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1.发明申请ELECTRICAL CONTACT MATERIAL, METHOD OF PRODUCING AN ELECTRICAL CONTACT MATERIAL, AND TERMINAL 审中-公开电接触材料，生产电接触材料的方法和端子公开(公告)号：US20170076834A1
公开(公告)日：2017-03-16
申请号：US15363518
申请日：2016-11-29
Inventor： Yoshikazu OKUNO , Yoshiaki KOBAYASHI , Tatsuya NAKATSUGAWA , Kengo MITOSE , Akira TACHIBANA , Shingo KAWATA
IPC: H01B1/02 , C25D3/12 , C25D3/38 , C25D3/30 , C22F1/08 , C25D5/50 , C25D7/00 , C22F1/16 , C22F1/10 , B32B15/01 , C25D5/12
CPC classification number: H01B1/026 , B21D53/00 , B32B15/018 , C22F1/08 , C22F1/10 , C22F1/16 , C25D3/12 , C25D3/30 , C25D3/38 , C25D5/12 , C25D5/34 , C25D5/50 , C25D5/505 , C25D7/00 , H01H1/025 , H01H1/04
Abstract: An electrical contact material (10) having: a conductive substrate (1) formed from copper or a copper alloy; a first intermediate layer (2) provided on the conductive substrate (1); a second intermediate layer (3) provided on the first intermediate layer (2); and an outermost layer (4) formed from tin or a tin alloy and provided on the second intermediate layer (3), wherein the first intermediate layer (2) is constructed as one layer of grains extending from the conductive substrate (1) side to the second intermediate layer (3) side, and wherein, in the first intermediate layer (2), the density of grain boundaries (5b) extending in a direction in which the angle formed by the grain boundary in interest and the interface between the conductive substrate and the first intermediate layer is 45° or greater, is 4 μm/μm2 or less; a method of producing the same; and a terminal.
Abstract translation: 1.一种电接触材料（10），具有：由铜或铜合金形成的导电性基体（1） 设置在所述导电基板（1）上的第一中间层（2）; 设置在第一中间层（2）上的第二中间层（3） 以及由锡或锡合金形成并设置在第二中间层（3）上的最外层（4），其中第一中间层（2）被构造为从导电基板（1）侧延伸到一层晶粒 第二中间层（3）侧，并且其中在第一中间层（2）中，沿着由感兴趣的晶界形成的角度和导电性界面之间的界面延伸的晶界（5b）的密度 基板和第一中间层为45°以上，为4μm/μm2以下; 其制造方法; 和一个终端。
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2.发明申请公开(公告)号：US20160359244A1
公开(公告)日：2016-12-08
申请号：US14913850
申请日：2014-09-12
Inventor： Akira TACHIBANA
CPC classification number: H01R4/62 , H01R4/18 , H01R4/185 , H01R13/035 , H01R13/04 , H01R13/113 , H01R43/04 , H01R43/20 , H01R2201/26
Abstract: A terminal and connection structural body that can restrain galvanic corrosion occurring between a core wire of a covered electrical wire and a terminal formed of different types of metal, and that can ensure conductive function. The terminal includes a box part as a connection part connected to another terminal and a wire barrel part as a crimping part crimp-connected to a covered electrical wire. All of a non-contact part, including an end surface as a cut surface upon blanking a metal member, is covered with a resin covered part, where the non-contact part is other than a contact part with another terminal, a non-covered part, and a contact part with an end part as an exposed part of a core wire of a covered electrical wire, a non-covered part.
Abstract translation: 一种端子和连接结构体，其可以抑制在被覆电线的芯线和由不同类型的金属形成的端子之间发生电偶腐蚀，并且可以确保导电功能。 端子包括作为连接到另一端子的连接部分的盒部件和作为压接部分的线筒部分压接连接到被覆盖的电线。 所有的非接触部分，包括在冲压金属部件时作为切割面的端面，被树脂覆盖部分覆盖，其中非接触部分不是与另一端子的接触部分，未覆盖 部分，以及具有端部的接触部分，作为被覆电线的芯线的露出部分，未覆盖部分。
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3.发明申请Terminal, A Wire Connecting Structure and A Method of Manufacturing the Terminal 有权端子，A线连接结构和终端制造方法公开(公告)号：US20150357724A1
公开(公告)日：2015-12-10
申请号：US14831643
申请日：2015-08-20
Inventor： Yoshikazu OKUNO , Akira TACHIBANA , Kengo MITOSE
CPC classification number: H01R4/187 , B23K26/206 , B23K26/244 , B23K26/262 , B23K26/30 , B23K2101/34 , B23K2101/38 , B23K2103/08 , B23K2103/166 , C25D3/12 , C25D3/30 , C25D5/12 , C25D7/00 , H01R4/20 , H01R4/62 , H01R13/03 , H01R43/0221 , H01R43/16 , Y10T29/49215
Abstract: A terminal includes a connector portion, a tubular crimp portion that crimps/joins with a wire, and a transition portion joining the two portions. The tubular crimp portion is composed of a metal member including a base material of copper or copper alloy with 0.20-1.40 mm thickness and a coating layer of tin, tin alloy, nickel, nickel alloy, silver or silver alloy with 0.2-3.0 μm thickness formed on the base material. The tubular crimp portion has a weld portion formed by butt-welding and having, in its cross-section perpendicular to a terminal longitudinal direction, a phase existing therein of tin, tin alloy, nickel, nickel alloy, silver or silver alloy greater than 0.01 μm2. The tubular crimp portion is a closed tubular body with one end opposite to a wire-insertion-opening being closed.
Abstract translation: 端子包括连接器部分，与线接合/接合的管状压接部分和连接两部分的过渡部分。 管状压接部由金属构件构成，该金属构件包括厚度为0.20-1.40mm的铜或铜合金的基材，以及锡，锡合金，镍，镍合金，银或银合金的涂层，厚度为0.2-3.0μm 形成在基材上。 管状压接部分具有通过对接焊接形成的焊接部分，其垂直于端子纵向方向的横截面中存在锡，锡合金，镍，镍合金，银或银合金的相位大于0.01 μm2。 管状压接部分是封闭的管状体，其一端与导线插入开口相对地封闭。
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公开(公告)号：US20200328009A1
公开(公告)日：2020-10-15
申请号：US16909861
申请日：2020-06-23
Inventor： Akira TACHIBANA , Shoichi DANJO
Abstract: An insulated wire includes: a copper alloy conductor; and at least one resin layer directly or indirectly coated on an outer peripheral face of the copper alloy conductor, in which the copper alloy conductor has a composition where a total content of metal components selected from Al, Be, Cd, Mg, Pb, Ni, P, Sn, and Cr is from 0.1 to 2.0 ppm and content of copper is 99.96 mass % or higher, and has a specific texture where an average orientation density in an area where φ2=0 degrees, φ1=0 degrees, and ϕ=from 0 degrees to 90 degrees is from 3.0 to less than 35.0, and a maximum orientation density in an area where φ2=35 degrees, φ1=from 45 degrees to 55 degrees, and ϕ=from 65 degrees to 80 degrees is from 1.0 to less than 30.0.
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5.发明申请ELECTROLYTIC COPPER FOIL, NEGATIVE ELECTRODE FOR LITHIUM ION SECONDARY BATTERY, AND LITHIUM ION SECONDARY BATTERY 审中-公开电解铜箔，锂离子二次电池负极和锂离子二次电池公开(公告)号：US20160013493A1
公开(公告)日：2016-01-14
申请号：US14425346
申请日：2013-06-25
Applicant: Furukawa Electric Co., Ltd.
Inventor： Jun SHINOZAKI , Kimiko FUJISAWA , Akira TACHIBANA
IPC: H01M4/66 , H01M10/0525 , C25D7/06
CPC classification number: H01M4/661 , C22C9/00 , C25D1/04 , C25D3/38 , C25D7/0614 , C25D11/38 , H01M10/0525 , H01M2220/30 , Y10T428/12431 , Y10T428/24917
Abstract: Provided are an electrodeposited copper foil, a negative electrode that is for a lithium ion secondary battery, and a lithium ion secondary battery into which the electrode is incorporated. The electrodeposited copper foil exhibits good electrical conductivity and superior tensile strength, with no significant decline in tensile strength exhibited even after one hour of heating at 300° C. The negative electrode has heightened cycle properties due to the use of the electrodeposited copper foil as a current collector. Using x-ray diffraction, in the electrodeposited copper foil, in normal conditions, the diffraction intensity (I) in the orientation, the diffraction intensity (I) in the orientation, and the diffraction intensity (I) in the orientation, satisfy the following formula (1): I /{I +I +I }>0.13 (1).
Abstract translation: 提供了一种电沉积铜箔，用于锂离子二次电池的负极和其中结合有电极的锂离子二次电池。 电沉积铜箔表现出良好的导电性和优异的拉伸强度，即使在300℃下加热1小时后，拉伸强度也没有明显的下降。由于使用电沉积铜箔作为负极，所以负极具有提高的循环性能 集电器 在正常条件下，在电沉积铜箔中使用X射线衍射，在<220>取向的衍射强度（I）<220>，<200>取向的衍射强度（I）<200> <111>方向的衍射强度（I）<111>满足下式（1）：I <220> / {I 220> + I 200> I 111>} 0.13（1）。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20150357725A1
公开(公告)日：2015-12-10
申请号：US14831686
申请日：2015-08-20
Inventor： Ryosuke MATSUO , Akira TACHIBANA , Kengo MITOSE
IPC: H01R4/18 , H01R43/02 , H01R43/048
CPC classification number: C22C9/00 , C22C9/02 , C22C9/06 , H01R4/187 , H01R4/20 , H01R4/62 , H01R13/03 , H01R43/02 , H01R43/0221 , H01R43/048 , H01R43/16 , Y10T29/49215
Abstract: A terminal includes a connector portion electrically connectable to an external terminal, a tubular crimp portion formed integrally or separate from the connector portion and crimps with a wire, and a transition portion coupling the two. The tubular crimp portion of a copper or copper alloy metal base material or a metal member having the same is a tubular member closed on transition portion side and reduces in diameter towards the transition portion side such that a conductor-end portion of the electric wire is un-exposed. The tubular crimp portion has a belt-shaped weld portion along a longitudinal direction of the tubular crimp portion. A circumferential direction of the tubular crimp portion matches the RD-direction of the base material. A sum of area ratios R1, R2 and R3 in a rolling plane of the base material, of Cube-, RDW-, and Goss-oriented crystal grains, respectively, is greater than or equal to 15%.
Abstract translation: 端子包括可连接到外部端子的连接器部分，与连接器部分一体地或与连接器部分分离并与电线卷曲的管状压接部分，以及连接两者的过渡部分。 铜或铜合金金属基材或其金属构件的管状压接部分是在过渡部分侧封闭的管状构件，并且朝向过渡部分侧直径减小，使得电线的导体端部为 未曝光 管状压接部具有沿管状压接部的长度方向的带状焊接部。 管状压接部的圆周方向与基材的RD方向一致。 基体材料的Cube，RDW和Goss取向晶粒分别的滚动平面中的面积比R1，R2和R3的总和分别大于或等于15％。
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7.发明申请公开(公告)号：US20160172811A1
公开(公告)日：2016-06-16
申请号：US15051943
申请日：2016-02-24
Inventor： Akira TACHIBANA , Kengo MITOSE , Kyota SUSAI , Takao TATEYAMA , Yukihiro KAWAMURA , Takashi TONOIKE , Masakazu KOZAWA , Takuro YAMADA
IPC: H01R43/048
CPC classification number: H01R43/048 , H01R4/183 , H01R4/187 , H01R4/62 , H01R13/03 , H01R43/02 , H01R43/0488 , Y10T29/49183
Abstract: In an electrical wire connecting structure and a method of manufacturing the electrical wire connecting structure, a terminal having a tube-shaped portion of 2.0 mm in inner diameter is prepared for an electrical wire having a conductor cross-sectional area of 0.72 to 1.37 mm2, the electrical wire 13 is inserted into an electrical wire insertion port of the tube-shaped portion of the electrical wire, and the tube-shaped portion and the core wire portion of the electrical wire are compressed to be crimp-connected to each other. Furthermore, a terminal having a tube-shaped portion of 3.0 mm in inner diameter is prepared for an electrical wire having a conductor cross-sectional area of 1.22 to 2.65 mm2, the electrical wire is inserted into the electrical wire insertion port of the tube-shaped portion 25 of the electrical wire, and the tube-shaped portion and the core wire portion of the electrical wire are compressed to be crimp-connected to each other.
Abstract translation: 在电线连接结构和制造电线连接结构的方法中，准备具有导体截面积为0.72至1.37mm 2的电线的内径为2.0mm的管状部分的端子， 电线13被插入到电线的管状部分的电线插入口中，并且电线的管状部分和芯线部分被压缩成彼此压接。 另外，对于导体截面积为1.22〜2.65mm 2的电线，准备内径为3.0mm的管状部的端子，将电线插入管状导线插入口， 并且电线的管状部分和芯线部分被压缩成彼此压接。
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8.发明申请Metal Member, A Terminal, A Wire Connecting Structure and A Method of Manufacturing A Terminal 有权金属构件，A端子，A线连接结构和制造端子的方法公开(公告)号：US20150357723A1
公开(公告)日：2015-12-10
申请号：US14829317
申请日：2015-08-18
Inventor： Akira TACHIBANA , Kengo MITOSE , Chikanobu IKUTA
CPC classification number: H01R4/187 , B23K26/32 , B23K26/322 , B23K2101/34 , B23K2101/38 , B23K2103/08 , B23K2103/12 , B32B15/04 , B32B15/043 , B32B15/20 , B32B2250/03 , B32B2307/20 , C22C9/00 , C22C9/06 , C25D3/12 , C25D3/30 , C25D5/16 , C25D5/48 , C25D7/00 , H01R4/20 , H01R4/62 , H01R13/03 , H01R43/0221 , H01R43/16 , Y10T29/49215 , Y10T428/12472
Abstract: A metal member includes a base material composed of one of copper and a copper alloy, a white metal layer provided on the base material at a part or an entirety thereof, and an oil film provided on the white metal layer. The white metal layer has a thickness of 0.01 μm to 0.80 μm. A surface of the white metal layer has an arithmetic mean roughness of 0.6 μm to 1.2 μm. The oil film has an electric double-layer capacitance of 1.5 μF/cm2 to 7.0 μF/cm2.
Abstract translation: 金属构件包括由铜和铜合金中的一种构成的基材，在其一部分或全部设置在基材上的白色金属层和设置在白色金属层上的油膜。 白色金属层的厚度为0.01μm〜0.80μm。 白色金属层的表面的算术平均粗糙度为0.6μm〜1.2μm。 油膜的电双层电容为1.5μF/ cm 2〜7.0μF/ cm 2。
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9.发明申请LEAD FRAME FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF PRODUCING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE 审中-公开用于光学半导体器件的引线框架，其制造方法和光学半导体器件公开(公告)号：US20130099270A1
公开(公告)日：2013-04-25
申请号：US13714000
申请日：2012-12-13
Applicant: Furukawa Electric Co., Ltd.
Inventor： Yoshiaki KOBAYASHI , Akira MATSUDA , Satoshi SUZUKI , Shin KIKUCHI , Akira TACHIBANA , Satoru ZAMA
IPC: H01L33/60
CPC classification number: H01L33/60 , C25D3/12 , C25D3/38 , C25D3/46 , C25D3/64 , C25D5/022 , C25D5/10 , C25D5/12 , C25D5/34 , C25D5/36 , C25D5/44 , C25D5/48 , C25D5/50 , C25D7/08 , H01L33/486 , H01L2924/0002 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
Abstract: A lead frame for an optical semiconductor device, having a reflection layer at least on one side or each side of the outermost surface of a substrate, partially or entirely, in which the reflection layer has, on the outermost surface at least in a region where light emitted by an optical semiconductor element is reflected, a microstructure with at least the surface thereof having been mechanically deformed, which is converted from a plating microstructure formed of a metal or an alloy thereof; a method of producing the same, and an optical semiconductor device having the same.
Abstract translation: 一种用于光学半导体器件的引线框架，其中反射层至少在基板的最外表面的一侧或每一侧上部分或全部地被反射层，其中反射层在其最外表面上至少在 由光学半导体元件发出的光被反射，其至少表面的机械变形的微观结构由金属或其合金形成的电镀微结构转变; 其制造方法和具有该半导体器件的光半导体器件。
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10.发明申请公开(公告)号：US20200212602A1
公开(公告)日：2020-07-02
申请号：US16817425
申请日：2020-03-12
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Akira TACHIBANA , Kenichi NAKAMURA , Hideo FUKUDA , Hirofumi OSHIMA
Abstract: Provided are an insulated wire material including: a conductor including a single core conductor or a plurality of divided conductors placed in parallel to each other or helically placed; and a peripheral insulating layer with which a periphery of the conductor is coated includes a welding member at at least one end portion of the conductor via a welded portion, a manufacturing method thereof, a coil including the insulated wire material, and electrical/electronic equipment including the coil.
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