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公开(公告)号：US08076166B2
公开(公告)日：2011-12-13
申请号：US12087291
申请日：2006-12-29
CPC分类号： H01S5/14 , H01L2224/48465 , H01L2224/49175 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , H01S3/109 , H01S5/005 , H01S5/0071 , H01S5/0206 , H01S5/02248 , H01S5/02272 , H01S5/02407 , H01S5/02415 , H01S5/02438 , H01S5/041 , H01S5/0612 , H01S5/183 , H01S5/4025 , H01L2924/00 , H01L2924/00012
摘要： A method for fabricating an optically pumped semiconductor apparatus, having the following steps: provision of a connection carrier assembly (50) comprising a plurality of connection carriers (14) which are permanently connected to one another mechanically, arrangement of a surface-emitting semiconductor body (1) on a connection carrier (14) in the connection carrier assembly (50), and separation of the connection carrier assembly (50) into individual semiconductor apparatuses.
摘要翻译： 一种用于制造光泵浦半导体器件的方法，具有以下步骤：提供包括多个连接载体（14）的连接载体组件（50），所述多个连接载体（14）机械地彼此永久连接，所述表面发射半导体主体 （1）连接在连接托架组件（50）中的连接托架（14）上，并且将连接托架组件（50）分离成单独的半导体设备。
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公开(公告)号：US20110032962A1
公开(公告)日：2011-02-10
申请号：US12809677
申请日：2008-11-19
CPC分类号： H01S5/02469 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4903 , H01L2224/49175 , H01S5/005 , H01S5/02208 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/06825 , H01S5/4031 , H01L2924/00014 , H01L2924/20755
摘要： The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).
摘要翻译： 本发明涉及一种包括激光棒（2），柔性导体支撑（10），金属或金属合金的支撑体（3）和散热器（4）的半导体激光器件，其布置在 支撑体（3）和激光棒（2），激光棒（2）由柔性导体支撑件（10）和支撑体（3）电连接，厚度至少为2mm。 本发明还涉及一种用于制造上述半导体激光器件的方法，其中使用同步焊接工艺来通过硬焊料层（30）将激光棒（2）焊接到散热器（4），并且 通过另外的硬焊料层（31）将散热片（4）连接到支撑体（3）上。
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公开(公告)号：US08411715B2
公开(公告)日：2013-04-02
申请号：US12809677
申请日：2008-11-19
CPC分类号： H01S5/02469 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/4903 , H01L2224/49175 , H01S5/005 , H01S5/02208 , H01S5/02248 , H01S5/02272 , H01S5/02276 , H01S5/06825 , H01S5/4031 , H01L2924/00014 , H01L2924/20755
摘要： The invention relates to a semiconductor laser device comprising a laser bar (2), a flexible conductor support (10), a supporting body (3) of a metal or a metal alloy and a heat sink (4), which is arranged between the supporting body (3) and the laser bar (2), the laser bar (2) being electrically contacted by the flexible conductor support (10) and the supporting body (3) having a thickness of at least 2 mm. The invention further relates to a method for producing the above-described semiconductor laser device, wherein a synchronous soldering process is used to solder the laser bar (2) to the heat sink (4) by means of a hard solder layer (30) and the heat sink (4) to the supporting body (3) by means of a further hard solder layer (31).
摘要翻译： 本发明涉及一种包括激光棒（2），柔性导体支撑（10），金属或金属合金的支撑体（3）和散热器（4）的半导体激光器件，其布置在 支撑体（3）和激光棒（2），激光棒（2）由柔性导体支撑件（10）和支撑体（3）电连接，厚度至少为2mm。 本发明还涉及一种用于制造上述半导体激光器件的方法，其中使用同步焊接工艺来通过硬焊料层（30）将激光棒（2）焊接到散热器（4），并且 通过另外的硬焊料层（31）将散热片（4）连接到支撑体（3）上。
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公开(公告)号：US08585257B2
公开(公告)日：2013-11-19
申请号：US12809694
申请日：2008-11-24
IPC分类号： B60Q1/06
CPC分类号： H04N9/315 , H01S5/005 , H01S5/0071 , H01S5/02208 , H01S5/02248 , H01S5/02415 , H01S5/02438 , H01S5/4093
摘要： A compact housing comprises a one-piece mounting plate made from a metallic material, which is designed to be joined thermally conductively by a main side to an external support not belonging to the compact housing. Furthermore, the compact housing comprises a one-piece housing cover, which is joined permanently to the mounting plate and therewith encloses a volume. In addition, the compact housing contains at least one electrical feedthrough, such that at least one electrically conductive connection may be produced therewith from inside the volume to outside the volume, this connection being insulated electrically from the mounting plate. Within the volume a module is located which is designed to emit electromagnetic radiation. This module is applied directly to the mounting plate, such that the joint face between mounting plate and module is substantially parallel to the main side of the mounting plate joined to the external support.
摘要翻译： 紧凑的壳体包括由金属材料制成的一体式安装板，其被设计成通过主侧导热地连接到不属于紧凑壳体的外部支撑件。 此外，紧凑的壳体包括一体式外壳盖，其永久地连接到安装板并且包围一个体积。 此外，紧凑的壳体包含至少一个电馈通，使得至少一个导电连接可以从体积内部到外部产生，该连接与安装板电绝缘。 在该体积内，设计用于发射电磁辐射的模块。 该模块直接应用于安装板，使得安装板和模块之间的接合面基本上平行于连接到外部支撑件的安装板的主侧。
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5.发明授权Vertically emitting, optically pumped semiconductor comprising an external resonator and frequency doubling on a separate substrate 有权包括外部谐振器的垂直发射的光泵浦半导体和在单独的衬底上倍频公开(公告)号：US08396092B2
公开(公告)日：2013-03-12
申请号：US12087331
申请日：2006-12-29
IPC分类号： H01S3/091
CPC分类号： H01S5/0612 , H01L2224/48465 , H01L2224/49175 , H01S3/0815 , H01S3/109 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/02272 , H01S5/024 , H01S5/02407 , H01S5/041 , H01S5/14 , H01S5/183 , H01S5/4056 , H01L2924/00
摘要： An optically pumped semiconductor apparatus having a surface-emitting semiconductor body (1) which has a radiation passage area (1a) which faces away from a mounting plane of the semiconductor body (1), and an optical element (7) which is suitable for directing pump radiation (17) onto the radiation passage area (1a) of the semiconductor body (1).
摘要翻译： 一种具有表面发射半导体本体（1）的光学泵浦半导体装置，其具有背离半导体本体（1）的安装面的辐射通路面积（1a），以及适于 将泵辐射（17）引导到半导体本体（1）的辐射通道区域（1a）上。
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公开(公告)号：US07729046B2
公开(公告)日：2010-06-01
申请号：US12170238
申请日：2008-07-09
IPC分类号： H01S5/00
CPC分类号： H01S3/16 , H01S3/005 , H01S3/025 , H01S3/042 , H01S3/0602 , H01S3/0612 , H01S3/0627 , H01S3/09415 , H01S3/109 , H01S3/1611 , H01S3/1643 , H01S3/1673 , H01S3/2383
摘要： In a laser device, a crystal array includes a laser gain crystal and an optically non-linear frequency conversion crystal. A pump source couples at least two mutually spatially separated pump beams into the crystal array. Between two pump beams, a saw kerf of the crystal array extends parallel to the pump beams.
摘要翻译： 在激光装置中，晶体阵列包括激光增益晶体和光学非线性变换晶体。 泵浦源将至少两个相互空间分离的泵浦光束耦合到晶体阵列中。 在两个泵浦梁之间，晶体阵列的锯切平行于泵浦梁延伸。
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7.发明申请Semiconductor laser component , optical device for a semiconductor laser component, and method for producing an optical device 有权半导体激光元件，半导体激光元件用光学元件及光学元件的制造方法公开(公告)号：US20090225797A1
公开(公告)日：2009-09-10
申请号：US11659065
申请日：2005-06-24
CPC分类号： H01S5/14 , H01L2224/48091 , H01S3/0815 , H01S3/109 , H01S5/0222 , H01S5/02248 , H01S5/041 , H01S5/183 , H01L2924/00014
摘要： A semiconductor laser component comprising a semiconductor laser chip (1) provided for generating radiation and an optical device comprising a carrier (7), a radiation deflecting element (8) arranged on the carrier and a mirror arranged on the carrier is proposed, wherein the mirror is formed as an external mirror (9) of an external optical resonator for the semiconductor laser chip (1), the radiation deflecting element is arranged within the resonator, the radiation deflecting element is formed for deflecting at least a portion of a radiation (13, 160) that is generated by the semiconductor laser chip (1) and reflected by the external mirror, the carrier has a lateral main extension direction, and the semiconductor laser chip (1) is disposed downstream of the carrier in a vertical direction with respect to the lateral main extension direction.
摘要翻译： 提供了一种半导体激光器部件，其包括用于产生辐射的半导体激光器芯片（1）和包括载体（7），布置在载体上的辐射偏转元件（8）和布置在载体上的反射镜的光学装置， 反射镜被形成为用于半导体激光器芯片（1）的外部光学谐振器的外部反射镜（9），该辐射偏转元件被布置在谐振器内，该辐射偏转元件形成为用于偏转至少一部分辐射 由所述半导体激光器芯片（1）产生并由所述外部反射镜反射的所述载体具有侧向主延伸方向，并且所述半导体激光器芯片（1）沿垂直方向设置在所述载体的下游， 相对于侧向主延伸方向。
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8.发明授权Semiconductor laser component, optical device for a semiconductor laser component, and method for producing an optical device 有权半导体激光元件，半导体激光元件用光学元件及光学元件的制造方法公开(公告)号：US07860144B2
公开(公告)日：2010-12-28
申请号：US11659065
申请日：2005-06-24
IPC分类号： H01S3/08
CPC分类号： H01S5/14 , H01L2224/48091 , H01S3/0815 , H01S3/109 , H01S5/0222 , H01S5/02248 , H01S5/041 , H01S5/183 , H01L2924/00014
摘要： A semiconductor laser component comprising a semiconductor laser chip (1) provided for generating radiation and an optical device comprising a carrier (7), a radiation deflecting element (8) arranged on the carrier and a mirror arranged on the carrier is proposed, wherein the mirror is formed as an external mirror (9) of an external optical resonator for the semiconductor laser chip (1), the radiation deflecting element is arranged within the resonator, the radiation deflecting element is formed for deflecting at least a portion of a radiation (13, 160) that is generated by the semiconductor laser chip (1) and reflected by the external mirror, the carrier has a lateral main extension direction, and the semiconductor laser chip (1) is disposed downstream of the carrier in a vertical direction with respect to the lateral main extension direction.
摘要翻译： 提供了一种半导体激光器部件，其包括用于产生辐射的半导体激光器芯片（1）和包括载体（7），布置在载体上的辐射偏转元件（8）和布置在载体上的反射镜的光学装置， 反射镜被形成为用于半导体激光器芯片（1）的外部光学谐振器的外部反射镜（9），该辐射偏转元件被布置在谐振器内，该辐射偏转元件形成为用于偏转至少一部分辐射 由所述半导体激光器芯片（1）产生并由所述外部反射镜反射的所述载体具有侧向主延伸方向，并且所述半导体激光器芯片（1）沿垂直方向设置在所述载体的下游， 相对于侧向主延伸方向。
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9.发明授权Optically pumped surface-emitting semiconductor laser and optical projection apparatus having a semiconductor laser such as this 有权光泵浦表面发射半导体激光器和具有这种半导体激光器的光学投影装置公开(公告)号：US07778289B2
公开(公告)日：2010-08-17
申请号：US11529976
申请日：2006-09-28
IPC分类号： H01S3/098
CPC分类号： H01S5/141 , H01S3/0805 , H01S3/109 , H01S5/024 , H01S5/041 , H01S5/18394 , H01S2301/18 , H04N9/3129
摘要： An optically pumped, surface-emitting semiconductor laser having a mode-selective apparatus (7) which is intended for suppression of predeterminable, higher resonator modes of the semiconductor laser. The mode-selective apparatus is arranged in the beam path of a pump beam source (2) of the surface-emitting semiconductor laser.
摘要翻译： 一种具有模式选择装置（7）的光泵浦的表面发射半导体激光器，其旨在用于抑制半导体激光器的可预先确定的较高谐振器模式。 模式选择装置被布置在表面发射半导体激光器的泵浦光源（2）的光束路径中。
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10.发明申请Vertically Emitting, Optically Pumped Semiconductor Comprising an External Resonator and Frequency Doubling on a Separate Substrate 有权垂直发射，包含外部谐振器的光学泵浦半导体和单独基板上的频率倍增公开(公告)号：US20090213881A1
公开(公告)日：2009-08-27
申请号：US12087331
申请日：2006-12-29
CPC分类号： H01S5/0612 , H01L2224/48465 , H01L2224/49175 , H01S3/0815 , H01S3/109 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/02272 , H01S5/024 , H01S5/02407 , H01S5/041 , H01S5/14 , H01S5/183 , H01S5/4056 , H01L2924/00
摘要： An optically pumped semiconductor apparatus having a surface-emitting semiconductor body (1) which has a radiation passage area (1a) which faces away from a mounting plane of the semiconductor body (1), and an optical element (7) which is suitable for directing pump radiation (17) onto the radiation passage area (1a) of the semiconductor body (1).
摘要翻译： 一种具有表面发射半导体本体（1）的光学泵浦半导体装置，其具有背离半导体本体（1）的安装面的辐射通路面积（1a），以及适于 将泵辐射（17）引导到半导体本体（1）的辐射通道区域（1a）上。
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