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公开(公告)号：US12235579B2
公开(公告)日：2025-02-25
申请号：US17548595
申请日：2021-12-13
Applicant: FUJIFILM Corporation
Inventor： Keiyu Ou , Naohiro Tango , Kei Yamamoto , Kazuhiro Marumo
IPC: G03F7/004 , C07C309/17 , C07C309/42 , C07C311/09 , C07C311/48 , C07C311/51 , C07C381/12 , C07D327/06 , C07D327/08 , C07D333/46 , C07D333/76 , C08F220/18 , C08F220/28 , G03F7/038 , G03F7/039
Abstract: A method for producing an actinic ray-sensitive or radiation-sensitive resin composition of an embodiment of the present invention is a method for producing an actinic ray-sensitive or radiation-sensitive resin composition including at least a resin having a polarity that increases due to decomposition by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, and a solvent, in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more compounds selected from the group consisting of a compound (I) to (III) below, and the actinic ray-sensitive or radiation-sensitive resin composition is produced by mixing a first solution including the resin having a polarity that increases by the action of an acid and a first solvent with the one or more compounds selected from the group consisting of the compound (I) to (III).
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公开(公告)号：US12216404B2
公开(公告)日：2025-02-04
申请号：US17106170
申请日：2020-11-29
Applicant: FUJIFILM Corporation
Inventor： Masafumi Kojima , Minoru Uemura , Takashi Kawashima , Akiyoshi Goto , Kei Yamamoto , Kazuhiro Marumo , Keiyu Ou
Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator A that generates an acid represented by General Formula (I), the acid having a pKa of −1.00 or more; one or more selected from the group consisting of a photoacid generator B that generates an acid having a pKa larger than that of an acid generated from the photoacid generator A by 1.00 or more, and a nitrogen-containing compound C having a pKa of a conjugate acid thereof larger than that of the acid generated from the photoacid generator A by 1.00 or more; and an acid-decomposable resin, in which in a case where the actinic ray-sensitive or radiation-sensitive resin composition includes a photoacid generator D that generates an acid having a pKa of less than −1.00, a ratio of the number of moles of the photoacid generator A to the number of moles of the photoacid generator D in the composition, is 1.0 or more.
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公开(公告)号：US09952509B2
公开(公告)日：2018-04-24
申请号：US15200059
申请日：2016-07-01
Applicant: FUJIFILM Corporation
Inventor： Keita Kato , Keiyu Ou , Michihiro Shirakawa , Akiyoshi Goto , Masafumi Kojima
CPC classification number: G03F7/0397 , G03F7/0045 , G03F7/0046 , G03F7/11 , G03F7/2035 , G03F7/2041 , G03F7/322 , G03F7/325
Abstract: The present invention relates to a pattern forming method including: forming a film using an actinic ray-sensitive or radiation-sensitive resin composition that includes a (A) resin which has an increase in the polarity by the action of an acid, and thus, has a decrease in the solubility in a developer containing an organic solvent, a (B) compound capable of generating an acid upon irradiation with specific actinic ray or radiation, and a (C) solvent, exposing the film, and developing the exposed film using a developer including an organic solvent, in which the resin (A) has a structure in which a polar group is protected with a leaving group which decomposes to leave by the action of an acid, and the leaving group is a group represented by the following General Formula (I).
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公开(公告)号：US20210294217A1
公开(公告)日：2021-09-23
申请号：US17320398
申请日：2021-05-14
Applicant: FUJIFILM Corporation
Inventor： Akiyoshi Goto , Masafumi Kojima , Minoru Uemura , Kei Yamamoto , Yasuharu Shiraishi , Keiyu Ou
Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes an acid-decomposable resin and a compound that generates an acid upon irradiation with actinic rays or radiation, in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more selected from the group consisting of a compound (I) to a compound (III), and one or more selected from the group consisting of a compound represented by General Formula (1) and a compound represented by General Formula (2).
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公开(公告)号：US11073762B2
公开(公告)日：2021-07-27
申请号：US16432279
申请日：2019-06-05
Applicant: FUJIFILM Corporation
Inventor： Daisuke Asakawa , Akiyoshi Goto , Masafumi Kojima , Keita Kato , Keiyu Ou , Kyohei Sakita
IPC: G03F7/038 , G03F7/004 , G03F7/039 , G03F7/20 , C09K3/00 , C08F220/26 , C07C309/17 , C07C381/12 , C07C309/12 , C07C309/19
Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a photoacid generator that generates an acid having a pKa of −1.40 or more upon irradiation with actinic rays or radiation, and (B) a resin having a repeating unit containing an acid-decomposable group, in which an Eth sensitivity of the repeating unit containing an acid-decomposable group is 5.64 or less, and which can provide very excellent roughness performance, exposure latitude, and depth of focus, particularly, in the formation of an ultrafine pattern; a photoacid generator; and an actinic ray-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
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Patent Agency Ranking
公开(公告)号：US10859914B2
公开(公告)日：2020-12-08
申请号：US15657295
申请日：2017-07-24
Applicant: FUJIFILM Corporation
Inventor： Naoya Hatakeyama , Akiyoshi Goto , Michihiro Shirakawa , Keita Kato , Keiyu Ou
Abstract: A method for producing an electronic device includes the pattern forming method, and an actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development. Specifically, provided is a pattern forming method, including a film forming step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition, an exposure step of irradiating the film, and a development step of developing the film using a developer containing an organic solvent, in which the composition contains a resin containing a repeating unit having an Si atom and a repeating unit having an acid-decomposable group and a compound capable of generating an acid upon irradiation with actinic rays or radiation, the content of Si atoms in the resin is 1.0 to 30 mass %, and the content of the resin in the total solid content of the composition is 20 mass % or more.
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公开(公告)号：US10649329B2
公开(公告)日：2020-05-12
申请号：US15384521
申请日：2016-12-20
Applicant: FUJIFILM Corporation
Inventor： Shohei Kataoka , Akinori Shibuya , Keiyu Ou
IPC: G03F7/004 , G03F7/38 , G03F7/40 , G03F7/038 , G03F7/039 , G03F7/09 , G03F7/16 , G03F7/20 , G03F7/32
Abstract: An active-light-sensitive or radiation-sensitive resin composition includes a basic compound (A) corresponding to at least one of the following basic compound (A1) or (A2): (A1) a nonionic compound having an alicyclic structure (a1) and a basic site (b2) at a site different from the alicyclic structure within one molecule, or (A2) a nonionic compound having a heterocyclic structure (a2) having no basicity and a basic site (b2) at a site different from the heterocyclic structure within one molecule.
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公开(公告)号：US20190294043A1
公开(公告)日：2019-09-26
申请号：US16432279
申请日：2019-06-05
Applicant: FUJIFILM Corporation
Inventor： Daisuke Asakawa , Akiyoshi Goto , Masafumi Kojima , Keita Kato , Keiyu Ou , Kyohei Sakita
Abstract: Provided are an actinic ray-sensitive or radiation-sensitive resin composition which contains (A) a photoacid generator that generates an acid having a pKa of −1.40 or more upon irradiation with actinic rays or radiation, and (B) a resin having a repeating unit containing an acid-decomposable group, in which an Eth sensitivity of the repeating unit containing an acid-decomposable group is 5.64 or less, and which can provide very excellent roughness performance, exposure latitude, and depth of focus, particularly, in the formation of an ultrafine pattern; a photoacid generator; and an actinic ray-sensitive or radiation-sensitive film, a pattern forming method, and a method for manufacturing an electronic device, each using the actinic ray-sensitive or radiation-sensitive resin composition.
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公开(公告)号：US10025186B2
公开(公告)日：2018-07-17
申请号：US15444471
申请日：2017-02-28
Applicant: FUJIFILM Corporation
Inventor： Akiyoshi Goto , Masafumi Kojima , Keita Kato , Keiyu Ou , Michihiro Shirakawa
IPC: G03F7/004 , G03F7/038 , G03F7/16 , G03F7/38 , G03F7/32 , G03F7/40 , G03F7/20 , C08F220/28 , C08F220/18 , C08F220/36 , C08F220/26 , G03F7/039 , H01L21/027
Abstract: The present invention has an object to provide an active-light-sensitive or radiation-sensitive resin composition having high DOF and low LWR; a pattern forming method using the composition; and a method for manufacturing an electronic device. The active-light-sensitive or radiation-sensitive resin composition of the present invention includes a resin P and a compound that generates an acid upon irradiation with active light or radiation, in which the resin P has a repeating unit p1 and a repeating unit p2 represented by specific formulae, and the repeating unit p2 does not have a group in which a hydroxy group of a hydroxyadamantyl group is protected with a group that decomposes by the action of an acid to leave.
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公开(公告)号：US09791777B2
公开(公告)日：2017-10-17
申请号：US15234489
申请日：2016-08-11
Applicant: FUJIFILM Corporation
Inventor： Akiyoshi Goto , Masafumi Kojima , Michihiro Shirakawa , Keita Kato , Keiyu Ou
IPC: G03F7/004 , C08F220/28 , G03F7/039 , G03F7/30 , G03F7/26 , C08F22/10 , G03F7/11 , G03F7/20 , G03F7/32 , C08F220/68 , C08F224/00 , G03F7/038
CPC classification number: G03F7/0397 , C08F22/10 , C08F220/68 , C08F224/00 , G03F7/038 , G03F7/0392 , G03F7/0395 , G03F7/11 , G03F7/2041 , G03F7/2053 , G03F7/26 , G03F7/30 , G03F7/325
Abstract: The actinic ray-sensitive or radiation-sensitive resin composition of the present invention contains a resin (P) including a repeating unit (i) having a group which decomposes by the action of an acid represented by the following General Formula (1), a pattern forming method using the composition, a method for manufacturing an electronic device, and an electronic device.
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