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1.发明申请公开(公告)号：US20100325882A1
公开(公告)日：2010-12-30
申请号：US12827732
申请日：2010-06-30
IPC分类号： H05K3/00
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , G06F1/20 , H01L23/427 , H01L23/433 , H01L2224/16225 , H01L2224/73253 , H01L2924/15192 , H01L2924/15312 , H01L2924/19105 , H01L2924/3011 , H01R12/52 , H01R12/57 , H01R13/24 , H05K1/0206 , H05K1/0262 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K1/182 , H05K3/301 , H05K3/368 , H05K2201/10189 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10689 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , Y10T29/49124
摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.
摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。
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2.发明授权Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management 有权用于向具有集成热和EMI管理的微处理器提供电力的方法和装置公开(公告)号：US06947293B2
公开(公告)日：2005-09-20
申请号：US10147138
申请日：2002-05-16
IPC分类号： G06F1/18 , H01L23/427 , H01L23/433 , H01R4/64 , H01R12/16 , H05K1/02 , H05K1/14 , H05K3/30 , H05K3/36 , H05K7/10 , H05K7/20 , H05K1/11
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L23/433 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2924/00014 , H01L2924/15192 , H01L2924/15311 , H01L2924/16251 , H01L2924/3011 , H01R4/64 , H01R12/52 , H01R12/7082 , H01R12/7088 , H01R12/721 , H05K1/0206 , H05K1/0262 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/1053 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00 , H01L2224/0401
摘要： A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
摘要翻译： 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。
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3.发明授权公开(公告)号：US06847529B2
公开(公告)日：2005-01-25
申请号：US10036957
申请日：2001-12-20
IPC分类号： G06F1/18 , H01L23/427 , H01L23/433 , H01R4/64 , H01R12/16 , H05K1/02 , H05K1/14 , H05K3/30 , H05K3/36 , H05K7/10 , H05K7/20 , H05K1/11
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L23/433 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/15312 , H01L2924/3011 , H01R4/64 , H01R12/52 , H01R12/7088 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036
摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.
摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。
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4.发明授权Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems 有权集成电力输送，具有用于集成电路和系统的高密度电源电路的柔性电路互连公开(公告)号：US06741480B2
公开(公告)日：2004-05-25
申请号：US10005024
申请日：2001-12-04
IPC分类号： H05K111
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L23/433 , H01L2924/0002 , H01L2924/01005 , H01L2924/01019 , H01L2924/01074 , H01L2924/15192 , H01L2924/3011 , H01R4/64 , H01R12/52 , H01R12/7088 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： A method and apparatus for electrically interconnecting a first circuit board having a power conditioning circuit and a second circuit board having a power dissipating component disposed therebelow along a z (vertical) axis is disclosed. In an illustrative embodiment, the apparatus comprises a first flexible circuit having a first set of raised conductive contacts, the first flexible circuit disposed on a first side of the second circuit board; and a second flexible circuit having a second set of raised conductive contacts, the second flexible circuit disposed on a second side of the second circuit board opposing the first side of the second circuit board. A power signal from the power conditioning circuit is provided to the second circuit board at least in part by one of the first set of raised conductive contacts on the flexible circuit and the second set of raised conductive contacts on the second flexible circuit and a ground return is provided to the second circuit board by the other of the first set of raised conductive contacts on the first flexible circuit and the second set of raised conductive contacts on the second flexible circuit.
摘要翻译： 公开了一种用于将具有功率调节电路的第一电路板和具有沿z（垂直）轴设置在其下方的功率耗散部件的第二电路板电互连的方法和装置。 在说明性实施例中，该装置包括具有第一组凸起的导电触点的第一柔性电路，第一柔性电路设置在第二电路板的第一侧上; 以及第二柔性电路，其具有第二组凸起的导电触头，所述第二柔性电路设置在所述第二电路板的与所述第二电路板的第一侧相对的第二侧上。 来自功率调节电路的功率信号至少部分地由柔性电路上的第一组升高的导电触点之一和第二柔性电路上的第二组升高的导电触点和接地回路提供给第二电路板 通过第一柔性电路上的第一组升高的导电触点中的另一个和第二柔性电路上的第二组升高的导电触点而提供给第二电路板。
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公开(公告)号：US06623279B2
公开(公告)日：2003-09-23
申请号：US10132586
申请日：2002-04-25
IPC分类号： H01R1200
CPC分类号： G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L23/433 , H01L2924/0002 , H01L2924/15192 , H01L2924/3011 , H01R4/64 , H01R12/52 , H01R12/7082 , H01R12/7088 , H01R12/721 , H05K1/0206 , H05K1/0262 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K7/1092 , H05K2201/10318 , H05K2201/10325 , H05K2201/1053 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the first conductive member, the second conductive member including a second conductor member first end and a second conductor member second end distal from the second conductor member first end; and one or more first circuit board permanent attachment features for electrical coupling with the first circuit board and second circuit board, and one or more disconnectable conduction features for electrically coupling the connector with the second circuit board.
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6.发明授权公开(公告)号：US07881072B2
公开(公告)日：2011-02-01
申请号：US11502682
申请日：2006-08-11
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , G06F1/20 , H01L23/427 , H01L23/433 , H01L2224/16225 , H01L2224/73253 , H01L2924/15192 , H01L2924/15312 , H01L2924/19105 , H01L2924/3011 , H01R12/52 , H01R12/57 , H01R13/24 , H05K1/0206 , H05K1/0262 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K1/182 , H05K3/301 , H05K3/368 , H05K2201/10189 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10689 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , Y10T29/49124
摘要： A power interconnection system comprising a plurality of z-axis compliant connectors passing power and ground signals between a first circuit board to a second circuit board is disclosed. The interconnection system provides for an extremely low impedance through a broad range of frequencies and allows for large amounts of current to pass from one substrate to the next either statically or dynamically. The interconnection system may be located close to the die or may be further away depending upon the system requirements. The interconnection may also be used to take up mechanical tolerances between the two substrates while providing a low impedance interconnect.
摘要翻译： 公开了一种电源互连系统，其包括在第一电路板到第二电路板之间传递电力和接地信号的多个z轴兼容的连接器。 互连系统通过宽范围的频率提供极低的阻抗，并允许大量的电流从静电或动态从一个衬底传递到下一个衬底。 互连系统可以靠近模具定位，或者可以根据系统要求进一步远离。 互连也可用于占用两个基板之间的机械公差，同时提供低阻抗互连。
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7.发明授权Apparatus for providing power to a microprocessor with integrated thermal and EMI management 失效用于向具有集成热和EMI管理的微处理器提供电力的装置公开(公告)号：US06452113B2
公开(公告)日：2002-09-17
申请号：US09785892
申请日：2001-02-16
IPC分类号： H05K116
CPC分类号： H01L23/433 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/92125 , H01L2924/15192 , H01L2924/15311 , H01L2924/15312 , H01L2924/3011 , H01R4/64 , H01R12/52 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K7/1092 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2924/00
摘要： A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
摘要翻译： 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。
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公开(公告)号：US4947807A
公开(公告)日：1990-08-14
申请号：US188952
申请日：1988-05-02
申请人： John D. Flaig , Gene F. Baltz , Henry C. Billingsley , David H. Hartke , James A. Holcomb , Chester G. DuBois , Dale L. Taipale
发明人： John D. Flaig , Gene F. Baltz , Henry C. Billingsley , David H. Hartke , James A. Holcomb , Chester G. DuBois , Dale L. Taipale
CPC分类号： F02M35/10183 , F02B61/045 , F02M35/10118 , F02M35/1019 , F02M35/10275 , F02M35/116 , F02B2075/025 , F02B2075/1816 , F02B75/22 , F05C2225/08
摘要： An internal combustion engine comprising a crankcase adapted to rotatably support a crankshaft having an axis, the crankcase defining a plurality of crankcase chambers and including a generally flat manifold mounting surface including therein a first series of inlet openings aligned in the direction of the crankshaft axis, and a second series of inlet openings aligned in the direction of the crankshaft axis, the first and second series being laterally offset with respect to the direction of the crankshaft axis, and each of the inlet openings of the first and second series being respectively adapted to feed air to one of the crankcase chambers and having a minor dimension parallel to the crankshaft axis, a major dimension transverse to the crankshaft axis, and a portion overlapping the inlet openings of the other of the first and second series.
摘要翻译： 一种内燃机，其包括适于可旋转地支撑具有轴线的曲轴的曲轴箱，所述曲轴箱限定多个曲轴箱室，并且包括大致平坦的歧管安装表面，其中包括在曲轴轴线方向上对齐的第一系列入口， 以及沿曲轴轴线方向对准的第二系列入口开口，第一和第二系列相对于曲轴轴线的方向横向偏移，并且第一和第二系列的每个入口开口分别适于 将空气馈送到一个曲轴箱室并且具有平行于曲轴轴线的小尺寸，横向于曲轴轴线的主要尺寸，以及与第一和第二系列中另一个的入口开口重叠的部分。
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公开(公告)号：US06845013B2
公开(公告)日：2005-01-18
申请号：US10384057
申请日：2003-03-04
申请人： David H. Hartke , J. Ted DiBene, II
发明人： David H. Hartke , J. Ted DiBene, II
CPC分类号： H05K1/141 , H01R12/7082 , H01R12/721 , H05K1/0262 , H05K7/1092 , H05K2201/1053 , H05K2201/10734
摘要： The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.
摘要翻译： 组件包括具有处理器载体的母板，处理器载体具有附接到其上的处理器。 散热器热耦合到处理器载体并位于载体的顶部。 电压调节模块板电耦合到处理器载体，并且被配置成邻近散热器定位并与母板基本成直角。
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10.发明授权Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate 有权用于与导热板接触的功率调节器模块和微处理器的热和机械管理的方法和装置公开(公告)号：US06452804B1
公开(公告)日：2002-09-17
申请号：US09802329
申请日：2001-03-08
IPC分类号： H05K720
CPC分类号： H05K7/1092 , G06F1/18 , G06F1/182 , G06F1/189 , H01L23/427 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/09701 , H01L2924/15192 , H01L2924/3011 , H01R4/64 , H01R12/52 , H05K1/0206 , H05K1/0263 , H05K1/141 , H05K1/144 , H05K3/301 , H05K3/368 , H05K2201/10318 , H05K2201/10325 , H05K2201/10598 , H05K2201/10704 , H05K2201/10734 , H05K2201/2018 , H05K2201/2036 , H01L2224/0401
摘要： A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
摘要翻译： 公开了一种用于在控制电磁辐射的同时从微处理器供电和去除热量的堆叠组件。 堆叠组件包括具有第一侧和第二侧的VRM电路板或功率调节模块; 诸如具有第一侧和第二侧的蒸气板的导热板，其中所述导热板第一侧热耦合到所述VRM电路板的第二侧; 以及具有第一侧和第二侧的微处理器，所述微处理器第一侧热耦合到所述蒸汽板第二侧。
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