公开(公告)号：US20070144439A1

公开(公告)日：2007-06-28

申请号：US11530297

申请日：2006-09-08

申请人： Eric A. Englhardt ,  Michael R. Rice ,  Jeffrey C. Hudgens ,  Steve Hongkham ,  Jay D. Pinson ,  Mohsen Salek ,  Charles Carlson ,  William T. Weaver ,  Helen R. Armer

发明人： Eric A. Englhardt ,  Michael R. Rice ,  Jeffrey C. Hudgens ,  Steve Hongkham ,  Jay D. Pinson ,  Mohsen Salek ,  Charles Carlson ,  William T. Weaver ,  Helen R. Armer

IPC分类号： B65H1/00 ,  C23F1/00 ,  H01L21/306 ,  C23C16/00

CPC分类号： G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745

摘要： The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.

摘要翻译： 本发明总体上提供了一种用于使用容易配置的多室处理系统（例如，集群工具）处理衬底的装置和方法，具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片 处理历史（或晶圆历史），减少占地面积。 在一个实施例中，簇工具适于执行其中衬底被感光材料涂覆的轨道光刻工艺，然后转移到步进/扫描器，其将感光材料暴露于某种形式的辐射以形成图案 感光材料，然后在簇组工具中完成的显影过程中去除感光材料的某些部分。

公开(公告)号：US07819079B2

公开(公告)日：2010-10-26

申请号：US11530297

申请日：2006-09-08

申请人： Eric A. Englhardt ,  Michael R. Rice ,  Jeffrey C. Hudgens ,  Steve Hongkham ,  Jay D. Pinson ,  Mohsen Salek ,  Charles Carlson ,  William T Weaver ,  Helen R. Armer

发明人： Eric A. Englhardt ,  Michael R. Rice ,  Jeffrey C. Hudgens ,  Steve Hongkham ,  Jay D. Pinson ,  Mohsen Salek ,  Charles Carlson ,  William T Weaver ,  Helen R. Armer

IPC分类号： B05C13/02 ,  H01L21/677 ,  C23C14/00

CPC分类号： G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745

摘要： The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that is easily configurable, has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, and then certain portions of the photosensitive material are removed in a developing process completed in the cluster tool.

摘要翻译： 本发明总体上提供了一种用于使用容易配置的多室处理系统（例如，集群工具）处理衬底的装置和方法，具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片 处理历史（或晶圆历史），减少占地面积。 在一个实施例中，簇工具适于执行其中衬底被感光材料涂覆的轨道光刻工艺，然后转移到步进/扫描器，其将感光材料暴露于某种形式的辐射以形成图案 感光材料，然后在簇组工具中完成的显影过程中去除感光材料的某些部分。

公开(公告)号：US06709218B1

公开(公告)日：2004-03-23

申请号：US09324889

申请日：1999-06-03

申请人： Frederik W. Freerks ,  Tetsuya Ishikawa ,  Timothy Y. Wang ,  Jeffrey C. Hudgens ,  James R. Ciulik ,  Mohsen Salek ,  Tim Leong ,  Al DiFrancesco

发明人： Frederik W. Freerks ,  Tetsuya Ishikawa ,  Timothy Y. Wang ,  Jeffrey C. Hudgens ,  James R. Ciulik ,  Mohsen Salek ,  Tim Leong ,  Al DiFrancesco

IPC分类号： B65G4907

CPC分类号： H01L21/68707 ,  B25J9/107 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/141

摘要： The present invention generally provides a robot blade which provides a plurality of semi-conductive or conductive contacts disposed at least partially on the surface of the blade to support a substrate above the blade. The contacts are preferably located inwardly from the edge of the blade and toward the center of the blade to provide a collection area on the blade to capture any particles which may form. The blade is preferably made of a semi-conductive material, such as alumina or other semi-conductive material, to provide an electrical flow path through the contact(s) to discharge any electrical charge which may build up on the substrate during processing.

摘要翻译： 本发明通常提供一种机器人刀片，其提供多个半导体或导电触头，其至少部分地设置在刀片的表面上以支撑刀片上方的衬底。 触点优选地从叶片的边缘向内并朝向叶片的中心，以在叶片上提供收集区域，以捕获可能形成的任何颗粒。 叶片优选地由诸如氧化铝或其它半导体材料的半导体材料制成，以提供通过接触件的电流路径，以排出在加工期间可能积聚在衬底上的任何电荷。

公开(公告)号：US20060134330A1

公开(公告)日：2006-06-22

申请号：US11112932

申请日：2005-04-22

申请人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John Backer

发明人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John Backer

IPC分类号： C23C16/00

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20060278165A1

公开(公告)日：2006-12-14

申请号：US11458664

申请日：2006-07-19

申请人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： C23C16/00

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20060130750A1

公开(公告)日：2006-06-22

申请号：US11112281

申请日：2005-04-22

申请人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Mike Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Mike Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： C23C14/00 ,  B05C5/00 ,  B05C11/00

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20060286300A1

公开(公告)日：2006-12-21

申请号：US11458667

申请日：2006-07-19

申请人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John Backer

发明人： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue ,  John Backer

IPC分类号： B05D1/40 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US06390904B1

公开(公告)日：2002-05-21

申请号：US09082891

申请日：1998-05-21

申请人： Allan Gleason ,  Manoocher Birang ,  John Prince ,  Mohsen Salek ,  Syed Askari

发明人： Allan Gleason ,  Manoocher Birang ,  John Prince ,  Mohsen Salek ,  Syed Askari

IPC分类号： B24B500

CPC分类号： B24B37/32 ,  H01L21/30625

摘要： The present invention provides a retaining ring having an resilient liner for protecting the substrate edge from being damaged during chemical mechanical polishing and a method for making the same. Retainers made of wear resistant ceramics, such as alumina, provide better overall performance, including wear resistance, and reduced particle formation than other retaining ring materials. By incorporating a resilient liner, such as an epoxy, on the inner surface of the wear resistant ring, the substrate edge is protected from damage that can be easily caused by the hard surface of the ceramic alone.

摘要翻译： 本发明提供了一种保持环，其具有用于保护基板边缘在化学机械抛光期间不被损坏的弹性衬垫及其制造方法。 由耐磨陶瓷制成的保持件，如氧化铝，提供比其他保持环材料更好的整体性能，包括耐磨性和减少的颗粒形成。 通过在耐磨环的内表面上并入弹性衬垫，例如环氧树脂，可以保护衬底边缘免受仅由陶瓷硬表面容易引起的损伤。

公开(公告)号：US06334229B1

公开(公告)日：2002-01-01

申请号：US09227272

申请日：1999-01-07

申请人： Mansour Moinpour ,  Hoang T. Nguyen ,  Mohsen Salek ,  Young C. Park ,  Tom Bramblett ,  John M. deLarios ,  Lynn S. Ryle ,  Donald E. Anderson ,  Wilbur C. Krusell

发明人： Mansour Moinpour ,  Hoang T. Nguyen ,  Mohsen Salek ,  Young C. Park ,  Tom Bramblett ,  John M. deLarios ,  Lynn S. Ryle ,  Donald E. Anderson ,  Wilbur C. Krusell

IPC分类号： B01B1102

CPC分类号： H01L21/67046 ,  B08B1/04 ,  G11B23/505 ,  H01L21/67028 ,  Y10S134/902

摘要： An apparatus for cleaning edges of substrates is described. The present invention provides a cleaning mechanism that cleans particles off the edge of the wafer based on friction and/or a difference in tangential velocity at a point of contact between the wafer and the cleaning mechanism.

摘要翻译： 描述了一种用于清洁基板边缘的装置。 本发明提供了一种清洁机构，其基于晶片和清洁机构之间的接触点处的摩擦和/或切向速度差来清除晶片边缘的颗粒。

公开(公告)号：US20090023297A1

公开(公告)日：2009-01-22

申请号：US11779844

申请日：2007-07-18

申请人： Mohsen Salek

发明人： Mohsen Salek

IPC分类号： H01L21/30

CPC分类号： H01L21/0276 ,  G03F7/162

摘要： A system for dispensing an adhesion promoting chemical includes a support plate configured to support a substrate and a dispense nozzle in fluid communication with a source of the adhesion promoting chemical, for example, HMDS. The dispense nozzle is positioned adjacent a peripheral portion of the substrate and at a first radial distance. The system also includes an exhaust aperture in fluid communication with a system exhaust. The exhaust aperture is positioned adjacent to dispense nozzle and at a second radial distance greater than the first radial distance.

摘要翻译： 用于分配粘附促进化学品的系统包括支撑板，该支撑板构造成支撑基底和与粘附促进化学品源（例如HMDS）流体连通的分配喷嘴。 分配喷嘴邻近基板的周边部分并且在第一径向距离处定位。 该系统还包括与系统排气流体连通的排气孔。 排气孔定位成与分配喷嘴相邻并且在大于第一径向距离的第二径向距离处。