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7 条记录 (耗时 0.033 秒)

    Integrated venting EMI shield and heatsink component for electronic equipment enclosures
    1.
    发明授权
    Integrated venting EMI shield and heatsink component for electronic equipment enclosures 失效
    电子设备外壳的集成通风EMI屏蔽和散热器部件

    公开(公告)号：US06401805B1

    公开(公告)日：2002-06-11

    申请号：US09470229

    申请日：1999-12-22

    申请人： Gang Wang ,  P. Keith Muller ,  James Leo Knighten ,  Joseph Ted DiBene, II

    发明人： Gang Wang ,  P. Keith Muller ,  James Leo Knighten ,  Joseph Ted DiBene, II

    IPC分类号： F28F700

    CPC分类号： H05K9/0041 ,  H01L23/427 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

    摘要： An electromagnetic shielding and/or containing heatsink with venting capabilities, comprising a heatsink block, an aperture, and a thermal coupler, is disclosed. The heatsink comprises a thermally conductive material. The aperture is coupled to the heatsink block and allows a thermal carrier to pass from a first side of the heatsink block to a second side of the heatsink block. The aperture is sized to prevent at least a first electromagnetic frequency lower than a cutoff frequency from passing through the aperture. The thermal coupler is coupled to the heatsink block and couples the heatsink block to a heat source.

    摘要翻译： 公开了一种电磁屏蔽和/或具有排气能力的散热器，其包括散热块，孔和热耦合器。 散热器包括导热材料。 孔径耦合到散热块，并允许热载体从散热块的第一侧通过散热块的第二侧。 孔径的大小可以防止至少一个低于截止频率的第一电磁频率通过孔径。 热耦合器耦合到散热块并将散热块耦合到热源。

    Inter-circuit encapsulated packaging for power delivery
    4.
    发明授权
    Inter-circuit encapsulated packaging for power delivery 失效
    用于电力输送的电路间封装封装

    公开(公告)号：US06356448B1

    公开(公告)日：2002-03-12

    申请号：US09432878

    申请日：1999-11-02

    申请人： Joseph Ted DiBene, II ,  David Hartke

    发明人： Joseph Ted DiBene, II ,  David Hartke

    IPC分类号： H05K720

    CPC分类号： G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L2924/15192 ,  H01R4/64 ,  H01R12/52 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/2036

    摘要： An encapsulated circuit assembly and methods for making an encapsulated circuit assembly for power delivery are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a mechanical coupler. The mechanical coupler is coupled between the first printed circuit board and the second printed circuit board and disposed between the first printed circuit board and the second printed circuit board. The mechanical coupler provides substantial electrical continuity between a trace on the first printed circuit board and a trace on the second printed circuit board.

    摘要翻译： 公开了一种封装电路组件和用于制造用于电力输送的封装电路组件的方法。 组件包括第一印刷电路板，第二印刷电路板和机械耦合器。 机械耦合器耦合在第一印刷电路板和第二印刷电路板之间并且设置在第一印刷电路板和第二印刷电路板之间。 机械耦合器在第一印刷电路板上的迹线和第二印刷电路板上的迹线之间提供实质的电连续性。

    Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems
    5.
    发明授权
    Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems 有权
    集成电力输送，具有用于集成电路和系统的高密度电源电路的柔性电路互连

    公开(公告)号：US06741480B2

    公开(公告)日：2004-05-25

    申请号：US10005024

    申请日：2001-12-04

    申请人： David H. Hartke ,  Joseph Ted DiBene, II

    发明人： David H. Hartke ,  Joseph Ted DiBene, II

    IPC分类号： H05K111

    CPC分类号： H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01074 ,  H01L2924/15192 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

    摘要： A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board. A power signal from the power conditioning circuit is provided to the second circuit board at least in part by one of the first set of raised conductive contacts on the flexible circuit and the second set of raised conductive contacts on the second flexible circuit and a ground return is provided to the second circuit board by the other of the first set of raised conductive contacts on the first flexible circuit and the second set of raised conductive contacts on the second flexible circuit.

    摘要翻译： 公开了一种用于将具有功率调节电路的第一电路板和具有沿z（垂直）轴设置在其下方的功率耗散部件的第二电路板电互连的方法和装置。 在说明性实施例中，该装置包括具有第一组凸起的导电触点的第一柔性电路，第一柔性电路设置在第二电路板的第一侧上; 以及第二柔性电路，其具有第二组凸起的导电触头，所述第二柔性电路设置在所述第二电路板的与所述第二电路板的第一侧相对的第二侧上。 来自功率调节电路的功率信号至少部分地由柔性电路上的第一组升高的导电触点之一和第二柔性电路上的第二组升高的导电触点和接地回路提供给第二电路板 通过第一柔性电路上的第一组升高的导电触点中的另一个和第二柔性电路上的第二组升高的导电触点而提供给第二电路板。

    Vortex heatsink for high performance thermal applications
    6.
    发明授权
    Vortex heatsink for high performance thermal applications 有权
    用于高性能热应用的涡流散热器

    公开(公告)号：US06698511B2

    公开(公告)日：2004-03-02

    申请号：US10150730

    申请日：2002-05-17

    申请人： Joseph Ted DiBene, II ,  Farhad Raiszadeh

    发明人： Joseph Ted DiBene, II ,  Farhad Raiszadeh

    IPC分类号： F28F700

    CPC分类号： H01L23/3672 ,  H01L2924/15192

    摘要： A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.

    摘要翻译： 一种用于提高使用涡流散热装置的电子装置的热传递热效率的方法，装置和制品。 该装置包括具有多个翅片并具有可变散热片密度的散热片阵列，所述散热片阵列包括靠近并与散热装置热接触的第一翅片阵列区域; 远离散热装置的第二鳍片阵列区域。 第一散热片区域包括第一散热片密度，第二散热片区域包括小于第一散热片密度的第二散热片密度。