-
公开(公告)号：US20050189635A1
公开(公告)日：2005-09-01
申请号：US11068831
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.
摘要翻译： 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁的至少一个的换能器 能量，并且所述芯片包括在前表面和后表面中的一个处暴露的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向芯片的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于使声能和电磁能中的至少一个沿至少一个方向传递到所述装置和所述装置。
-
公开(公告)号：US20050189622A1
公开(公告)日：2005-09-01
申请号：US11068830
申请日：2005-03-01
申请人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
发明人： Giles Humpston , Philip Osborn , Jesse Thompson , Yoichi Kubota , Chung-Chuan Tseng , Robert Burtzlaff , Belgacem Haba , David Tuckerman , Michael Warner
IPC分类号： B81B7/00 , H01L23/495 , H04R19/00 , H04R19/04
CPC分类号： B81B7/0077 , B81B2201/0257 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05568 , H01L2224/05624 , H01L2224/16 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H01L2924/10155 , H01L2924/10158 , H01L2924/10253 , H01L2924/12041 , H01L2924/19041 , H01L2924/3025 , H04R19/005 , H01L2924/00 , H01L2924/00014
摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.
-
公开(公告)号：US07964947B2
公开(公告)日：2011-06-21
申请号：US11645242
申请日：2006-12-21
申请人： Ilyas Mohammed , Chung-Chuan Tseng
发明人： Ilyas Mohammed , Chung-Chuan Tseng
CPC分类号： H01L25/50 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/0002 , H01L2924/00
摘要： A stacked microelectronic assembly is disclosed, as are different embodiments related to the same. The stacked microelectronic assembly includes a plurality of stackable microelectronic units each having a semiconductor element mounted on a substrate, and also includes alignment elements which align and stack the units one atop another. The aligned assembly may be heated to melt or to reflow the conductive bonding material between the units, thereby electrically coupling and bonding corresponding conductive terminals on each unit.
摘要翻译： 公开了堆叠的微电子组件，以及与其相关的不同实施例。 堆叠的微电子组件包括多个可堆叠微电子单元，每个单元具有安装在基板上的半导体元件，并且还包括对准元件，其将单元对准并堆叠在另一个上。 对准的组件可以被加热以熔化或者回流单元之间的导电接合材料，从而电耦合并结合每个单元上相应的导电端子。
-
公开(公告)号：US20110308773A1
公开(公告)日：2011-12-22
申请号：US12819966
申请日：2010-06-21
CPC分类号： B03C3/743 , B03C2201/04
摘要： An apparatus for cleaning an emitter electrode in electrohydrodynamic fluid accelerator and precipitator devices via movement of a cleaning device including granular abrasives positioned to frictionally engage the emitter electrode. The cleaning device causes the granular abrasives to travel along a longitudinal extent of the emitter electrode to remove detrimental material accumulated on the electrode. The granular abrasives can be retained in housing, on opposed cleaning surfaces, and can be compressed by the housing or an applied force to abrade detrimental material from the electrode surface.
摘要翻译： 一种用于通过包括定位成摩擦地接合发射电极的颗粒磨料的清洁装置的移动来清洁电动液体加速器和除尘装置中的发射极的装置。 清洁装置使得颗粒磨料沿着发射极的纵向延伸，以去除积聚在电极上的有害材料。 颗粒状研磨剂可以保持在壳体中的相对的清洁表面上，并且可以被壳体或施加的力压缩以从电极表面磨蚀有害材料。
-
公开(公告)号：US20080156518A1
公开(公告)日：2008-07-03
申请号：US11649354
申请日：2007-01-03
申请人： Kenneth Allen Honer , Christopher Paul Wade , Seiichi Tobe , Chung-Chuan Tseng , Ellis Chau , Kyong-Mo Bang
发明人： Kenneth Allen Honer , Christopher Paul Wade , Seiichi Tobe , Chung-Chuan Tseng , Ellis Chau , Kyong-Mo Bang
CPC分类号： H05K3/0052 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/97 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/078 , H01L2924/10156 , H01L2924/10158 , H01L2924/19107 , H05K2203/0165 , H05K2203/0228 , H05K2203/167 , Y10T29/49002 , Y10T29/49169 , H01L2224/81 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/0555 , H01L2224/0556
摘要： A substrate including plural microelectronic device carriers has metallic alignment elements. The alignment elements desirably are disposed in a predetermined positional relationship to terminals on the carriers. The alignment elements are engaged with a carrier frame and a cutting device is aligned with the carrier frame. The cutting device cuts the carriers so that borders of the carriers are in a precise relationship with the terminals.
摘要翻译： 包括多个微电子器件载体的衬底具有金属对准元件。 对准元件期望地与载体上的端子以预定的位置关系设置。 对准元件与载体框架接合，并且切割装置与载体框架对准。 切割装置切割载体，使得载体的边界与端子具有精确的关系。
-
公开(公告)号：US20080150114A1
公开(公告)日：2008-06-26
申请号：US11645242
申请日：2006-12-21
申请人： Ilyas Mohammed , Chung-Chuan Tseng
发明人： Ilyas Mohammed , Chung-Chuan Tseng
CPC分类号： H01L25/50 , H01L25/105 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/0002 , H01L2924/00
摘要： A stacked microelectronic assembly is disclosed, as are different embodiments related to the same. The stacked microelectronic assembly includes a plurality of stackable microelectronic units each having a semiconductor element mounted on a substrate, and also includes alignment elements which align and stack the units one atop another. The aligned assembly may be heated to melt or to reflow the conductive bonding material between the units, thereby electrically coupling and bonding corresponding conductive terminals on each unit.
摘要翻译： 公开了堆叠的微电子组件，以及与其相关的不同实施例。 堆叠的微电子组件包括多个可堆叠微电子单元，每个单元具有安装在基板上的半导体元件，并且还包括对准元件，其将单元对准并堆叠在另一个上。 对准的组件可以被加热以熔化或者回流单元之间的导电接合材料，从而电耦合并结合每个单元上相应的导电端子。
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.034 秒)
