公开(公告)号：US08067253B2

公开(公告)日：2011-11-29

申请号：US11314988

申请日：2005-12-21

申请人： Scott Wayne Ferguson ,  Ali Mehrabi ,  Reza Mehrabi

发明人： Scott Wayne Ferguson ,  Ali Mehrabi ,  Reza Mehrabi

IPC分类号： H01L21/00

CPC分类号： B29C35/0888 ,  B29C43/18 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29C2035/0855 ,  B29C2043/3615 ,  B32B2519/02 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

摘要翻译： 提供一种电气装置及其制造方法，其中将芯片或其它电气部件嵌入到基板中。 衬底可以是能够在芯片周围变形的热塑性材料，并且当将热和/或压力施加到衬底时至少部分地封装芯片。 诸如近红外辐射的电磁辐射可用于加热基底。 衬底可以包括可压缩和/或压碎以形成可以插入芯片的凹槽的可压缩层。 一旦被嵌入，芯片或电气部件被基板固定，并且可以耦合到另一个电气部件。 还提供了一种制造RFID应答器的方法，其中使用热和/或压力将RFID芯片嵌入到基板中，天线结构被施加到基板，并且RFID芯片和天线结构耦合在一起。

公开(公告)号：US20090206474A1

公开(公告)日：2009-08-20

申请号：US12430140

申请日：2009-04-27

申请人： Scott Wayne Ferguson ,  Ali Mehrabi ,  Reza Mehrabi

发明人： Scott Wayne Ferguson ,  Ali Mehrabi ,  Reza Mehrabi

IPC分类号： H01L23/28 ,  H01L21/00

CPC分类号： B29C35/0888 ,  B29C43/18 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29C2035/0855 ,  B29C2043/3615 ,  B32B2519/02 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

摘要翻译： 提供一种电气装置及其制造方法，其中将芯片或其它电气部件嵌入到基板中。 衬底可以是能够在芯片周围变形的热塑性材料，并且当将热和/或压力施加到衬底时至少部分地封装芯片。 诸如近红外辐射的电磁辐射可用于加热基底。 衬底可以包括可压缩和/或压碎以形成可以插入芯片的凹槽的可压缩层。 一旦被嵌入，芯片或电气部件被基板固定，并且可以耦合到另一个电气部件。 还提供了一种制造RFID应答器的方法，其中使用热和/或压力将RFID芯片嵌入在基板中，天线结构被施加到基板，并且RFID芯片和天线结构耦合在一起。

公开(公告)号：US20050167863A1

公开(公告)日：2005-08-04

申请号：US11047300

申请日：2005-01-31

申请人： Rishikesh Bharadwai ,  Eng-Pi Chang ,  Philip Chu ,  Hsiao Chuang ,  David Edwards ,  Robert Fermin ,  Ali Mehrabi ,  Reza Mehrabi ,  Ronald Sieloff ,  Chunhwa Wang

发明人： Rishikesh Bharadwai ,  Eng-Pi Chang ,  Philip Chu ,  Hsiao Chuang ,  David Edwards ,  Robert Fermin ,  Ali Mehrabi ,  Reza Mehrabi ,  Ronald Sieloff ,  Chunhwa Wang

IPC分类号： B28C1/00 ,  B29C20060101 ,  B29C35/02 ,  B29C35/08 ,  B29C47/06 ,  B29C55/00 ,  B29C59/00 ,  B29C59/02 ,  B29C59/04 ,  B29C67/00 ,  B29C71/00 ,  H05B6/00

CPC分类号： B29C59/02 ,  B29C35/0272 ,  B29C35/0888 ,  B29C59/04 ,  B29C2035/0822 ,  Y10T156/1023 ,  Y10T156/1041 ,  Y10T156/1737

摘要： A method of embossing a sheet material includes: heating at least a portion of the sheet directly or indirectly with radiant energy from a radiant energy source; pressing a tool against the heated portion of the sheet, thereby patterning a surface of the sheet; and separating the sheet and the tool. The radiant energy may travel through a solid material that is relatively transparent to radiation, on its way to being absorbed by a relatively-absorptive material. The relatively-transparent material may be an unheated portion of the sheet, and the relatively-absorptive material may be either the tool or the heated portion of the sheet. Alternatively, the relatively-transparent material may be the tool, and the relatively-absorptive material may be all or part of the sheet. The method may be performed as one or more roll-to-roll operations.

摘要翻译： 压片片材的方法包括：用来自辐射能源的辐射能直接或间接加热片材的至少一部分; 将工具压靠在片材的加热部分上，从而对片材的表面进行图案化; 并分离纸张和工具。 辐射能量可以通过对辐射相对透明的固体材料，在被相对吸收材料吸收的途中。 相对透明的材料可以是片材的未加热部分，并且相对吸收材料可以是片材的工具或加热部分。 或者，相对透明的材料可以是工具，并且相对吸收材料可以是片材的全部或部分。 该方法可以作为一个或多个卷对卷操作执行。

公开(公告)号：US20070141760A1

公开(公告)日：2007-06-21

申请号：US11314988

申请日：2005-12-21

申请人： Scott Ferguson ,  Ali Mehrabi ,  Reza Mehrabi

发明人： Scott Ferguson ,  Ali Mehrabi ,  Reza Mehrabi

IPC分类号： H01L21/00

CPC分类号： B29C35/0888 ,  B29C43/18 ,  B29C2035/0822 ,  B29C2035/0827 ,  B29C2035/0855 ,  B29C2043/3615 ,  B32B2519/02 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/07752 ,  H01L21/50 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： An electrical device and method of making same is provided wherein a chip or other electrical component is embedded in a substrate. The substrate may be a thermoplastic material capable of deforming around the chip and at least partially encasing the chip when heat and/or pressure is applied to the substrate. Electromagnetic radiation such a near infrared radiation can be used to heat the substrate. The substrate may include a compressible layer that can be compressed and/or crushed to form a recess into which the chip can be inserted. Once embedded, the chip or electrical component is secured by the substrate and may be coupled to another electrical component. A method of making an RFID transponder is also provided wherein an RFID chip is embedded in a substrate using heat and/or pressure, an antenna structure is applied to the substrate, and the RFID chip and antenna structure are coupled together.

摘要翻译： 提供一种电气装置及其制造方法，其中将芯片或其它电气部件嵌入到基板中。 衬底可以是能够在芯片周围变形的热塑性材料，并且当将热和/或压力施加到衬底时至少部分地包围芯片。 诸如近红外辐射的电磁辐射可用于加热基底。 衬底可以包括可压缩和/或压碎以形成可以插入芯片的凹槽的可压缩层。 一旦被嵌入，芯片或电气部件被基板固定，并且可以耦合到另一个电气部件。 还提供了一种制造RFID应答器的方法，其中使用热和/或压力将RFID芯片嵌入在基板中，天线结构被施加到基板，并且RFID芯片和天线结构耦合在一起。

公开(公告)号：US20060252182A1

公开(公告)日：2006-11-09

申请号：US11122539

申请日：2005-05-04

申请人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

发明人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

IPC分类号： H01L21/00

CPC分类号： G06K19/07749 ,  H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/0401

摘要： A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

摘要翻译： 公开了一种制造诸如RFID组件的半导体器件的方法，其中安装到衬底的管芯阵列以第一节距间隔开，并且在阵列中的管芯的位置被可固化物质固定之后，去除衬底。 然后去除可固化物质，而不改变阵列中的模具的相对位置。 芯片阵列的全部或选定部分然后电连接到布置在相应阵列中的多个带或插入件。 在芯片阵列中的管芯之间的间距或间距可以在衬底移除之前或之后改变以匹配相应阵列中的带或插入件的间距。 还公开了使用本发明创造的RFID设备。

公开(公告)号：US07989313B2

公开(公告)日：2011-08-02

申请号：US12104156

申请日：2008-04-16

申请人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

发明人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Dave N. Edwards ,  Akiko Tanabe ,  Mark Licon ,  Jay Akhave

IPC分类号： H01L21/46 ,  H01L21/30 ,  H01L21/78 ,  H01L21/82 ,  H01L23/544 ,  H01L21/768

CPC分类号： G06K19/07749 ,  H01L21/50 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2224/0401

摘要： A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.

摘要翻译： 公开了一种制造诸如RFID组件的半导体器件的方法，其中安装到衬底的管芯阵列以第一节距间隔开，并且在阵列中的管芯的位置被可固化物质固定之后，去除衬底。 然后去除可固化物质，而不改变阵列中的模具的相对位置。 芯片阵列的全部或选定部分然后电连接到布置在相应阵列中的多个带或插入件。 在芯片阵列中的管芯之间的间距或间距可以在衬底移除之前或之后改变以匹配相应阵列中的带或插入件的间距。 还公开了使用本发明创造的RFID设备。

公开(公告)号：US20060286335A1

公开(公告)日：2006-12-21

申请号：US11510636

申请日：2006-08-25

申请人： Martin Utz ,  Karl Lengfeller ,  Michael Wilkes ,  Sriram Venkatasanthanam ,  Ramin Heydarpour ,  Chia-Hsi Chu ,  Ronald Ugolick ,  Ali Mehrabi

发明人： Martin Utz ,  Karl Lengfeller ,  Michael Wilkes ,  Sriram Venkatasanthanam ,  Ramin Heydarpour ,  Chia-Hsi Chu ,  Ronald Ugolick ,  Ali Mehrabi

IPC分类号： G09F3/00

CPC分类号： B32B3/266 ,  B26D3/085 ,  B26F1/40 ,  B32B3/00 ,  B32B27/10 ,  B32B27/32 ,  B32B29/00 ,  B32B37/08 ,  B32B37/153 ,  B32B38/0004 ,  B32B38/145 ,  B32B2038/042 ,  B32B2038/045 ,  B32B2307/538 ,  B32B2307/718 ,  B32B2307/75 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2317/12 ,  B32B2425/00 ,  B42D5/027 ,  B42D15/02 ,  C08K3/013 ,  C08K5/0083 ,  C08K5/1575 ,  Y10T156/1052 ,  Y10T428/15 ,  Y10T428/24314 ,  Y10T428/2457 ,  Y10T428/24612

摘要： A card sheet including a top material having punched lines, the front side of the top material being printable. A carrier material of at least one polymer layer is directly applied as by extruding to the back side of the top material. The polymer has a stress-at-break in the range of 10 to 30 MPa and an elongation at break in the range of 10 to 120%. From the card sheet individual cards may be broken out to form high quality calling (business) cards, photograph cards, post cards or the like.

公开(公告)号：US20080124842A1

公开(公告)日：2008-05-29

申请号：US11557472

申请日：2006-11-07

申请人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

发明人： Haochuan Wang ,  Ali Mehrabi ,  Kouroche Kian ,  Xiaoming He ,  Stephen Li

IPC分类号： H01L21/60 ,  B23P19/00

CPC分类号： G06K19/07752 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/90 ,  H01L24/97 ,  H01L2221/68354 ,  H01L2224/16 ,  H01L2224/83192 ,  H01L2224/90 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/53543 ,  H01L2224/81 ,  H01L2224/0401

摘要： A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing a strap lead substrate having a plurality of strap leads disposed thereon; dispensing a first plurality of strap leads from the plurality of strap leads; providing a plurality of pins; bringing the penetrable substrate into close proximity with the strap lead substrate so as to bringing the first plurality of strap leads into contact with the plurality of dies; pressing the first plurality of strap leads against the plurality of dies using the plurality of pins; and, moving the penetrable substrate away from the strap lead substrate while using the plurality of pins to maintain contact between the first plurality of strap leads and the plurality of dies. An apparatus for assembling a semiconductor device is also disclosed.

摘要翻译： 一种组装半导体器件的方法，包括以下步骤：提供具有粘合剂表面的可穿透基底和设置在粘合剂表面上的多个管芯; 提供具有设置在其上的多个带状引线的带状引线基底; 从所述多个带状引线分配第一多个带状引线; 提供多个销; 使所述可穿透基板与所述带状引线基板紧密接合，以使所述第一多个带状引线与所述多个管芯接触; 使用所述多个销将所述第一多个带引线压靠所述多个管芯; 以及在使用所述多个销以保持所述第一多个带状引线和所述多个管芯之间的接触的同时将所述可穿透基板移离所述带状引线基板。 还公开了一种用于组装半导体器件的装置。

公开(公告)号：US20080122119A1

公开(公告)日：2008-05-29

申请号：US11469313

申请日：2006-08-31

申请人： Kouroche Kian ,  Xiaoming He ,  Ali Mehrabi ,  Haochuan Wang

发明人： Kouroche Kian ,  Xiaoming He ,  Ali Mehrabi ,  Haochuan Wang

IPC分类号： H01L23/12 ,  H01L21/58

CPC分类号： H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2221/68322 ,  H01L2221/68336 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83868 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2224/0401

摘要： A method for creating a plurality of semiconductor assemblies that includes the steps of creating a plurality of quasi-wafers, each quasi-wafer comprising a plurality of semiconductor devices; transferring the plurality of semiconductor devices on each quasi-wafers onto a carrier having a functional adhesive; and bonding the plurality of semiconductor devices to a substrate.

摘要翻译： 一种用于产生多个半导体组件的方法，包括以下步骤：产生多个准晶片，每个准晶片包括多个半导体器件; 将每个准晶片上的多个半导体器件转移到具有功能性粘合剂的载体上; 以及将所述多个半导体器件接合到衬底。

公开(公告)号：US20080036131A1

公开(公告)日：2008-02-14

申请号：US11923432

申请日：2007-10-24

申请人： Martin Utz ,  Karl Lengfeller ,  Michael Wilkes ,  Sriram Venkatasanthanam ,  Ramin Heydarpour ,  Chia-Hsi Chu ,  Ronald Ugolick ,  Ali Mehrabi

发明人： Martin Utz ,  Karl Lengfeller ,  Michael Wilkes ,  Sriram Venkatasanthanam ,  Ramin Heydarpour ,  Chia-Hsi Chu ,  Ronald Ugolick ,  Ali Mehrabi

IPC分类号： B41F13/54

CPC分类号： B32B3/266 ,  B26D3/085 ,  B26F1/40 ,  B32B3/00 ,  B32B27/10 ,  B32B27/32 ,  B32B29/00 ,  B32B37/08 ,  B32B37/153 ,  B32B38/0004 ,  B32B38/145 ,  B32B2038/042 ,  B32B2038/045 ,  B32B2307/538 ,  B32B2307/718 ,  B32B2307/75 ,  B32B2309/10 ,  B32B2309/105 ,  B32B2317/12 ,  B32B2425/00 ,  B42D5/027 ,  B42D15/02 ,  C08K3/013 ,  C08K5/0083 ,  C08K5/1575 ,  Y10T156/1052 ,  Y10T428/15 ,  Y10T428/24314 ,  Y10T428/2457 ,  Y10T428/24612

摘要： A card sheet including a top material having punched lines, the front side of the top material being printable. A carrier material of at least one polymer layer is directly applied as by extruding to the back side of the top material. The polymer has a stress-at-break in the range of 10 to 30 MPa and an elongation at break in the range of 10 to 120%. From the card sheet individual cards may be broken out to form high quality calling (business) cards, photograph cards, post cards or the like.

摘要翻译： 一种包括具有穿孔线的顶部材料的卡片，顶部材料的前侧可打印。 至少一个聚合物层的载体材料通过挤出直接施加到顶部材料的背面。 聚合物的断裂应力为10〜30MPa，断裂伸长率为10〜120％。 从卡片单独的卡片可能被打破以形成高质量的呼叫（商业）卡，照片卡，明信片等。