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1.发明申请Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures 失效低K层间电介质材料和低K层间介电层和结构的形成方法公开(公告)号：US20070023870A1
公开(公告)日：2007-02-01
申请号：US11190644
申请日：2005-07-27
申请人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Muthumanickam Sankarapandian , Linda Sundberg , Willi Volksen
发明人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Muthumanickam Sankarapandian , Linda Sundberg , Willi Volksen
IPC分类号： H01L23/58 , H01L21/4763
CPC分类号： C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
摘要： A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
摘要翻译： 使用该组合物制造的物质组成和结构。 所述组合物包含：树脂; 分散在树脂中的聚合物纳米颗粒，每个聚合纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物的悬置聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物 与树脂; 和溶剂，所述溶剂在第一温度下挥发，所述树脂在第二温度下可交联，所述聚合物纳米颗粒在第三温度下可分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度 ，其中在从第二温度到第三温度的层之间加热组合物的层的厚度收缩小于约3.5％。
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公开(公告)号：US20060084282A1
公开(公告)日：2006-04-20
申请号：US11031418
申请日：2005-01-07
申请人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
发明人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
IPC分类号： H01L21/31
CPC分类号： H01L21/7682 , H01L21/02126 , H01L21/02203 , H01L21/02214 , H01L21/02282 , H01L21/02343 , H01L21/31633 , H01L21/31695 , H01L2221/1047
摘要： Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators (porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3-6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims.
摘要翻译： 氧碳硅烷材料制成优良的基质材料，用于形成使用并入的孔隙发生器（致孔剂）的多孔低k材料。 以这种方式制备的多孔样品测量的弹性模量数是使用牺牲致孔剂途径制备的多孔有机硅酸盐的3-6倍。 氧碳硅烷材料用于生产用于电子设备的集成电路。 要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。 提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。
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公开(公告)号：US07229934B2
公开(公告)日：2007-06-12
申请号：US11031418
申请日：2005-01-07
申请人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
发明人： Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Eva Simonyi , Willi Volksen
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/7682 , H01L21/02126 , H01L21/02203 , H01L21/02214 , H01L21/02282 , H01L21/02343 , H01L21/31633 , H01L21/31695 , H01L2221/1047
摘要： Oxycarbosilane materials make excellent matrix materials for the formation of porous low-k materials using incorporated pore generators(porogens). The elastic modulus numbers measured for porous samples prepared in this fashion are 3–6 times higher than porous organosilicates prepared using the sacrificial porogen route. The oxycarbosilane materials are used to produce integrated circuits for use in electronics devices.
摘要翻译： 氧碳硅烷材料制成优良的基质材料，用于形成使用并入的孔隙发生器（致孔剂）的多孔低k材料。 以这种方式制备的多孔样品测量的弹性模量数是使用牺牲致孔剂途径制备的多孔有机硅酸盐的3-6倍。 氧碳硅烷材料用于生产用于电子设备的集成电路。
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公开(公告)号：US20060241194A1
公开(公告)日：2006-10-26
申请号：US11111343
申请日：2005-04-20
申请人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
发明人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
IPC分类号： C08J9/00
摘要： Substantially or roughly spherical micellar structures useful in the formation of nanoporous materials by templating are disclosed. A roughly spherical micellar structure is formed by organization of one or more spatially unsymmetric organic amphiphilic molecules. Each of those molecules comprises a branched moiety and a second moiety. The branched moiety can form part of either the core or the surface of the spherical micellar structure, depending on the polarity of the environment. The roughly spherical micellar structures form in a thermosetting polymer matrix. They are employed in a templating process whereby the amphiphilic molecules are dispersed in the polymer matrix, the matrix is cured, and the porogens are then removed, leaving nanoscale pores.
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公开(公告)号：US20060240240A1
公开(公告)日：2006-10-26
申请号：US11111055
申请日：2005-04-20
申请人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
发明人： Jennifer Cha , Geraud Dubois , James Hedrick , Ho-Cheol Kim , Victor Lee , Teddie Magbitang , Robert Miller , Willi Volksen
IPC分类号： B32B3/26
CPC分类号： H01L21/3121 , G03F7/0002 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/312 , H01L21/31695 , Y10T428/249953 , Y10T428/31663
摘要： A nanoporous material exhibiting a lamellar structure is disclosed. The material comprises three or more substantially parallel sheets of an organosilicate material, separated by highly porous spacer regions. The distance between the centers of the sheets lies between 1 nm and 50 nm. The highly porous spacer regions may be substantially free of condensed material. For the manufacture of such materials, a process is disclosed in which matrix non-amphiphilic polymeric material and templating polymeric material are dispersed in a solvent, where the templating polymeric material includes a polymeric amphiphilic material. The solvent with the polymeric materials is distributed onto a substrate. Organization is induced in the templating polymeric material. The solvent is removed, leaving the polymeric materials in place. The matrix polymeric material is cured, forming a lamellar structure.
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6.发明授权Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures 有权低K层间电介质材料和低K层间介电层和结构的形成方法公开(公告)号：US07931829B2
公开(公告)日：2011-04-26
申请号：US12857633
申请日：2010-08-17
申请人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
发明人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
IPC分类号： H01B1/12
CPC分类号： C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
摘要： A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
摘要翻译： 使用该组合物制造的物质组成和结构。 所述组合物包含：树脂; 分散在树脂中的聚合物纳米颗粒，每个聚合纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物的悬置聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物 与树脂; 和溶剂，所述溶剂在第一温度下挥发，所述树脂在第二温度下可交联，所述聚合物纳米颗粒在第三温度下可分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度 ，其中在从第二温度到第三温度的层之间加热组合物的层的厚度收缩小于约3.5％。
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7.发明申请公开(公告)号：US20100311895A1
公开(公告)日：2010-12-09
申请号：US12857633
申请日：2010-08-17
申请人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
发明人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
CPC分类号： C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
摘要： A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
摘要翻译： 使用该组合物制造的物质组成和结构。 所述组合物包含：树脂; 分散在树脂中的聚合物纳米颗粒，每个聚合纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物的悬置聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物 与树脂; 和溶剂，所述溶剂在第一温度下挥发，所述树脂在第二温度下可交联，所述聚合物纳米颗粒在第三温度下可分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度 ，其中在从第二温度到第三温度的层之间加热组合物的层的厚度收缩小于约3.5％。
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公开(公告)号：US07459183B2
公开(公告)日：2008-12-02
申请号：US11190644
申请日：2005-07-27
申请人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
发明人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
CPC分类号： C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
摘要： A method of forming a structure. The method including: forming a precursor layer on a substarte, the precursor layer including a resin and, polymeric nano-particles dispersed in the resin, and a solvent, each the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the milti-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscuble with the resin; heating the precursor layer to cross-link at least about 90% of the resin thereby converting the pre-baked precursor layer to a dielectric layer; forming trenches in the dielectric layer and filling the trenches with an electrical conductor; heating the dielectric layer to thermally decompose at least acout 99.5% of the polymeric nano-particles into decomposition products and to drive the decomposition products out of the dielectric layer.
摘要翻译： 一种形成结构的方法。 该方法包括：在基体上形成前体层，前体层包括树脂和分散在树脂中的聚合物纳米颗粒和溶剂，每个聚合物纳米颗粒包含多臂核聚合物和附着的悬置聚合物 连接到多臂芯聚合物的多芯聚合物和附着的聚合物，与树脂不混溶的多臂芯聚合物和与该树脂不相容的侧链聚合物; 加热前体层以交联至少约90％的树脂，从而将预烘烤的前体层转化为电介质层; 在电介质层中形成沟槽并用电导体填充沟槽; 加热电介质层以将至少99.5％的聚合物纳米颗粒的热量分解成分解产物并将分解产物驱出电介质层。
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9.发明授权Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures 有权低K层间电介质材料和低K层间介电层和结构的形成方法公开(公告)号：US07820242B2
公开(公告)日：2010-10-26
申请号：US12053721
申请日：2008-03-24
申请人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
发明人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
IPC分类号： B05D3/02
CPC分类号： C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
摘要： A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
摘要翻译： 使用该组合物制造的物质组成和结构。 所述组合物包含：树脂; 分散在树脂中的聚合物纳米颗粒，每个聚合纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物的悬置聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物 与树脂; 和溶剂，所述溶剂在第一温度下挥发，所述树脂在第二温度下可交联，所述聚合物纳米颗粒在第三温度下可分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度 ，其中在从第二温度到第三温度的层之间加热组合物的层的厚度收缩小于约3.5％。
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10.发明申请公开(公告)号：US20080171136A1
公开(公告)日：2008-07-17
申请号：US12053721
申请日：2008-03-24
申请人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
发明人： Geraud Jean-Michel Dubois , James Lupton Hedrick , Ho-Cheol Kim , Victor Yee-Way Lee , Teddie Peregrino Magbitang , Robert Dennis Miller , Muthumanickam Sankarapandian , Linda Karin Sundberg , Willi Volksen
CPC分类号： C08L101/12 , H01L21/02118 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/31695 , H01L21/76807 , H01L21/7682 , H01L2221/1047
摘要： A composition of matter and a structure fabricated using the composition. The composition comprising: a resin; polymeric nano-particles dispersed in the resin, each of the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscible with the resin; and a solvent, the solvent volatile at a first temperature, the resin cross-linkable at a second temperature, the polymeric nano-particle decomposable at a third temperature, the third temperature higher than the second temperature, the second temperature higher than the first temperature, wherein a thickness of a layer of the composition shrinks by less than about 3.5% between heating the layer from the second temperature to the third temperature.
摘要翻译： 使用该组合物制造的物质组成和结构。 所述组合物包含：树脂; 分散在树脂中的聚合物纳米颗粒，每个聚合纳米颗粒包含多臂芯聚合物和连接到多臂芯聚合物的悬置聚合物，与树脂不混溶的多臂芯聚合物和可混溶的侧链聚合物 与树脂; 和溶剂，所述溶剂在第一温度下挥发，所述树脂在第二温度下可交联，所述聚合物纳米颗粒在第三温度下可分解，所述第三温度高于所述第二温度，所述第二温度高于所述第一温度 ，其中在从第二温度到第三温度的层之间加热组合物的层的厚度收缩小于约3.5％。
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