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16 条记录 (耗时 0.022 秒)

    Direct air cooling system for airborne electronics
    1.
    发明授权
    Direct air cooling system for airborne electronics 失效
    用于机载电子设备的直接空气冷却系统

    公开(公告)号：US4674704A

    公开(公告)日：1987-06-23

    申请号：US804034

    申请日：1985-12-03

    申请人： Frank E. Altoz ,  John J. Buckley

    发明人： Frank E. Altoz ,  John J. Buckley

    IPC分类号： H05K7/20 ,  B64C21/02

    CPC分类号： H05K7/20136 ,  B64D2241/00 ,  Y10S62/05

    摘要： A direct air cooling system 12 for electronics carried by aircraft. The cooling system provides a submerged air scoop 16 which directs outside air to several electronic modules 14. The air flows through passages 76 in the modules 14 which are adjacent to circuit boards 74, 78 bearing discrete electronic components 88. A foil layer 86 and aluminum fin stock help transfer heat from the electronic components to the directed air. Heated air is then exhausted through exhaust port 24 or 28.

    摘要翻译： 由飞机运载的电子设备的直接空气冷却系统12。 冷却系统提供了一个浸没的空气勺16，其将外部空气引导到几个电子模块14.空气流过模块14中的通道76，模块14与承载离散电子部件88的电路板74,78相邻。箔层86和铝 散热片有助于将热量从电子部件传递到定向空气。 加热空气然后通过排气口24或28排出。

    Sliding compression air seal for removable electronic units
    2.
    发明授权
    Sliding compression air seal for removable electronic units 失效
    用于可移动电子单元的滑动压缩空气密封

    公开(公告)号：US4375290A

    公开(公告)日：1983-03-01

    申请号：US209555

    申请日：1980-11-24

    申请人： Alfred A. Zucchi ,  Frank E. Altoz ,  John W. Hughes

    发明人： Alfred A. Zucchi ,  Frank E. Altoz ,  John W. Hughes

    IPC分类号： H05K7/14 ,  H05K7/20 ,  F16J15/10

    CPC分类号： H05K7/20563 ,  H05K7/1418

    摘要： The compression air seal for containing air between equipment racks and electronic modules is described incorporating a metal base having a slot opening and an inclined or tapered upper surface with respect to the lower surface, a double layer of elastomeric material having two hardness values one upon the other in enclosing the opening and a coating of low-friction material over the upper elastomeric material to facilitate low friction when an electronic module having a tapered surface is slid over and compresses the seal.

    摘要翻译： 描述了用于在设备机架和电子模块之间容纳空气的压缩空气密封件，其结合有相对于下表面具有狭槽开口和倾斜或锥形上表面的金属底座，具有两层硬度值的双层弹性材料 另一个在封闭开口和在上弹性体材料上方的低摩擦材料涂层，以便当具有锥形表面的电子模块滑动并压缩密封件时便于低摩擦。

    Thermal switch
    3.
    发明授权
    Thermal switch 失效
    热开关

    公开(公告)号：US3957107A

    公开(公告)日：1976-05-18

    申请号：US553700

    申请日：1975-02-27

    申请人： Frank E. Altoz ,  Richard F. Porter

    发明人： Frank E. Altoz ,  Richard F. Porter

    IPC分类号： F28D15/06 ,  G05D23/01 ,  G05D23/19 ,  F28D15/00 ,  G05D23/00

    CPC分类号： F28F13/00 ,  F28D15/06 ,  G05D23/01 ,  G05D23/192 ,  F28F2013/008

    摘要： A sealed extensible bellows containing freon and a flexible wick provide a heat pipe, and fixed end of which is attached to a heat sink (a cold body), the other movable end of the bellows carries a thermally conductive plate that moves from a nonengaging relationship to an engaging relationship with a temperature regulated surface at a predetermined temperature of the cold body.

    摘要翻译： 包含氟利昂和柔性芯的密封可延伸波纹管提供热管，其固定端附接到散热器（冷体），波纹管的另一个可移动端承载从非啮合关系移动的导热板 在冷体的预定温度下与温度调节表面的接合关系。

    Flexible diaphragm cooling device for microwave antennas
    5.
    发明授权
    Flexible diaphragm cooling device for microwave antennas 失效
    柔性隔膜冷却装置用于微波天线

    公开(公告)号：US4851856A

    公开(公告)日：1989-07-25

    申请号：US156042

    申请日：1988-02-16

    申请人： Frank E. Altoz

    发明人： Frank E. Altoz

    IPC分类号： H01Q1/00

    CPC分类号： H01Q1/002

    摘要： The invention is a cooling apparatus for electronically steered phased array antennas in radar systems. The apparatus includes a rigid tube, used in multiplicity with a series of identical apparatus, located adjacent to the transmitter/receiver modules in the antenna and having a plurality of longitudinal slots. Flexible hoses are inserted into the tubes so that when a liquid coolant is introduced under pressure into the hoses, the fluid pressure will be sufficient to cause expansion of the flexible hose material enough so the material expands outward through the slots in the tubes and becomes flush against the side of the transmitter/receiver modules, thereby maximizing heat transfer between the modules and the liquid coolant.

    摘要翻译： 本发明是用于雷达系统中的电子转向相控阵天线的冷却装置。 该装置包括与一系列相同装置多重使用的刚性管，其位于天线中与发射器/接收器模块相邻并且具有多个纵向狭槽。 柔性软管被插入到管中，使得当液体冷却剂在压力下引入软管中时，流体压力将足以使柔性软管材料足够膨胀，使得材料通过管中的槽向外膨胀并且变成平齐 靠近发射器/接收器模块的侧面，从而最大限度地发挥模块和液体冷却剂之间的热传递。

    Module cooling system
    6.
    发明授权
    Module cooling system 失效
    模块冷却系统

    公开(公告)号：US5325913A

    公开(公告)日：1994-07-05

    申请号：US81712

    申请日：1993-06-25

    申请人： Frank E. Altoz

    发明人： Frank E. Altoz

    IPC分类号： F28D15/04 ,  F28D15/06 ,  H01L23/427 ,  H05K7/20 ,  F28D15/02

    CPC分类号： H01L23/4275 ,  F28D15/04 ,  F28D15/06 ,  H01L23/427 ,  H01L2924/0002 ,  Y10S165/911

    摘要： An apparatus is provided for cooling electronic components mounted on a cuit board. The circuit board is placed in thermal contact with a heat sink enclosure that has an interior cavity and a release opening that provides a path from the interior cavity to the external ambient. A meltable pellet blocks the release opening. A wick is bonded to the inside surface of the interior cavity. The device is sealed with a working fluid that permeates the wick. When the components get hot, the heat is transferred through the heat sink enclosure to the working fluid in the wick, causing the working fluid to vaporize. The vapors remain trapped in the interior cavity until the pellet melts, allowing the vapor to be released and the temperature of the heat sink enclosure to be stabilized or lowered.

    摘要翻译： 提供一种用于冷却安装在电路板上的电子部件的装置。 电路板被放置成与散热器外壳热接触，所述散热器外壳具有内部空腔和释放开口，其提供从内部空腔到外部环境的路径。 可熔颗粒堵塞释放口。 吸芯连接到内腔的内表面。 该装置用渗透到芯的工作流体密封。 当组件变热时，热量通过散热器外壳传递到芯中的工作流体，导致工作流体蒸发。 蒸汽仍然被困在内部空腔中，直到颗粒熔化，允许蒸汽被释放并且散热器壳体的温度被稳定或降低。

    Dual mode heat exchanger
    7.
    发明授权
    Dual mode heat exchanger 失效
    双模换热器

    公开(公告)号：US4635709A

    公开(公告)日：1987-01-13

    申请号：US804193

    申请日：1985-12-03

    申请人： Frank E. Altoz

    发明人： Frank E. Altoz

    IPC分类号： F28D15/02 ,  F28F13/18 ,  H05K7/20 ,  F28D15/00 ,  H01L23/44

    CPC分类号： F28D15/0233 ,  F28F13/18 ,  H05K7/20254 ,  F28F2245/04 ,  Y10S165/911 ,  Y10S165/912

    摘要： A dual mode heat exchanger 10 for cooling airborne electronics 12 through a cold plate 14. The heat exchanger either radiates heat to air through radiator fins 18 or absorbs heat by evaporative cooling. A liquid coolant contained in grooves 16 of the cold plate 14 boils at a preselected temperature and thereby absorbs heat energy. Vapor released by the boiling liquid is exhausted through a hydrophobic filter membrane 24.

    摘要翻译： 用于通过冷板14冷却机载电子设备12的双模式热交换器10.热交换器通过散热器散热片18将热量散发到空气中，或通过蒸发冷却吸收热量。 包含在冷板14的槽16中的液体冷却剂在预选温度下沸腾，从而吸收热能。 由沸腾液体释放的蒸气通过疏水性过滤膜24排出。

    Self-securing turbulence promoter to enhance heat transfer
    9.
    发明授权
    Self-securing turbulence promoter to enhance heat transfer 失效
    自固定湍流促进剂以增强热传递

    公开(公告)号：US4899812A

    公开(公告)日：1990-02-13

    申请号：US240282

    申请日：1988-09-06

    申请人： Frank E. Altoz

    发明人： Frank E. Altoz

    IPC分类号： B01F5/06 ,  F28F13/12

    CPC分类号： F28F13/12 ,  B01F5/0616 ,  Y10S165/53

    摘要： A device for positioning within the interior of a conduit for enhancing heat transfer between the conduit and an enclosed flowing coolant fluid comprised of a longitudinal member having a plurality of protuberances for generating turbulent flow within the conduit with the longitudinal member being resiliently secured within the conduit such that the force of the fluid flow will not displace the member.Design of the device is such that installation or removal from a tube may be easily accomplished by merely sliding the device in or out of the tube.

    摘要翻译： 一种用于定位在管道内部的装置，用于增强导管与封闭流动的冷却剂流体之间的热传递，包括具有多个突起的纵向构件，用于在导管内产生湍流，纵向构件弹性地固定在导管内 使得流体流动的力不会使构件移位。 设备的设计使得可以通过仅将设备滑入或移出管道容易地实现从管的安装或移除。

    Attitude independent evaporative cooling system
    10.
    发明授权
    Attitude independent evaporative cooling system 失效
    独立的蒸发冷却系统

    公开(公告)号：US4463409A

    公开(公告)日：1984-07-31

    申请号：US478124

    申请日：1983-03-22

    申请人： Frank E. Altoz ,  John J. Chino

    发明人： Frank E. Altoz ,  John J. Chino

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20009 ,  H05K7/20681

    摘要： An attitude independent, evaporative cooling system used in airborne systems for cooling electronic components. The coolant is water contained within ducts in heat transfer relationship with the electronic components. The ducts are sealed to water passage by porous membranes which permit passage of steam into a manifold which is sealed by a normally closed pressure relief valve. The relief valve is operable at a selected steam pressure which corresponds to the desired maximum operating temperature for the electronic components.

    摘要翻译： 用于机载系统冷却电子元件的独立的独立的蒸发冷却系统。 冷却剂是与电子部件传热关系的管道内的水。 管道通过多孔膜密封到水通道，允许蒸汽通过由常闭压力释放阀密封的歧管。 安全阀可以在对应于电子部件的期望最大工作温度的选定蒸汽压力下操作。