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15 条记录 (耗时 0.047 秒)

    Arrangement for transporting a flat substrate in a vacuum chamber
    2.
    发明授权
    Arrangement for transporting a flat substrate in a vacuum chamber 失效
    用于在真空室中输送平面基板的布置

    公开(公告)号：US07837799B2

    公开(公告)日：2010-11-23

    申请号：US10732179

    申请日：2003-12-10

    申请人： Stefan Bangert ,  Frank Fuchs ,  Uwe Schuessler ,  Ralph Lindenberg ,  Tobias Stolley

    发明人： Stefan Bangert ,  Frank Fuchs ,  Uwe Schuessler ,  Ralph Lindenberg ,  Tobias Stolley

    IPC分类号： C23C16/00 ,  C23C14/00 ,  C23F1/00 ,  H01L21/306 ,  C25B11/00 ,  C25B13/00

    CPC分类号： B65G49/065 ,  B65G49/063 ,  B65G2249/02 ,  B65G2249/045 ,  Y10S414/139

    摘要： An arrangement for transporting a flat substrate through a coating installation, wherein the coating installation comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in vacuo. So that no abrasion is generated between glass pane and contact, the glass pane is kept spaced apart from the contact by means of gas pressure. The gas pressure is herein built up through relatively few and small holes in a gas channel. Since during flooding of the coating installation to atmospheric pressure or during evacuation, due to the small holes, no fast pressure equalization between gas channel and the remaining coating installation is possible, the gas channel is decoupled in terms of gas from the remaining coating installation and provided with a separate gas line, via which gas can be introduced into the gas channel or pumped out of it.

    摘要翻译： 用于将平坦基底输送通过涂覆装置的布置，其中所述涂覆装置包括例如多个和不同的溅射阴极，平坦基底例如玻璃板在其中真空地彼此输送。 因此，玻璃板和接触件之间不会产生磨损，玻璃板通过气体压力与接触件保持间隔开。 气体压力通过气体通道中相对较少和小的孔形成。 由于涂层装置在大气压下或排空过程中，由于小孔，气体通道和剩余的涂层装置之间无法实现快速压力平衡，所以气体通道与剩余涂层装置的气体相分离， 设置有单独的气体管线，通过该气体管线可以将气体引入气体通道中或从其中泵出。

    Arrangement for transporting a flat substrate in a vacuum chamber
    3.
    发明申请
    Arrangement for transporting a flat substrate in a vacuum chamber 失效
    用于在真空室中输送平面基板的布置

    公开(公告)号：US20050199493A1

    公开(公告)日：2005-09-15

    申请号：US10732179

    申请日：2003-12-10

    申请人： Stefan Bangert ,  Frank Fuchs ,  Uwe Schuessler ,  Ralph Lindenberg ,  Tobias Stolley

    发明人： Stefan Bangert ,  Frank Fuchs ,  Uwe Schuessler ,  Ralph Lindenberg ,  Tobias Stolley

    IPC分类号： B65G49/06 ,  B65G49/07 ,  C23C14/00

    CPC分类号： B65G49/065 ,  B65G49/063 ,  B65G2249/02 ,  B65G2249/045 ,  Y10S414/139

    摘要： An arrangement for transporting a flat substrate through a coating installation, wherein the comprises, e.g., several and different sputter cathodes, to which the flat substrate, for example a glass pane, is transported one after the other in vacuo. So that no abrasion is generated between glass pane and contact, the glass pane is kept spaced apart from the contact by means of gas pressure. The gas pressure is herein built up through relatively few and small holes in a gas channel. Since during flooding of the coating installation to atmospheric pressure or during evacuation, due to the small holes, no fast pressure equalization between gas channel and the remaining coating installation is possible, the gas channel is decoupled in terms of gas from the remaining coating installation and provided with a separate gas line, via which gas can be introduced into the gas channel or pumped out of it.

    摘要翻译： 用于将平坦基板输送通过涂布设备的布置，其中包括例如几个和不同的溅射阴极，平板基板（例如玻璃板）在其中真空地一个接一个地输送到该喷涂阴极。 因此，玻璃板和接触件之间不会产生磨损，玻璃板通过气体压力与接触件保持间隔开。 气体压力通过气体通道中相对较少和小的孔形成。 由于涂层装置在大气压下或排空过程中，由于小孔，气体通道和剩余的涂层装置之间无法实现快速压力平衡，所以气体通道与剩余涂层装置的气体相分离， 设置有单独的气体管线，通过该气体管线可以将气体引入气体通道中或从其中泵出。

    Coater with a large-area assembly of rotatable magnetrons
    4.
    发明授权
    Coater with a large-area assembly of rotatable magnetrons 有权
    涂层机具有可旋转磁控管的大面积组件

    公开(公告)号：US08137510B2

    公开(公告)日：2012-03-20

    申请号：US11121563

    申请日：2005-05-04

    申请人： Stefan Bangert ,  Frank Fuchs ,  Ralph Lindenberg ,  Andreas Lopp ,  Uwe Schüssler ,  Tobias Stolley

    发明人： Stefan Bangert ,  Frank Fuchs ,  Ralph Lindenberg ,  Andreas Lopp ,  Uwe Schüssler ,  Tobias Stolley

    IPC分类号： C23C14/00

    CPC分类号： H01J37/3455 ,  C23C14/352 ,  C23C14/56 ,  H01J37/3405 ,  H01J2237/3325

    摘要： This invention relates to a coater for the coating, in particular, of large-area substrates by means of cathode sputtering, the coater having a coating chamber and, provided therein, a cathode assembly (2) where the material to be sputtered is located on a target (4) with a curved surface, the material to be sputtered being located, in particular, on the lateral surface of a cylinder, there being in a single coating chamber for a coherent coating zone at least three, preferably more, cathode assemblies (2) with rotatable, curved targets (4) positioned one beside the other.

    摘要翻译： 本发明涉及一种用于通过阴极溅射涂覆，特别是大面积基板的涂布机，涂布机具有涂覆室，并且在其中设置阴极组件（2），其中待溅射的材料位于 具有弯曲表面的靶（4），待溅射的材料特别地位于圆柱体的侧表面上，在单个涂覆室中用于粘附涂层区域，至少三个，优选更多的阴极组件 （2）具有位于另一个旁边的可旋转的弯曲目标（4）。

    APPARATUS FOR TREATING A SUBSTRATE
    6.
    发明申请
    APPARATUS FOR TREATING A SUBSTRATE 有权
    用于处理基板的装置

    公开(公告)号：US20090205954A1

    公开(公告)日：2009-08-20

    申请号：US12031339

    申请日：2008-02-14

    申请人： Markus Hanika ,  Tobias Stolley

    发明人： Markus Hanika ,  Tobias Stolley

    IPC分类号： C23C14/00

    CPC分类号： C23C14/352 ,  H01J37/34 ,  H01J37/3438

    摘要： This invention relates to an apparatus (1) for treating, e.g. coating, a substrate (35, 39) in a vacuum chamber (2). In this vacuum chamber (2) there are arranged n cathodes (7-10) and n+1 anodes (28-32), each of said anodes adjacent to a cathode (7-10). Each of the n cathodes (7-10) and n of the assigned anodes (29-32) are connected to a power supply (11-14). One of the anodes (28) not being assigned to a cathode (7-10) is connected to an electrical line (63) which is connecting each of the anodes (28-32). A pull-down resistor (34) is connected to said line (63) at its one end and to ground (33) at its other end.

    摘要翻译： 本发明涉及一种用于处理，例如， 涂覆在真空室（2）中的基底（35,39）。 在该真空室（2）中，设置n个阴极（7-10）和n + 1个阳极（28-32），每个阳极与阴极（7-10）相邻。 分配的阳极（29-32）的n个阴极（7-10）和n中的每一个连接到电源（11-14）。 未分配给阴极（7-10）的阳极（28）中的一个连接到连接每个阳极（28-32）的电线（63）。 下拉电阻器（34）在其一端连接到所述线（63），并在其另一端连接到地（33）。

    Apparatus for treating a substrate
    8.
    发明授权
    Apparatus for treating a substrate 有权
    用于处理基底的装置

    公开(公告)号：US08083911B2

    公开(公告)日：2011-12-27

    申请号：US12031339

    申请日：2008-02-14

    申请人： Markus Hanika ,  Tobias Stolley

    发明人： Markus Hanika ,  Tobias Stolley

    IPC分类号： C23C14/36

    CPC分类号： C23C14/352 ,  H01J37/34 ,  H01J37/3438

    摘要： This invention relates to an apparatus (1) for treating, e.g. coating, a substrate (35, 39) in a vacuum chamber (2). In this vacuum chamber (2) there are arranged n cathodes (7-10) and n+1 anodes (28-32), each of said anodes adjacent to a cathode (7-10). Each of the n cathodes (7-10) and n of the assigned anodes (29-32) are connected to a power supply (11-14). One of the anodes (28) not being assigned to a cathode (7-10) is connected to an electrical line (63) which is connecting each of the anodes (28-32). A pull-down resistor (34) is connected to said line (63) at its one end and to ground (33) at its other end.

    摘要翻译： 本发明涉及一种用于处理，例如， 涂覆在真空室（2）中的基底（35,39）。 在该真空室（2）中，设置n个阴极（7-10）和n + 1个阳极（28-32），每个阳极与阴极（7-10）相邻。 分配的阳极（29-32）的n个阴极（7-10）和n中的每一个连接到电源（11-14）。 未分配给阴极（7-10）的阳极（28）中的一个连接到连接每个阳极（28-32）的电线（63）。 下拉电阻器（34）在其一端连接到所述线（63），并在其另一端连接到地（33）。