摘要:
A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.
摘要:
A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.
摘要:
A method of making a microneedle array structure (20) comprising a plurality of simultaneously formed microneedles (24), each microneedle (24) having a protrusion (32) and a passageway (34) extending therethrough. The method comprises the steps of pressing an embossable sheet material between a complimentary tools and radiantly heating the sheet material using radiant energy from a radiant energy source. One tool is relatively-radiantly-transparent, and another tool and/or the sheet material is relatively-radiantly-absorptive.
摘要:
A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.
摘要:
A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.
摘要:
A method of making an embossed optical sheet material includes: providing an optically anisotropic, uniaxially oriented polymer substrate having a first major surface and a second major surface; heating a patterned tool using radiant energy from a radiant energy source, wherein the pattern comprises a plurality of parallel raised microstructures having a longitudinal direction; pressing the tool against the first major surface of the polymer substrate such that the longitudinal direction of the raised microstructures is substantially parallel to the direction of orientation of the polymer substrate, to soften the first major surface of the polymer substrate and emboss groove-shaped microchannels into the polymer substrate; cooling the embossed polymer substrate; and separating the tool from the polymer substrate; wherein the orientation of the polymer substrate is unchanged throughout the polymer substrate and first major surface.
摘要:
A method for making a composite and/or structured material includes: forming a lattice construction from a plurality of solid particles, the construction being formed so as to have one or more gaps between the particles; invading the lattice construction with a fluid material such that the fluid material at least partially penetrates the gaps; and, solidifying the material which invaded the lattice construction to form a composite material. In one suitable embodiment, the method further includes removing at least a portion of the lattice construction from the composite material thereby forming at the location of the removed portion one or more pores in the solidified material that invaded the construction.
摘要:
A method for making a composite and/or structured material includes: forming a lattice construction from a plurality of solid particles, the construction being formed so as to have one or more gaps between the particles; invading the lattice construction with a fluid material such that the fluid material at least partially penetrates the gaps; and, solidifying the material which invaded the lattice construction to form a composite material. In one suitable embodiment, the method further includes removing at least a portion of the lattice construction from the composite material thereby forming at the location of the removed portion one or more pores in the solidified material that invaded the construction.
摘要:
An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.
摘要:
A method of thermocompressive bonding of one or more electrical devices using individual heating elements and a resilient member to force the individual heating elements into compressive engagement with the electrical devices is provided. The individual heating elements may be Curie-point heating elements or conventional resistive heating elements. A method of thermocompressive bonding of one or more electrical devices using a transparent flexible platen and thermal radiation is also provided. In one embodiment, the thermal radiation is near infra-red thermal radiation and the transparent flexible platen is composed of silicone rubber. The bonding material may be an adhesive or a thermoplastic bonding material. A method of capacitively coupling a semiconductor chip to an electrical component with a pressure sensitive adhesive is also provided. The method includes compressing the chip by forcing a flexible platen of a bonding device into compressive engagement with the semiconductor chip.