  Y10T428/31678 ,  H01L2924/00

摘要： A thermal interface material includes a thermally conductive metal matrix and coarse polymeric particles dispersed therein. The composite can be used for both TIM1 and TIM2 applications in electronic devices.

摘要翻译： 热界面材料包括导热金属基体和分散在其中的粗聚合物颗粒。 该复合材料可用于电子设备中的TIM1和TIM2应用。

公开(公告)号：US20100092690A1

公开(公告)日：2010-04-15

申请号：US12517211

申请日：2007-11-07

申请人： Khristopher Alvarez ,  Nick Shephard ,  James Tonge

发明人： Khristopher Alvarez ,  Nick Shephard ,  James Tonge

IPC分类号： C08F2/48 ,  C08G77/04 ,  C08G77/12 ,  C08F2/46 ,  B05D3/02 ,  B05D5/12

CPC分类号： C08G77/50 ,  C08J3/243 ,  C08J2383/04 ,  C08K5/54 ,  C09D183/14 ,  Y10T428/31663

摘要： A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

摘要翻译： 聚合物通过辐射或湿气固化机制或两者固化。 聚合物通过氢化硅烷化制备。 聚合物包括式（R22SiO2 / 2）b，（R2Si03 / 2）c，（SiO4 / 2）d，（R1'）f和（R23Si01 / 2）g的单元，其中每个R1独立地是氧原子 或二价烃基; 每个R1'独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。