公开(公告)号：US20050189622A1

公开(公告)日：2005-09-01

申请号：US11068830

申请日：2005-03-01

申请人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

发明人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

IPC分类号： B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC分类号： B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

公开(公告)号：US20050189635A1

公开(公告)日：2005-09-01

申请号：US11068831

申请日：2005-03-01

申请人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

发明人： Giles Humpston ,  Philip Osborn ,  Jesse Thompson ,  Yoichi Kubota ,  Chung-Chuan Tseng ,  Robert Burtzlaff ,  Belgacem Haba ,  David Tuckerman ,  Michael Warner

IPC分类号： B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC分类号： B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as a transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed at one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chip and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of to said device and from said device.

摘要翻译： 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁的至少一个的换能器 能量，并且所述芯片包括在前表面和后表面中的一个处暴露的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向芯片的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于使声能和电磁能中的至少一个沿至少一个方向传递到所述装置和所述装置。

公开(公告)号：US20070077677A1

公开(公告)日：2007-04-05

申请号：US11607372

申请日：2006-12-01

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  IIyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  IIyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

IPC分类号： H01L21/00

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly includes a microelectronic package having a microelectronic element with faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The package includes a plurality of support elements disposed between the microelectronic element and the substrate and supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements. The assembly includes a circuitized substrate having conductive pads confronting the conductive posts of the microelectronic package, whereby the conductive posts are electrically interconnected with the conductive pads.

摘要翻译： 微电子组件包括具有微电子元件的微电子封装，所述微电子元件具有面和触点，与微电子元件的第一面间隔开并覆盖着微电子元件的第一面的柔性基板，以及多个导电柱，其从柔性基板延伸并远离第一面 微电子元件，至少一些导电柱与微电子元件电互连。 所述封装包括设置在所述微电子元件和所述基板之间的多个支撑元件，并且在所述微电子元件上支撑所述柔性基板。 至少一些导电柱从支撑元件偏移。 组件包括具有面对微电子封装的导电柱的导电焊盘的电路化衬底，由此导电柱与导电焊盘电互连。

公开(公告)号：US20080029879A1

公开(公告)日：2008-02-07

申请号：US11711595

申请日：2007-02-27

申请人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

发明人： David Tuckerman ,  Giles Humpston ,  Michael Nystrom ,  Masud Beroz ,  Jesse Thompson

IPC分类号： H01L23/10 ,  H01L21/58

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118 ,  C04B2237/366 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/11334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： Lidded chip packages are provided in which an optoelectronic device chip has microelectronic circuits exposed at a surface of the chip with a lid mounted to overlie the optoelectronic device and the microelectronic circuits. An opaque film may be attached to the lid to overlie the microelectronic circuits while exposing the optoelectronic device. Lidded chip packages are also provided in which the lid overlies an active or passive device mounted to the chip. Wiring traces may be embedded within an adhesive between the lid and the chip.

摘要翻译： 提供了带芯芯片封装，其中光电子器件芯片具有在芯片的表面处暴露在其上的微电子电路，其上安装有覆盖在光电子器件和微电子电路上的盖。 不透明的膜可以附着到盖子上以覆盖微电子电路，同时暴露光电子器件。 还提供了带盖的芯片封装，其中盖子覆盖安装在芯片上的有源或无源器件。 接线迹线可以嵌入在盖子和芯片之间的粘合剂中。

公开(公告)号：US20050181544A1

公开(公告)日：2005-08-18

申请号：US11014439

申请日：2004-12-16

申请人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

发明人： Belgacem Haba ,  Masud Beroz ,  Ronald Green ,  Ilyas Mohammed ,  Stuart Wilson ,  Wael Zohni ,  Yoichi Kubota ,  Jesse Thompson

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/17 ,  H01L2224/1703 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, wherein at least some of the conductive posts are electrically interconnected with the microelectronic element, and a plurality of support elements supporting the flexible substrate over the microelectronic element. The conductive posts are offset from the support elements to facilitate flexure of the substrate and movement of the posts relative to the microelectronic element.

摘要翻译： 微电子封装包括具有面和触点的微电子元件和与微电子元件的第一面间隔开并且覆盖其上的柔性基板。 该封装还包括从柔性基板延伸并从远离微电子元件的第一面突出的多个导电柱，其中至少一些导电柱与微电子元件电互连，以及多个支撑元件 微电子元件上的柔性衬底。 导电柱从支撑元件偏移以便于基板的挠曲和柱相对于微电子元件的移动。

公开(公告)号：US20070145550A1

公开(公告)日：2007-06-28

申请号：US11318846

申请日：2005-12-27

申请人： Belgacem Haba ,  IIyas Mohammed ,  Craig Mitchell ,  Michael Warner ,  Jesse Thompson

发明人： Belgacem Haba ,  IIyas Mohammed ,  Craig Mitchell ,  Michael Warner ,  Jesse Thompson

IPC分类号： H01L23/02

CPC分类号： H01L21/6835 ,  H01L22/34 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/1601 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05099

摘要： A dielectric structure is formed by a molding process, so that a first surface of a dielectric structure is shaped by contact with the mold. The opposite second surface of the dielectric structure is applied onto the front surface of a wafer element. The dielectric layer may include protruding bumps and terminals may be formed on the bumps. The bumps may be of a precise height. The terminals lie at a precisely controlled height above the front surface of the wafer element. The terminals may include projecting posts which extend above a surrounding solder mask layer to facilitate engagement with a test fixture. The posts are immersed within solder joints when the structure is bonded to a circuit panel.

摘要翻译： 通过模制工艺形成电介质结构，使得电介质结构的第一表面通过与模具接触而成形。 电介质结构的相对的第二表面被施加到晶片元件的前表面上。 电介质层可以包括突出的凸起，并且可以在凸块上形成端子。 凸块可能具有精确的高度。 端子位于晶片元件的前表面上方的精确控制的高度。 端子可以包括在周围的焊接掩模层之上延伸的突出柱，以便于与测试夹具的接合。 当结构结合到电路板上时，将柱浸入焊点中。

公开(公告)号：US20050150813A1

公开(公告)日：2005-07-14

申请号：US10969527

申请日：2004-10-20

申请人： Jesse Thompson ,  Jennifer Alfonso ,  Glenn Urbish ,  Philip Osborn ,  Ellis Chau

发明人： Jesse Thompson ,  Jennifer Alfonso ,  Glenn Urbish ,  Philip Osborn ,  Ellis Chau

IPC分类号： B65D85/30 ,  H01L23/498 ,  H01L25/10

CPC分类号： H01L23/4985 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/00

摘要： A microelectronic fold package is formed from an in-process unit including an internal unit such as a chip and a tape defining a bottom run extending beneath the internal unit, a top run extending above the internal unit and a fold connecting said top and bottom runs. The in-process unit is engaged between a pair of elements having flat surfaces so that these elements form the top and bottom runs to a substantially flat condition at least in regions between the internal unit and the fold and so that the engagement elements form the fold to a height equal to the height of the internal unit.

摘要翻译： 微电子折叠包装由包括诸如芯片的内部单元和限定在内部单元下方延伸的底部行程的带的内部单元形成，在内部单元上方延伸的顶部行程以及连接所述顶部和底部行程的折叠 。 在处理单元被接合在具有平坦表面的一对元件之间，使得这些元件至少在内部单元和折叠之间的区域中形成顶部和底部行程至基本上平坦的状态，并且使得接合元件形成折叠 高度等于内部单元的高度。

公开(公告)号：US20070210125A1

公开(公告)日：2007-09-13

申请号：US11373359

申请日：2006-03-10

申请人： Martin Grabijas ,  Jesse Thompson

发明人： Martin Grabijas ,  Jesse Thompson

IPC分类号： A45F4/02 ,  A45F3/04

CPC分类号： A45F3/04 ,  A45F4/02

摘要： A backpack with a retractable seat is disclosed having a pouch with a sleeve secured thereto. A seat is selectively positionable within the sleeve and has extension straps secured to a lower portion thereof and retraction straps secured to an upper portion thereof. The lower portion of the seat is wider than the upper portion. The seat is deployed by gripping the extension straps and withdrawing the seat. The seat is then bent to conform to the lower back and hips of a user such that the lower portion is directly beneath the user. The seat is retracted by pulling on the retraction straps. In an alternative embodiment, the seat comprises multiple panels folded over one another when retracted into the sleeve.

摘要翻译： 公开了一种具有伸缩座的背包，其具有固定于其上的套筒。 座椅可选择性地定位在套筒内并且具有固定到其下部的延伸带和固定到其上部的收缩带。 座椅的下部比上部宽。 通过抓住延伸带并取出座椅来部署座椅。 然后，座椅被弯曲以符合使用者的下背部和臀部，使得下部直接在使用者的下方。 通过拉动收回带收回座椅。 在替代实施例中，座椅包括当缩回到套筒中时彼此折叠的多个面板。

公开(公告)号：US20120128548A1

公开(公告)日：2012-05-24

申请号：US12673192

申请日：2008-08-08

申请人： Jason A.A. West ,  Jesse Thompson

发明人： Jason A.A. West ,  Jesse Thompson

IPC分类号： G01N30/00 ,  B29C59/02 ,  B29C45/00 ,  B32B37/06 ,  B29C45/03 ,  B29C45/73 ,  B01L3/00 ,  B05D5/00

CPC分类号： B01L3/502707 ,  B01J19/0046 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00608 ,  B01J2219/00722 ,  B01L2200/0636 ,  B01L2200/0647 ,  B01L2200/0668 ,  B01L2200/0689 ,  B01L2300/0636 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2300/12 ,  B29L2031/756 ,  G01N33/54386

摘要： Provided are microfluidic devices and methods for fabricating and bonding such devices. Also provided are kits for analyzing analyte-containing samples and for lysing cells.

摘要翻译： 提供了用于制造和结合这种装置的微流体装置和方法。 还提供了用于分析含分析物的样品和裂解细胞的试剂盒。

公开(公告)号：US20070028339A1

公开(公告)日：2007-02-08

申请号：US11199860

申请日：2005-08-08

申请人： Richard Carlson ,  Jesse Thompson

发明人： Richard Carlson ,  Jesse Thompson

IPC分类号： F41H1/02

CPC分类号： F41H1/02

摘要： A deltoid arm protection system for a ballistic vest including an asymmetrical anatomically shaped deltoid cover having fasteners for attachment to a ballistic vest. The deltoid cover is connected to the vest and prevents any gaps forming between the deltoid cover and the vest during arm movement of the wearer. The deltoid cover includes a weapon gripping pad and attachment loops on an outer surface of the deltoid cover.

摘要翻译： 用于防弹背心的三角臂保护系统，其包括具有用于附接到弹道背心的紧固件的不对称解剖形状的三角肌盖。 三角形盖连接到背心，并防止在佩戴者的手臂运动期间形成三角肌盖和背心之间的任何间隙。 三角形盖包括在三角形盖的外表面上的武器夹持垫和附接环。