公开(公告)号：US20130099372A1

公开(公告)日：2013-04-25

申请号：US13280881

申请日：2011-10-25

申请人： Frank Kuechenmeister ,  Lothar Lehmann ,  Alexander Platz ,  Gotthard Jungnickel ,  Sven Kosgalwies

发明人： Frank Kuechenmeister ,  Lothar Lehmann ,  Alexander Platz ,  Gotthard Jungnickel ,  Sven Kosgalwies

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L23/49811 ,  H01L23/291 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03009 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05552

摘要： One illustrative method disclosed herein includes forming a conductive pad in a layer of insulating material, forming a passivation layer above the conductive pad, performing at least one etching process on the passivation layer to define an opening in the passivation layer that exposes at least a portion of the conductive pad, forming a protective layer on the passivation layer, in the opening and on the exposed portion of the conductive pad, forming a heat-curable material layer above the protective layer, performing an etching process to define a patterned heat-curable material layer having an opening that exposes a portion of the protective layer, performing an etching process on the protective layer to thereby expose at least a portion of the conductive pad and forming a conductive bump that is conductively coupled to the conductive pad.

摘要翻译： 本文公开的一种说明性方法包括在绝缘材料层中形成导电焊盘，在导电焊盘上形成钝化层，在钝化层上执行至少一个蚀刻工艺，以限定钝化层中的至少一部分 的导电焊盘，在导电焊盘的开口和暴露部分上在钝化层上形成保护层，在保护层上方形成可热固化的材料层，执行蚀刻工艺以限定图案化的可热固化 材料层具有露出所述保护层的一部分的开口，对所述保护层进行蚀刻处理，从而暴露所述导电焊盘的至少一部分，并形成与所述导电焊盘导电耦合的导电凸块。

公开(公告)号：US08580672B2

公开(公告)日：2013-11-12

申请号：US13280881

申请日：2011-10-25

申请人： Frank Kuechenmeister ,  Lothar Lehmann ,  Alexander Platz ,  Gotthard Jungnickel ,  Sven Kosgalwies

发明人： Frank Kuechenmeister ,  Lothar Lehmann ,  Alexander Platz ,  Gotthard Jungnickel ,  Sven Kosgalwies

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  H01L23/291 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03009 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05166 ,  H01L2224/05558 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11472 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/05552

摘要： One illustrative method disclosed herein includes forming a conductive pad in a layer of insulating material, forming a passivation layer above the conductive pad, performing at least one etching process on the passivation layer to define an opening in the passivation layer that exposes at least a portion of the conductive pad, forming a protective layer on the passivation layer, in the opening and on the exposed portion of the conductive pad, forming a heat-curable material layer above the protective layer, performing an etching process to define a patterned heat-curable material layer having an opening that exposes a portion of the protective layer, performing an etching process on the protective layer to thereby expose at least a portion of the conductive pad and forming a conductive bump that is conductively coupled to the conductive pad.

摘要翻译： 本文公开的一种说明性方法包括在绝缘材料层中形成导电焊盘，在导电焊盘上形成钝化层，在钝化层上执行至少一个蚀刻工艺，以限定钝化层中的至少一部分 的导电焊盘，在导电焊盘的开口和暴露部分上在钝化层上形成保护层，在保护层上方形成可热固化的材料层，执行蚀刻工艺以限定图案化的可热固化 材料层具有露出所述保护层的一部分的开口，对所述保护层进行蚀刻处理，从而暴露所述导电焊盘的至少一部分，并形成与所述导电焊盘导电耦合的导电凸块。

公开(公告)号：US08080293B2

公开(公告)日：2011-12-20

申请号：US12728047

申请日：2010-03-19

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

IPC分类号： H01R12/00

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US20090077807A1

公开(公告)日：2009-03-26

申请号：US12256060

申请日：2008-10-22

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David K. Fork ,  Eugene M. Chow

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David K. Fork ,  Eugene M. Chow

IPC分类号： B23P13/00

CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

公开(公告)号：US20120021170A1

公开(公告)日：2012-01-26

申请号：US13248660

申请日：2011-09-29

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

IPC分类号： B32B3/22

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US07943504B2

公开(公告)日：2011-05-17

申请号：US12256060

申请日：2008-10-22

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David K. Fork ,  Eugene M. Chow

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David K. Fork ,  Eugene M. Chow

IPC分类号： H01L21/4763

CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。

公开(公告)号：US08435612B2

公开(公告)日：2013-05-07

申请号：US13248660

申请日：2011-09-29

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

IPC分类号： B32B3/22

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US20100184311A1

公开(公告)日：2010-07-22

申请号：US12728047

申请日：2010-03-19

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

IPC分类号： H01R12/00

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US07730615B2

公开(公告)日：2010-06-08

申请号：US12037890

申请日：2008-02-26

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

IPC分类号： H01R43/16

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US20060076693A1

公开(公告)日：2006-04-13

申请号：US10959180

申请日：2004-10-07

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  David Fork ,  Eugene Chow

IPC分类号： H01L23/52

CPC分类号： G01R1/06716 ,  G01R3/00 ,  Y10T29/49609

摘要： According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

摘要翻译： 根据各种示例性实施例，公开了一种弹簧装置，其包括基板，设置在基板上的自放电层和设置在自放电层上的应力金属层，其中应力金属层内部的应力量 导致剥离力高于自释放层和应力金属层之间的粘附力。 此外，根据各种示例性实施例的制造弹簧装置的方法包括提供衬底，在衬底上提供自释放层，并在自释放层上方提供应力金属层，其中， 在本发明中也公开了应力金属层导致比自发层和应力金属层之间的粘附力高的剥离力。