公开(公告)号：US20010048575A1

公开(公告)日：2001-12-06

申请号：US09878350

申请日：2001-06-12

申请人： HITACHI, LTD.

发明人： Hidekazu Kohira ,  Hiromitsu Tokisue ,  Masaaki Matsumoto ,  Masayuki Suzuki ,  Yoshinori Takeuchi ,  Toshihiko Shimizu

IPC分类号： G11B005/48

CPC分类号： G11B5/4833

摘要： A magnetic disk unit includes a magnetic disk attached to a spindle so as to be rotatable, a slider having a magnetic head for reading/writing data onto/from the magnetic disk, a suspension for providing the slider with a predetermined load, and an actuator arm for positioning the slider attached to the suspension on the magnetic disk. A first pad including the magnetic head and second pads including no magnetic heads are disposed on an air bearing surface of. the slider. During rotation of said magnetic disk, a part of the first pad keeps in contact with the magnetic disk. A load point of the suspension with respect to the slider is positioned between a leading edge of the slider and a position located at a distance equivalent to substantially 0.42 times a whole length of the slider from the leading edge of the slider.

摘要翻译： 磁盘单元包括：可旋转地安装在主轴上的磁盘，具有磁头的滑块，用于将数据读入/写入磁盘，用于为滑块提供预定负载的悬架，以及致动器 用于将附接到磁盘上的悬架的滑块定位的臂。 包括磁头的第一焊盘和不包括磁头的第二焊盘设置在空气支承表面上。 滑块。 在所述磁盘旋转期间，第一焊盘的一部分与磁盘保持接触。 悬架相对于滑动件的载荷点位于滑动件的前缘之间，并且位于距离滑块的前缘相当于滑块整个长度的大约0.42倍的距离的位置。

公开(公告)号：US20030021059A1

公开(公告)日：2003-01-30

申请号：US10245330

申请日：2002-09-18

申请人： HITACHI, LTD.

发明人： Hidekazu Kohira ,  Hiromitsu Tokisue ,  Masaaki Matsumoto ,  Masayuki Suzuki ,  Yoshinori Takeuchi ,  Toshihiko Shimizu

IPC分类号： G11B017/00

CPC分类号： G11B5/4833

摘要： A magnetic disk unit includes a magnetic disk attached to a spindle so as to be rotatable, a slider having a magnetic head for reading/writing data onto/from the magnetic disk, a suspension for providing the slider with a predetermined load, and an actuator arm for positioning the slider attached to the suspension on the magnetic disk. A first pad including the magnetic head and second pads including no magnetic heads are disposed on an air bearing surface of.the slider. During rotation of said magnetic disk, a part of the first pad keeps in contact with the magnetic disk. A load point of the suspension with respect to the slider is positioned between a leading edge of the slider and a position located at a distance equivalent to substantially 0.42 times a whole length of the slider from the leading edge of the slider.

摘要翻译： 磁盘单元包括：可旋转地安装在主轴上的磁盘，具有磁头的滑块，用于将数据读入/写入磁盘，用于为滑块提供预定负载的悬架，以及致动器 用于将附接到磁盘上的悬架的滑块定位的臂。 包括磁头的第一焊盘和不包括磁头的第二焊盘设置在滑块的空气支承表面上。 在所述磁盘旋转期间，第一焊盘的一部分与磁盘保持接触。 悬架相对于滑动件的载荷点位于滑动件的前缘之间，并且位于距离滑块的前缘相当于滑块整个长度的大约0.42倍的距离的位置。

公开(公告)号：US20020024769A1

公开(公告)日：2002-02-28

申请号：US09964738

申请日：2001-09-28

申请人： HITACHI, LTD.

发明人： Hidekazu Kohira ,  Hiromitsu Tokisue ,  Masaaki Matsumoto ,  Masayuki Suzuki ,  Yoshinori Takeuchi ,  Toshihiko Shimizu

IPC分类号： G11B005/48

CPC分类号： G11B5/4833

摘要： A magnetic disk unit includes a magnetic disk attached to a spindle so as to be rotatable, a slider having a magnetic head for reading/writing data onto/from the magnetic disk, a suspension for providing the slider with a predetermined load, and an actuator arm for positioning the slider attached to the suspension on the magnetic disk. A first pad including the magnetic head and second pads including no magnetic heads are disposed on an air bearing surface of the slider. During rotation of said magnetic disk, a part of the first pad keeps in contact with the magnetic disk. A load point of the suspension with respect to the slider is positioned between a leading edge of the slider and a position located at a distance equivalent to substantially 0.42 times a whole length of the slider from the leading edge of the slider.

摘要翻译： 磁盘单元包括：可旋转地安装在主轴上的磁盘，具有磁头的滑块，用于将数据读入/写入磁盘，用于为滑块提供预定负载的悬架，以及致动器 用于将附接到磁盘上的悬架的滑块定位的臂。 包括磁头的第一焊盘和不包括磁头的第二焊盘设置在滑块的空气轴承表面上。 在所述磁盘旋转期间，第一焊盘的一部分与磁盘保持接触。 悬架相对于滑动件的载荷点位于滑动件的前缘之间，并且位于距离滑块的前缘相当于滑块整个长度的大约0.42倍的距离的位置。

公开(公告)号：US20030205797A1

公开(公告)日：2003-11-06

申请号：US10453606

申请日：2003-06-04

申请人： Hitachi, Ltd. ,  Hitachi ULSI Systems Co., Ltd. ,  Hitachi Yonezawa Electronics Co., Ltd.

发明人： Noriyuki Takahashi ,  Masayuki Suzuki ,  Kouji Tsuchiya ,  Takao Matsuura ,  Takanori Hashizume ,  Masahiro Ichitani ,  Kazunari Suzuki ,  Takafumi Nishita ,  Kenichi Imura ,  Takashi Miwa

IPC分类号： H01L021/44 ,  H01L023/02 ,  H01L023/52

CPC分类号： H01L23/564 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： The back side of a strip substrate with plural semiconductor chips mounted thereon is vacuum-chucked to a lower mold half of a mold, and in this state the plural semiconductor chips are sealed with resin simultaneously to form a seal member. Thereafter, the strip substrate and the seal member are released from the mold and are cut into plural semiconductor devices. The semiconductor devices thus obtained are improved in their mounting reliability.

公开(公告)号：US20020168796A1

公开(公告)日：2002-11-14

申请号：US10091302

申请日：2002-03-06

申请人： Hitachi, Ltd.

发明人： Yoshihiko Shimanuki ,  Masayuki Suzuki

IPC分类号： H01L021/44

CPC分类号： H01L24/32 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48664 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/3512 ,  H01L2924/00

摘要： A non-leaded resin-sealed semiconductor device is manufactured by the steps of providing a conductive flat substrate (metal plate) of copper plate or the like, fixing semiconductor elements respectively to predetermined positions on the principal surface of the substrate by an insulating adhesive, electrically connecting electrodes on the surfaces of the semiconductor elements with predetermined partition parts of the substrate separate from the semiconductor elements by conductive wires, forming an insulating resin layer on the principal surface of the substrate to cover the semiconductor elements and wires, selectively removing the substrate from the rear of said substrate to form electrically independent partition parts whereof at least some are external electrode terminals, and selectively removing said resin layer to fragment the device into regions containing the semiconductor elements and the plural partition parts around the semiconductor elements. Thus, there is provided a compact non-leaded semiconductor device having a large number of electrode terminals.

摘要翻译： 非导电树脂密封半导体器件通过以下步骤制造：提供铜板等的导电平面基板（金属板），通过绝缘粘合剂将半导体元件分别固定在基板的主表面上的预定位置， 将半导体元件的表面上的电极与基板的预定分隔部分用导电线与半导体元件分开，在基板的主表面上形成绝缘树脂层以覆盖半导体元件和导线，选择性地去除基板 从所述基板的后部形成电气独立的分隔部，其中至少一些是外部电极端子，并且选择性地去除所述树脂层以将器件分解成包含半导体元件的区域和围绕半导体元件的多个分隔部分。 因此，提供了具有大量电极端子的紧凑的非铅半导体器件。

公开(公告)号：US20020056916A1

公开(公告)日：2002-05-16

申请号：US09982842

申请日：2001-10-22

申请人： Hitachi, Ltd.

发明人： Teruhisa Ichise ,  Hiroyuki Uchiyama ,  Masayuki Suzuki

IPC分类号： H01L021/8242 ,  H01L021/8234

CPC分类号： H01L27/10885 ,  H01L21/28568 ,  H01L27/10894 ,  H01L28/84 ,  H01L28/90

摘要： The bit lines composed of a conductive film containing the tungsten as a principal component are formed inside the side wall spacers formed on the side walls of the wiring grooves. The TiN film having a higher adhesive strength to the silicon oxide than the tungsten is formed on the boundary faces between the bit lines and the side wall spacers, which functions as an adhesive layer that prevents strippings on the boundary faces between the bit lines and the side wall spacers. Thereby, the invention prevents disconnections, even when the width of the wirings having the tungsten as the principal component is fined to 0.1 nullm or less.

摘要翻译： 在形成在布线槽的侧壁上的侧壁间隔物的内部，形成由含有钨作为主要成分的导电膜构成的位线。 在位线和侧壁间隔物之间​​的边界面上形成具有比钨更高的氧化硅粘合强度的TiN膜，其作为防止位线之间的边界面上的剥离的粘合剂层 侧壁间隔件。 因此，即使以钨为主要成分的配线的宽度为0.1μm以下，本发明也能够防止断开。