公开(公告)号：US20150371962A1

公开(公告)日：2015-12-24

申请号：US14734267

申请日：2015-06-09

Applicant: FUJITSU LIMITED

Inventor： TOSHIYA AKAMATSU

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/11 ,  H01L2224/0361 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/11826 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/11906 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2224/1368 ,  H01L2224/13681 ,  H01L2224/13684 ,  H01L2224/13686 ,  H01L2224/16145 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/81075 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/81951 ,  H01L2224/92127 ,  H01L2224/92225 ,  H01L2924/3512 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/053

Abstract: A terminal structure includes: a pillar containing a first metal material; and a cover layer covering an upper surface and a side surface of the pillar, the cover layer containing a second metal material into which a solder material diffuses more slowly than into the first metal material.And the terminal structure further includes a bonding layer over the cover layer, the bonding layer containing a metal material capable of solder bonding.

Abstract translation: 端子结构包括：包含第一金属材料的柱; 以及覆盖所述柱的上表面和侧表面的覆盖层，所述覆盖层包含第二金属材料，焊料材料比所述第一金属材料扩散更慢地扩散到所述第二金属材料中。 并且端子结构还包括覆盖层上的接合层，该接合层包含能够焊接的金属材料。

公开(公告)号：US20170250153A1

公开(公告)日：2017-08-31

申请号：US15397314

申请日：2017-01-03

Applicant: FUJITSU LIMITED

Inventor： Ryo Kikuchi ,  TOSHIYA AKAMATSU

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L23/3121 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13007 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1403 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/85447 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/05442 ,  H01L2924/13091 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/013 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01022 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/06

Abstract: An electronic part includes a substrate, an insulating film formed over the substrate, a first pillar electrode, a first solder formed over the first pillar electrode, a second pillar electrode, and a second solder formed over the second pillar electrode. The first pillar electrode over which the first solder is formed is formed over a first region of an insulating film including a level difference between a first opening portion and a peripheral portion of the first opening portion. The second pillar electrode over which the second solder is formed is formed over a second region of the insulating film including a second opening portion whose opening area is larger than that of the first opening portion. For example, the second pillar electrode over which the second solder is formed is formed over the second opening portion of the insulating film.

公开(公告)号：US20150221607A1

公开(公告)日：2015-08-06

申请号：US14589413

申请日：2015-01-05

Applicant: FUJITSU LIMITED

Inventor： TOSHIYA AKAMATSU ,  Muneyuki Odaira

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05166 ,  H01L2224/05647 ,  H01L2224/06102 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11901 ,  H01L2224/11903 ,  H01L2224/13012 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2224/13647 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/1601 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/81141 ,  H01L2224/8118 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: Surfaces of a semiconductor chip and a circuit board are made to face each other, and upper portions of stoppers of the circuit board are fit into regions between adjacent stoppers of rail grooves of the semiconductor chip, and upper portions of the stoppers of the semiconductor chip are fit into regions between the adjacent stoppers of rail grooves of the circuit board, whereby side surfaces of first terminals of the semiconductor chip and side surfaces of second terminals of the circuit board are electrically connected.

Abstract translation: 将半导体芯片和电路板的表面相互面对，并且将电路板的止动件的上部配合到半导体芯片的轨道槽的相邻止动件之间的区域中，并且半导体芯片的止动件的上部 配合在电路板的轨道槽的相邻挡块之间的区域中，由此半导体芯片的第一端子的侧表面和电路板的第二端子的侧表面电连接。