公开(公告)号：US09472527B2

公开(公告)日：2016-10-18

申请号：US14589413

申请日：2015-01-05

申请人： FUJITSU LIMITED

发明人： Toshiya Akamatsu ,  Muneyuki Odaira

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/11903 ,  H01L2224/13012 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2224/13647 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/1601 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/8118 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： Surfaces of a semiconductor chip and a circuit board are made to face each other, and upper portions of stoppers of the circuit board are fit into regions between adjacent stoppers of rail grooves of the semiconductor chip, and upper portions of the stoppers of the semiconductor chip are fit into regions between the adjacent stoppers of rail grooves of the circuit board, whereby side surfaces of first terminals of the semiconductor chip and side surfaces of second terminals of the circuit board are electrically connected.

摘要翻译： 将半导体芯片和电路板的表面相互面对，并且将电路板的止动件的上部配合到半导体芯片的轨道槽的相邻止动件之间的区域中，并且半导体芯片的止动件的上部 配合在电路板的轨道槽的相邻挡块之间的区域中，由此半导体芯片的第一端子的侧表面和电路板的第二端子的侧表面电连接。

公开(公告)号：US20150221607A1

公开(公告)日：2015-08-06

申请号：US14589413

申请日：2015-01-05

申请人： FUJITSU LIMITED

发明人： TOSHIYA AKAMATSU ,  Muneyuki Odaira

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L24/16 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/11903 ,  H01L2224/13012 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2224/13647 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/1601 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/8118 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： Surfaces of a semiconductor chip and a circuit board are made to face each other, and upper portions of stoppers of the circuit board are fit into regions between adjacent stoppers of rail grooves of the semiconductor chip, and upper portions of the stoppers of the semiconductor chip are fit into regions between the adjacent stoppers of rail grooves of the circuit board, whereby side surfaces of first terminals of the semiconductor chip and side surfaces of second terminals of the circuit board are electrically connected.

摘要翻译： 将半导体芯片和电路板的表面相互面对，并且将电路板的止动件的上部配合到半导体芯片的轨道槽的相邻止动件之间的区域中，并且半导体芯片的止动件的上部 配合在电路板的轨道槽的相邻挡块之间的区域中，由此半导体芯片的第一端子的侧表面和电路板的第二端子的侧表面电连接。

公开(公告)号：US20140159235A1

公开(公告)日：2014-06-12

申请号：US14073144

申请日：2013-11-06

申请人： FUJITSU LIMITED

发明人： Muneyuki Odaira

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L21/563 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0345 ,  H01L2224/039 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11614 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/11902 ,  H01L2224/11903 ,  H01L2224/13005 ,  H01L2224/13007 ,  H01L2224/13011 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/13564 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16503 ,  H01L2224/16507 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01327 ,  H01L2924/00

摘要： An electronic component includes an electrode portion and a solder portion formed on the electrode portion. In the electronic component, the electrode portion includes a first conductive portion and a second conductive portion each having different diffusion coefficient with respect to a component of the solder portion on a top surface of the electrode portion, and the solder portion is formed on the first conductive portion and the second conductive portion.

摘要翻译： 电子部件包括在电极部上形成的电极部和焊料部。 在电子部件中，电极部包括第一导电部和第二导电部，所述第一导电部和第二导电部相对于电极部的顶面上的焊料部的成分具有不同的扩散系数，焊料部形成在第一导电部 导电部分和第二导电部分。