公开(公告)号：US4565767A

公开(公告)日：1986-01-21

申请号：US603451

申请日：1984-04-24

申请人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Issei Takemoto ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitsumasa Kojima

发明人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Issei Takemoto ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitsumasa Kojima

IPC分类号： C08F290/00 ,  C08F299/00 ,  C08G73/00 ,  C08G73/02 ,  C08G73/10 ,  C08L79/08 ,  G03F7/012 ,  G03F7/038 ,  G03F7/26 ,  H01L21/312 ,  H01L21/47 ,  G03C1/71

CPC分类号： C08L79/08 ,  G03F7/0125 ,  Y10S430/12 ,  Y10S430/128

摘要： A light-sensitive polymer composition comprising a poly(amic acid), a special bisazide compound and an amine compound can give a film which has high sensitivity and in which portions exposed to light are not easily released by a developing solution at the time of development.

摘要翻译： 包含聚（酰胺酸），特殊双叠氮化合物和胺化合物的光敏聚合物组合物可以产生具有高灵敏度的膜，并且其中暴露于光的部分在显影时不容易被显影溶液释放 。

公开(公告)号：US4513132A

公开(公告)日：1985-04-23

申请号：US480789

申请日：1983-03-31

申请人： Fusaji Shoji ,  Issei Takemoto ,  Fumio Kataoka ,  Hitoshi Yokono ,  Tokio Isogai

发明人： Fusaji Shoji ,  Issei Takemoto ,  Fumio Kataoka ,  Hitoshi Yokono ,  Tokio Isogai

IPC分类号： C08G77/00 ,  C08G77/42 ,  C08G77/44 ,  C08G77/52 ,  C08G77/06

CPC分类号： C08G77/52 ,  C08G77/44

摘要： Heat-resistant silicone block polymer with a good flexibility obtained by reaction of an organosilsesquioxane with a silicone compound or organosiloxane in the presence of a basic catalyst in an organic solvent.

摘要翻译： 通过有机倍半硅氧烷与有机硅化合物或有机硅氧烷在碱性催化剂存在下在有机溶剂中反应而获得的具有良好柔软性的耐热硅氧烷嵌段聚合物。

公开(公告)号：US4451551A

公开(公告)日：1984-05-29

申请号：US331875

申请日：1981-12-17

申请人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitumasa Kojima

发明人： Fumio Kataoka ,  Fusaji Shoji ,  Isao Obara ,  Hitoshi Yokono ,  Tokio Isogai ,  Mitumasa Kojima

IPC分类号： C08K5/00 ,  C08L79/08 ,  G03F7/008 ,  G03F7/038 ,  G03C1/68

CPC分类号： G03F7/0387 ,  C08K5/0041 ,  C08L79/08 ,  G03F7/008 ,  Y10S430/12 ,  Y10S430/121 ,  Y10S522/904

摘要： A light- or radiation-sensitive polymer composition comprising (a) a poly(amic acid) having as a major component a repeating unit of the formula: ##STR1## (b) one or more light- or radiation-sensitive compounds having an amino group and an aromatic azide group or aromatic sulfonylazide group in one molecule, and if necessary (c) one or more photosensitizers and/or amine compounds having at least one unsaturated bonding, and/or (d) one or more compounds having at least two unsaturated bonding in one molecule, is highly sensitive to light and radiation and can give a precise relief pattern on a substrate. Further, a finally obtained polyimide film is excellent in heat resistance.

摘要翻译： 一种光或辐射敏感性聚合物组合物，其包含（a）作为主要组分的具有下式的重复单元的聚（酰胺酸）：（b）一种或多种具有氨基的光或辐射敏感性化合物 （c）一种或多种具有至少一个不饱和键的光敏剂和/或胺化合物，和/或（d）一种或多种具有至少两个不饱和键的化合物， 在一个分子中的不饱和键，对光和辐射具有高度敏感性，并且可以在基底上给出精确的浮雕图案。 此外，最终得到的聚酰亚胺膜的耐热性优异。

公开(公告)号：US4321319A

公开(公告)日：1982-03-23

申请号：US198952

申请日：1980-05-22

申请人： Fusaji Shoji ,  Issei Takemoto ,  Hitoshi Yokono ,  Tokio Isogai

发明人： Fusaji Shoji ,  Issei Takemoto ,  Hitoshi Yokono ,  Tokio Isogai

IPC分类号： C08G73/10 ,  C08G73/12 ,  C08G73/14 ,  G03F7/038 ,  G03C1/68

CPC分类号： C08G73/121 ,  C08G73/1025 ,  C08G73/1042 ,  C08G73/14 ,  G03F7/0387

摘要： There is described photosensitive polymer composition and a polyimide film-coated material made by applying the composition to a support, irradiating with ultraviolet and thereafter heating. The photosensitive polymer composition is prepared by adding a sensitizer to a photosensitive polyamide acid intermediate solution which is obtained by reacting in an inert solvent a first compound comprising 100 to 5% by weight of a photosensitive group-containing diamine and 0 to 95% by weight of a diamine having no photosensitive group, with a second compound comprising at least one compound selected from a tetracarboxylic acid dianhydride and a tricarboxylic acid anhydride monohalide.

摘要翻译： 描述了感光聚合物组合物和通过将该组合物施加到载体上，用紫外线照射并随后加热而制成的聚酰亚胺膜涂覆材料。 光敏聚合物组合物是通过将感光性聚酰胺酸中间体溶液加入到感光性聚酰胺酸中间体溶液中制备的，该溶液是通过在惰性溶剂中使包含100-5重量％含光敏基团的二胺和0至95重量％ 的具有无光敏基团的二胺，第二化合物包含至少一种选自四羧酸二酐和三羧酸酐一卤化物的化合物。

公开(公告)号：US4273420A

公开(公告)日：1981-06-16

申请号：US56119

申请日：1979-07-09

申请人： Takeshi Watanabe ,  Ryoichi Sudo ,  Fusaji Shoji ,  Issei Takemoto ,  Hitoshi Yokono

发明人： Takeshi Watanabe ,  Ryoichi Sudo ,  Fusaji Shoji ,  Issei Takemoto ,  Hitoshi Yokono

IPC分类号： C09K19/40 ,  G02F1/1337 ,  G02F1/133

CPC分类号： G02F1/133711 ,  C09K19/408 ,  Y10T428/1014 ,  Y10T428/31612 ,  Y10T428/31663

摘要： A liquid crystal display device using an alignment film of ladder-type organosilicone polymer or cross-linking product of cross-linkable ladder-type organosilicone polymer makes a homogeneous liquid crystal orientation, irrespectively of the kind of the liquid crystal used, never lowers its orientation ability even when fusion-sealing or sealing of the liquid crystal device is made with glass or thermosetting resin, and makes a clear display owing to the alignment film being colorless. The alignment film is insoluble in the liquid crystal used.

摘要翻译： 使用梯型有机硅聚合物的取向膜或交联性梯型有机硅聚合物的交联体的液晶显示装置，与所使用的液晶的种类无关，不会降低其取向 即使使用玻璃或热固性树脂进行液晶装置的熔接或密封，由于取向膜是无色的，因此能够进行清晰的显示。 取向膜不溶于所用液晶。

公开(公告)号：US4554237A

公开(公告)日：1985-11-19

申请号：US452198

申请日：1982-12-22

申请人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

发明人： Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono ,  Daisuke Makino ,  Shigeru Koibuchi ,  Asao Isobe

IPC分类号： G03C1/72 ,  G03F7/008 ,  G03C1/52 ,  G03C1/60 ,  G03C5/16

CPC分类号： G03F7/008 ,  Y10S430/128

摘要： Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].

摘要翻译： 公开了用于在半导体器件上形成精细图案的光敏树脂组合物，具有高度敏感性和显影性优异的并且没有问题，例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀，以及方法 用于用所述组合物形成精细图案。 所述光敏树脂组合物包含（a）至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和（b）由通式（1）表示的叠氮化合物：其中 X是-N3或-SO2N3，Y是低级亚烷基，例如-CH2CH2-，-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-，羟基亚烷基或氨基亚烷基，例如

公开(公告)号：US4736012A

公开(公告)日：1988-04-05

申请号：US625968

申请日：1984-06-29

申请人： Fusaji Shoji ,  Akihiro Kenmotsu ,  Isao Obara ,  Hitoshi Yokono ,  Takeshi Komaru

发明人： Fusaji Shoji ,  Akihiro Kenmotsu ,  Isao Obara ,  Hitoshi Yokono ,  Takeshi Komaru

IPC分类号： C08G73/00 ,  C08G73/10 ,  H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L23/556 ,  C08G69/26

CPC分类号： H01L23/3171 ,  H01L23/293 ,  H01L23/556 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/3025

摘要： A semiconductor device containing an .alpha.-rays shielding resin layer on at least active portion of a semiconductor element, said .alpha.-rays shielding resin being a special polyimide resin, is excellent in thermal resistance at the time of sealing the semiconductor element, adhesion of the .alpha.-rays shielding layer to the semiconductor element, and .alpha.-rays shielding ability.

摘要翻译： 一种在半导体元件的至少有效部分上含有α-阵列屏蔽树脂层的半导体器件，所述α-阵列屏蔽树脂是特殊的聚酰亚胺树脂，其密封半导体元件时的耐热性优异， 半导体元件的α-阵列屏蔽层和α射线屏蔽能力。

公开(公告)号：US5388328A

公开(公告)日：1995-02-14

申请号：US187546

申请日：1994-01-28

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.

摘要翻译： 制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口 从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构 井层。 此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构 填充无溶剂形式的清漆，并且清漆被固化。

公开(公告)号：US5300735A

公开(公告)日：1994-04-05

申请号：US37543

申请日：1993-03-22

申请人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

发明人： Hitoshi Yokono ,  Hideo Arima ,  Takashi Inoue ,  Naoya Kitamura ,  Haruhiko Matsuyama ,  Hitoshi Oka ,  Fumio Kataoka ,  Fusaji Shoji ,  Hideyasu Murooka ,  Masayuki Kyooi

IPC分类号： H01L21/48 ,  H01L27/01 ,  H05K3/10 ,  H05K3/24 ,  H05K3/46 ,  H05K1/00

CPC分类号： H01L21/4857 ,  H05K3/4647 ,  H01L2224/1147 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/3025 ,  H05K2203/0733 ,  H05K2203/0769 ,  H05K3/108 ,  H05K3/243 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.

摘要翻译： 这里描述了互连的多层板及其制造工艺。 骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。 然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。 还描述了使用这种互连的多层板的模块和具有这种模块的计算机。

公开(公告)号：US4587197A

公开(公告)日：1986-05-06

申请号：US578058

申请日：1984-02-08

申请人： Mithumasa Kojima ,  Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono

发明人： Mithumasa Kojima ,  Fumio Kataoka ,  Fusaji Shoji ,  Hitoshi Yokono

IPC分类号： C08L79/08 ,  G03F7/004 ,  G03F7/012 ,  G03F7/038 ,  G03C1/71 ,  G03C1/60

CPC分类号： G03F7/0387 ,  C08L79/08 ,  G03F7/0125 ,  Y10S430/12 ,  Y10S430/128

摘要： A photosensitive polymer composition comprising (A) a poly(amic acid), (B) a compound or a mixture of compounds which can form a compound having two or more amino groups in the molecule, and (C) at least one compound having a boiling point of 150.degree. C. or higher at atmospheric pressure and selected from the group consisting of ##STR1## wherein R.sup.a, R.sup.b, R.sup.c, m and n are as defined in the specification, has good properties and does not produce cracks on a pattern at the time of development obtained from said composition.

摘要翻译： 一种光敏聚合物组合物，其包含（A）聚（酰胺酸），（B）可以在分子中形成具有两个或更多个氨基的化合物的化合物或化合物的混合物，和（C）至少一种具有 沸点在大气压下为150℃或更高，并且选自由下列组成的组：其中Ra，Rb，Rc，m和n如说明书中所定义，具有良好的性能并且不会在图案上产生裂纹 在从所述组合物获得的显影时。