公开(公告)号：US08143713B2

公开(公告)日：2012-03-27

申请号：US12662268

申请日：2010-04-08

申请人： Eun-Seok Song ,  YoungHoon Ro

发明人： Eun-Seok Song ,  YoungHoon Ro

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L27/10 ,  H01L29/73 ,  H01L29/40

CPC分类号： H01L23/49855 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a chip-on-board package. The chip-on-board package may include a board, a grounding pad on a first surface of the board, the grounding pad including a body portion and at least one line portion, and at least two conductive pads on the first surface, the at least two conductive pads being arranged adjacent to the body portion. The at least one line portion may extend between the at least two conductive pads and the at least one line portion may have a narrower width than the at least two conductive pads.

摘要翻译： 提供了一个芯片组的封装。 板上芯片封装可以包括板，板的第一表面上的接地焊盘，接地焊盘包括主体部分和至少一个线部分，以及在第一表面上的至少两个导电焊盘， 至少两个导电焊盘被布置成与主体部分相邻。 所述至少一个线部分可以在所述至少两个导电焊盘之间延伸，并且所述至少一个线部分可以具有比所述至少两个导电焊盘窄的宽度。

公开(公告)号：US20100270657A1

公开(公告)日：2010-10-28

申请号：US12662268

申请日：2010-04-08

申请人： Eun-Seok Song ,  YoungHoon Ro

发明人： Eun-Seok Song ,  YoungHoon Ro

IPC分类号： H01L23/48

CPC分类号： H01L23/49855 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided is a chip-on-board package. The chip-on-board package may include a board, a grounding pad on a first surface of the board, the grounding pad including a body portion and at least one line portion, and at least two conductive pads on the first surface, the at least two conductive pads being arranged adjacent to the body portion. The at least one line portion may extend between the at least two conductive pads and the at least one line portion may have a narrower width than the at least two conductive pads.

摘要翻译： 提供了一个芯片组的封装。 板上芯片封装可以包括板，板的第一表面上的接地焊盘，接地焊盘包括主体部分和至少一个线部分，以及在第一表面上的至少两个导电焊盘， 至少两个导电焊盘被布置成与主体部分相邻。 所述至少一个线部分可以在所述至少两个导电焊盘之间延伸，并且所述至少一个线部分可以具有比所述至少两个导电焊盘窄的宽度。

公开(公告)号：US20120074566A1

公开(公告)日：2012-03-29

申请号：US13188069

申请日：2011-07-21

申请人： HanShin Youn ,  Yonghwan Kwon ,  YoungHoon Ro ,  Woojae Kim ,  Sungwoo Park

发明人： HanShin Youn ,  Yonghwan Kwon ,  YoungHoon Ro ,  Woojae Kim ,  Sungwoo Park

IPC分类号： H01L23/498 ,  H01L23/48

CPC分类号： H01L24/03 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

摘要翻译： 示例性实施例涉及半导体封装。 半导体封装包括第一衬底，其包括第一焊盘，与第一衬底向上间隔开的第二衬底，并且包括与第一焊盘相对的第二焊盘。 至少一个电极耦合在第一焊盘和第二焊盘之间。 半导体封装包括形成在第一基板和第二基板之间的电极的周边处的引导环。

公开(公告)号：US09418914B2

公开(公告)日：2016-08-16

申请号：US14014810

申请日：2013-08-30

申请人： YoungHoon Ro ,  Seung Hwan Kim ,  Jung-Ho Park

发明人： YoungHoon Ro ,  Seung Hwan Kim ,  Jung-Ho Park

IPC分类号： H05K7/00 ,  H01L23/48 ,  H01L23/498

CPC分类号： H01L23/49855 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/45144 ,  H01L2224/48228 ,  H01L2924/014 ,  H01L2924/00

摘要： Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.

摘要翻译： 提供包装衬底，包括封装衬底的半导体封装以及用于制造半导体封装的方法。 封装基板可以包括芯，芯包括设置有半导体芯片的第一表面和与第一表面相对的第二表面。 封装衬底还可以包括在芯的第二表面上的金属焊盘。 金属垫可以包括盐水耐腐蚀表面。

公开(公告)号：US08823185B2

公开(公告)日：2014-09-02

申请号：US13244326

申请日：2011-09-24

申请人： In Won O ,  Woojae Kim ,  YoungHoon Ro ,  HanShin Youn ,  Yechung Chung ,  YunSeok Choi

发明人： In Won O ,  Woojae Kim ,  YoungHoon Ro ,  HanShin Youn ,  Yechung Chung ,  YunSeok Choi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/28

CPC分类号： H01L23/49531 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4903 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.

摘要翻译： 提供一种半导体封装，包括：安装在管芯焊盘上的半导体芯片; 至少一个引线与半导体芯片电连接; 以及柔性膜基板，其具有使所述半导体芯片和所述至少一个引线电连接的金属布线，其中所述半导体芯片通过与所述半导体芯片和所述金属布线接触的第一连接构件与所述薄膜基板电连接; 并且所述薄膜基板通过接触所述金属布线和所述至少一个引线的第二连接构件电连接到所述至少一个引线。

公开(公告)号：US08587108B2

公开(公告)日：2013-11-19

申请号：US13188069

申请日：2011-07-21

申请人： HanShin Youn ,  Yonghwan Kwon ,  YoungHoon Ro ,  Woojae Kim ,  Sungwoo Park

发明人： HanShin Youn ,  Yonghwan Kwon ,  YoungHoon Ro ,  Woojae Kim ,  Sungwoo Park

IPC分类号： H01L21/60

CPC分类号： H01L24/03 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.