公开(公告)号：US09011002B2

公开(公告)日：2015-04-21

申请号：US13218322

申请日：2011-08-25

申请人： Franz Dirauf ,  Franz Fadler ,  Gernot Schimetta ,  Stefan Setzer

发明人： Franz Dirauf ,  Franz Fadler ,  Gernot Schimetta ,  Stefan Setzer

IPC分类号： H05G1/02 ,  A61N5/10 ,  A61N5/01

CPC分类号： A61N5/1081 ,  A61N5/01 ,  A61N5/1082

摘要： The present embodiments relate to a radiation generation unit for a therapy system. The radiation generation unit has a radiation source and support components for the radiation source. The radiation generation unit includes a power source and has a mechanical interface, with which the radiation generation unit may be attached to a stand. Degrees of freedom of movement may easily be implemented using a corresponding movement of the radiation generation unit.

摘要翻译： 本实施例涉及用于治疗系统的放射线产生单元。 辐射发生单元具有用于辐射源的辐射源和支撑部件。 辐射发生单元包括电源并且具有机械接口，辐射生成单元可以通过该机械接口附接到支架。 可以使用辐射发生单元的相应运动来容易地实现移动自由度。

公开(公告)号：US20120213334A1

公开(公告)日：2012-08-23

申请号：US13218322

申请日：2011-08-25

申请人： Franz Dirauf ,  Franz Fadler ,  Gernot Schimetta ,  Stefan Setzer

发明人： Franz Dirauf ,  Franz Fadler ,  Gernot Schimetta ,  Stefan Setzer

IPC分类号： A61N5/10

CPC分类号： A61N5/1081 ,  A61N5/01 ,  A61N5/1082

摘要： The present embodiments relate to a radiation generation unit for a therapy system. The radiation generation unit has a radiation source and support components for the radiation source. The radiation generation unit includes a power source and has a mechanical interface, with which the radiation generation unit may be attached to a stand. Degrees of freedom of movement may easily be implemented using a corresponding movement of the radiation generation unit.

摘要翻译： 本实施例涉及用于治疗系统的放射线产生单元。 辐射发生单元具有用于辐射源的辐射源和支撑部件。 辐射发生单元包括电源并且具有机械接口，辐射生成单元可以通过该机械接口附接到支架。 可以使用辐射发生单元的相应运动来容易地实现移动自由度。

公开(公告)号：US06813947B2

公开(公告)日：2004-11-09

申请号：US10780051

申请日：2004-02-17

申请人： Franz Dollinger ,  Gernot Schimetta

发明人： Franz Dollinger ,  Gernot Schimetta

IPC分类号： G01F1506

CPC分类号： H03H9/6406 ,  B60C23/0408 ,  G01D5/48 ,  G01K7/34

摘要： The product comprises a sensor (1) via which a measured quantity that corresponds to reactive resistance can be furnished within a measuring range. The product also comprises a matching network (2) and a surface wave element (3). The sensor (1) is connected to a first reflector (4) of the surface wave element (3) via the matching network (2). The first reflector (4) forms, together with the matching network (2) and the sensor (1), a resonator which, for a value of the measured quantity within the measuring range, has a resonance with regard to a reflection of an acoustic surface wave on the first reflector (4). The invention also relates to a method for determining the measured quantity and to a corresponding system.

摘要翻译： 该产品包括传感器（1），通过该传感器可以在测量范围内提供对应于无功电阻的测量量。 该产品还包括匹配网络（2）和表面波元件（3）。 传感器（1）经由匹配网络（2）连接到表面波元件（3）的第一反射器（4）。 第一反射器（4）与匹配网络（2）和传感器（1）一起形成谐振器，对于测量范围内的测量量的值，相对于声学的反射具有谐振 表面波在第一反射器（4）上。 本发明还涉及一种用于确定测量量的方法和相应的系统。

公开(公告)号：US20090026602A1

公开(公告)日：2009-01-29

申请号：US12224608

申请日：2006-12-21

申请人： Gernot Schimetta ,  Maximilian Tschernitz

发明人： Gernot Schimetta ,  Maximilian Tschernitz

IPC分类号： H01L23/538 ,  H01L21/58

CPC分类号： H01L23/66 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/82

摘要： Reliable electrical contact is made with electronic components and effective electrical isolation is produced between the top and bottom of the electronic components. An electronic component is arranged inside a window in a first layer on a substrate. Next, a second layer is put on such that contact areas on the component and contact points on the first layer are freely accessible. Electrical contacts and electrical connecting lines are produced by electrodeposition. The second layer is used to produce bridges over an interval range between the electronic component and the first layer. The bridges have connecting lines formed on them. The second layer can be removed again. Radio-frequency modules can be produces in compact fashion and can be combined with audio-frequency components.

摘要翻译： 用电子部件进行可靠的电气接触，并在电子部件的顶部和底部之间产生有效的电气隔离。 电子部件布置在基板上的第一层中的窗口内。 接下来，放置第二层，使得组件上的接触区域和第一层上的接触点可自由接近。 电触点和电连接线通过电沉积生产。 第二层用于在电子部件和第一层之间的间隔范围内产生桥梁。 桥梁上形成有连接线。 可以再次删除第二层。 射频模块可以紧凑地生成，并且可以与音频组件组合。

公开(公告)号：US08261439B2

公开(公告)日：2012-09-11

申请号：US12733507

申请日：2008-08-04

申请人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

发明人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

IPC分类号： H01R43/00

CPC分类号： H01L24/33 ,  H01L23/3735 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/18 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/30107 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00014

摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

公开(公告)号：US20100208438A1

公开(公告)日：2010-08-19

申请号：US12733507

申请日：2008-08-04

申请人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

发明人： Axel Kaltenbacher ,  Michael Kaspar ,  Gernot Schimetta ,  Karl Weidner ,  Robert Weinke ,  Jörg Zapf

IPC分类号： H05K7/02 ,  H05K13/00

CPC分类号： H01L24/33 ,  H01L23/3735 ,  H01L23/49562 ,  H01L23/5389 ,  H01L24/18 ,  H01L24/36 ,  H01L24/40 ,  H01L24/73 ,  H01L24/82 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/18 ,  H01L2224/82039 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/30107 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  H01L2924/00 ,  H01L2924/00014

摘要： One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

摘要翻译： 一个未安置的电子部件，例如半导体功率部件，具有设置在顶侧和/或底侧上的用于紧固和/或电接触的至少一个连接表面。 部件的一侧在连接表面的区域中的相对的连接表面处附接到和/或电接触直接铜结合陶瓷基板。 在基板上在连接表面的区域外侧面向组件的一侧上形成电绝缘载体膜，并延伸超过底侧。 导电导体部分附接到和/或电接触顶侧上的连接表面。 形成延伸超过顶侧区域的预先形成的三维结构，从而在载体膜和导体部分的三维结构之间形成电绝缘物质。

公开(公告)号：US08642465B2

公开(公告)日：2014-02-04

申请号：US12224608

申请日：2006-12-21

申请人： Gernot Schimetta ,  Maximilian Tschemitz

发明人： Gernot Schimetta ,  Maximilian Tschemitz

IPC分类号： H01L21/4763

CPC分类号： H01L23/66 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2224/82

摘要： Reliable electrical contact is made with electronic components and effective electrical isolation is produced between the top and bottom of the electronic components. An electronic component is arranged inside a window in a first layer on a substrate. Next, a second layer is put on such that contact areas on the component and contact points on the first layer are freely accessible. Electrical contacts and electrical connecting lines are produced by electrodeposition. The second layer is used to produce bridges over an interval range between the electronic component and the first layer. The bridges have connecting lines formed on them. The second layer can be removed again. Radio-frequency modules can be produced in compact fashion and can be combined with audio-frequency components.

摘要翻译： 用电子部件进行可靠的电气接触，并在电子部件的顶部和底部之间产生有效的电气隔离。 电子部件布置在基板上的第一层中的窗口内。 接下来，放置第二层，使得组件上的接触区域和第一层上的接触点可自由接近。 电触点和电连接线通过电沉积生产。 第二层用于在电子部件和第一层之间的间隔范围内产生桥梁。 桥梁上形成有连接线。 可以再次删除第二层。 射频模块可以紧凑地制造，并且可以与音频组件组合。

公开(公告)号：US20060162157A1

公开(公告)日：2006-07-27

申请号：US10527961

申请日：2004-06-29

申请人： Gernot Schimetta ,  Karl Weidner ,  Joerg Zapf

发明人： Gernot Schimetta ,  Karl Weidner ,  Joerg Zapf

IPC分类号： H05K3/10

CPC分类号： H01L23/552 ,  H01L21/50 ,  H01L23/3164 ,  H01L2224/16225 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19106 ,  H01L2924/3025 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00

摘要： A component is connected to a circuit carrier via contacts which place the component at a distance from the circuit carrier. A foil is applied to the component and the circuit carrier so that it lies close to the surface of the circuit carrier on which the component is located and to the sides of the component not facing the circuit carrier. After being applied to the component and the circuit carrier the film is provided with a metal coating.

摘要翻译： 组件通过将组件放置在距离电路载体一定距离的触点连接到电路载体。 箔片被施加到部件和电路载体上，使得其靠近组件所在的电路载体的表面和不面向电路载体的部件的侧面。 在施加到部件和电路载体之后，该膜被提供有金属涂层。