公开(公告)号：US10287471B2

公开(公告)日：2019-05-14

申请号：US15531253

申请日：2014-12-05

Applicant: Honeywell International Inc.

Inventor： Liqiang Zhang ,  Ling Shen ,  Hui Wang ,  Ya Qun Liu ,  Wei Jun Wang ,  Hong Min Huang

IPC: H01L23/373 ,  C09K5/06 ,  C09K5/14

Abstract: A thermal interface material includes, in one exemplary embodiment, a polymer, a phase change material, a first thermally conductive filler having a first particle size, and a second thermally conductive filler having a second particle size. The first particle size is larger than the second particle size. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

公开(公告)号：US10068830B2

公开(公告)日：2018-09-04

申请号：US15117862

申请日：2015-02-04

Applicant: HONEYWELL INTERNATIONAL INC. ,  Liang Zeng ,  Ya Qun Liu ,  Jerry Chang ,  Bright Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

Inventor： Liang Zeng ,  Ya Qun Liu ,  Wei Chang ,  Liqiang Zhang ,  Zhe Ding ,  Wei Jun Wang ,  Hong Min Huang

IPC: F28F7/00 ,  H01L23/373 ,  H01L23/42 ,  C09K5/06 ,  H01L23/367

CPC classification number: H01L23/3737 ,  C09K5/063 ,  H01L23/367 ,  H01L23/42 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a compressible thermal interface material including a polymer, a thermally conductive filler, and a phase change material. A formulation for forming a compressible thermal interface material and an electronic component including a compressible thermal interface material are also provided.

公开(公告)号：US20180022642A1

公开(公告)日：2018-01-25

申请号：US15595459

申请日：2017-05-15

Applicant: Honeywell International Inc.

Inventor： Ya Qun Liu ,  Hong Min Huang ,  Helen X. Xu

IPC: C03C17/34 ,  C23C16/50 ,  C23C16/40 ,  B05D1/00 ,  B05D3/02

CPC classification number: C03C17/3417 ,  C03C2217/732 ,  C03C2217/948 ,  C23C28/00 ,  C23C28/021 ,  C23C28/023

Abstract: A layered construct including: a substrate, a transparent electrically conductive layer positioned along an upper surface of the substrate, and an index-matching layer positioned adjacent the transparent electrically conductive layer that reduces the refractive index differential between the transparent electrically conductive layer and the substrate.

公开(公告)号：US20170017017A1

公开(公告)日：2017-01-19

申请号：US15183055

申请日：2016-06-15

Applicant: Honeywell International Inc.

Inventor： Huifeng Duan ,  Yanming Shen ,  Ya Qun Liu ,  Hong Min Huang

IPC: G02B1/113 ,  B05D3/02 ,  G02B1/14 ,  B05D1/00

CPC classification number: B05D3/0272 ,  B05D1/005 ,  C09D183/04 ,  C23C18/122 ,  C23C18/1245 ,  G02B1/111 ,  G02B1/14

Abstract: A coated substrate includes a sapphire substrate and an anti-reflective coating comprising a silicon-based material, wherein the anti-reflective coating has refractive index of 1.23 to 1.45 and a Mohs hardness of at least 4. A method of coating a sapphire substrate with an anti-reflective coating includes applying a liquid formulation to a sapphire substrate to form a coated substrate, and curing the coated substrate at a temperature of at least 500° C. to form an anti-reflective layer on the sapphire substrate.

Abstract translation: 涂覆的基材包括蓝宝石基底和包含硅基材料的抗反射涂层，其中抗反射涂层的折射率为1.23至1.45，莫氏硬度至少为4.一种用蓝宝石基底涂覆蓝宝石基底的方法， 防反射涂层包括将液体制剂施加到蓝宝石衬底以形成涂覆的基底，并且在至少500℃的温度下固化涂覆的基底，以在蓝宝石衬底上形成抗反射层。

公开(公告)号：US11373921B2

公开(公告)日：2022-06-28

申请号：US16844916

申请日：2020-04-09

Applicant: Honeywell International Inc.

Inventor： Kai Zhang ,  Liqiang Zhang ,  Ling Shen ,  Ya Qun Liu

IPC: C08L83/04 ,  H01L23/36 ,  C08G77/20 ,  C08K3/22 ,  C08G77/16

Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material is soft and has elastic properties post-curing along with high thermally conductive filler loading. The thermal interface material includes at least one long chain alkyl silicone oil; at least one long chain, vinyl terminated alkyl silicone oil; at least one long chain, single end hydroxyl terminated silicone oil; at least one thermally conductive filler, at least one coupling agent, at least one catalyst, at least one crosslinker, and at least one addition inhibitor.

公开(公告)号：US20190249007A1

公开(公告)日：2019-08-15

申请号：US16267056

申请日：2019-02-04

Applicant: Honeywell International Inc.

Inventor： Ling Shen ,  Kai Zhang ,  Liqiang Zhang ,  Ya Qun Liu ,  Xin Zhang

IPC: C08L83/04 ,  C09K5/08 ,  H01L23/373 ,  C08K3/22

CPC classification number: C08L83/04 ,  C08K3/22 ,  C08K2201/006 ,  C08L2201/56 ,  C08L2203/20 ,  C09K5/08 ,  H01L23/3737

Abstract: A thermal interface material that is useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material comprises at least one silicone oil, at least one catalyst, at least one thermally conductive filler having a larger surface area, a solvent, at least one inhibitor, and at least one crosslinker. The at least one thermally conductive filler reduces the oil leakage of the TIM, and the solvent increases the flow rate of the TIM without negating the reduction of oil leakage realized by the thermally conductive fillers

公开(公告)号：US20190085225A1

公开(公告)日：2019-03-21

申请号：US16081649

申请日：2016-03-08

Applicant: Bright ZHANG ,  Wei Jun WANG ,  Ya Qun LIU ,  Hong Min HUANG ,  Honeywell International Inc.

Inventor： Bright Zhang ,  Wei Jun Wang ,  Ya Qun Liu ,  Hong Min Huang

IPC: C09K5/06 ,  H01L23/367 ,  H01L23/00 ,  H01L23/373

Abstract: A thermal interface material includes, in one exemplary embodiment, at least one polymer, at least one phase change material, at least one crosslinker, and at least one thermally conductive filler. The at least one thermally conductive includes a first plurality of particles having a particle diameter of about 1 micron or less. The at least one thermally conductive filler comprises at least 80 wt. % of the total weight of the thermal interface material. A formulation for forming a thermal interface material and an electronic component including a thermal interface material are also provided.

公开(公告)号：US20180358283A1

公开(公告)日：2018-12-13

申请号：US15554806

申请日：2016-10-12

Applicant: Liqiang ZHANG ,  Yaqin MAO ,  Huifeng DUAN ,  Haigang KANG ,  Ya Qun LIU ,  Ling SHEN ,  Kai ZHANG ,  Honeywell International Inc.

Inventor： Liqiang Zhang ,  Yaqin Mao ,  Huifeng Duan ,  Haigang Kang ,  Ya Qun Liu ,  Ling Shen ,  Kai Zhang

IPC: H01L23/42 ,  H01L23/373 ,  C09K5/06 ,  C08L23/26

CPC classification number: H01L23/42 ,  C08L23/26 ,  C09K5/06 ,  C09K5/063 ,  H01L23/3737

Abstract: The present disclosure provides thermal interface materials that are useful in transferring heat from heat generating electronic devices, such as computer chips, to heat dissipating structures, such as heat spreaders and heat sinks. The thermal interface material also includes a coloring agent selected from the group consisting of: an iron based inorganic pigment; and an organic pigment.

公开(公告)号：US10597346B2

公开(公告)日：2020-03-24

申请号：US16435877

申请日：2019-06-10

Applicant: Honeywell International Inc.

Inventor： Ya Qun Liu ,  Hong Min Huang ,  Jun Liu ,  Rajiv R. Singh

IPC: C07C41/01 ,  C11D7/50 ,  A62D1/00 ,  C07C41/06 ,  C09K5/04 ,  C09K3/30 ,  C07C41/24 ,  C09K3/00 ,  C09K13/00 ,  C09K21/06 ,  C10M131/10 ,  C11D3/43

Abstract: The production of solvents for applications such as heat transfer, cleaning, and degreasing, for example. In particular, the production of solvents derived from 1-chloro-3,3,3-trifluoro-propene, such as chloro and/or fluoro substituted alkanes and chloro and/or fluoro substituted trifluoropropenyl ethers.

公开(公告)号：US10567084B2

公开(公告)日：2020-02-18

申请号：US16134139

申请日：2018-09-18

Applicant: Honeywell International Inc.

Inventor： Kai Zhang ,  Ling Shen ,  Liqiang Zhang ,  Ya Qun Liu ,  Limei Cui

IPC: H04B1/38 ,  H04B10/40 ,  H05K7/20 ,  G06F1/20 ,  H04B1/036

Abstract: A thermal interface structure for electronic devices, such as telecommunications or data networking hardware, that utilize optical transceiver modules which are inserted within cage receptacles of the electronic devices. In order to provide for efficient heat transfer, the thermal interface structure is disposed between, and in abutment with, the optical transceiver module and a heat sink associated with the cage receptacle. The thermal interface structure includes a thermal interface layer including a phase change material, and a polymer layer connected to the thermal interface layer.